The present invention relates to the field of optical assemblies, and, more particularly, to optical modules that each carry a respective optical device and related methods.
A photonic integrated circuit (PIC) and similar optical devices are optical circuits that integrate photonic functions similar to an electronic integrated circuit. Information signals may be imposed on optical wavelengths in a PIC, usually in the visible spectrum or near infrared 850 nanometers to 1,650 nanometers. A photonic integrated circuit may be fabricated from different materials, including electric-optic crystals such as lithium niobate, silica on silicon, Silicon on insulator, various polymers, and semiconductor materials that are used to make semiconductor lasers such as GaAs and InP lasers.
Photonic integrated circuits may include different optical circuits such as low loss interconnected waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. End-use applications for photonic integrated circuits include fiber-optic communication systems, biomedical applications, and photonic computing. For example, a common application for a photonic integrated circuit is an arrayed waveguide grating used in optical multiplexers and demultiplexers for use with wavelength division multiplexed (WDM), fiber-optic communication systems.
Other applications for photonic integrated circuits include multi-channel transceivers, tunable dispersion compensators, RF photonic processors and phased arrays. Most photonic integrated circuits, however, have fixed functionality and utility, thus limiting their use in other systems. Because most photonic integrated circuits do not have multi-function capabilities, they are limited in configuration to specialized end-use applications. Usually, a photonic integrated circuit is designed for a specific use and cannot be integrated into other circuits, and for that reason, its use is limited to the specific configuration for which it was designed.
In general, an optical assembly may comprise a base having a body defining a base mating feature surface and a plurality of optical modules arranged in side-by-side relation on the base and in optical communication with each other. Each optical module may comprise a housing that is commonly-shaped with other housings. Each housing may have a bottom wall defining a module mating feature surface coupled with a respective area of the base mating feature surface and at least one sidewall with an optical communication opening therein aligned with the at least one optical communication opening of an adjacent housing. A respective optical device may be within each housing.
Each optical module may comprise at least one conductive trace carried by the housing. Each housing may have a top wall defining a top wall mating feature surface compatible with the bottom wall mating feature surface. Each top wall may have at least one optical communication opening therein.
The at least one optical device may comprise an active photonic integrated circuit (PIC). The active PIC may comprise at least one of a source, a filter, a multiplexer, a receiver, a matrix math device, a switch, a demultiplexer, a tunable dispersion compensator, and a channel add/drop device. The at least one optical device may comprise a passive photonic integrated circuit (PIC). The passive PIC may comprise at least one of a waveguide, a splitter, and a combiner. A respective lens may be in each optical communication opening. The housing may comprise a photocured polymer.
Another aspect is directed to a method for making an optical assembly that may comprise mounting a plurality of optical modules arranged in side-by-side relation on a base comprising a body defining a base mating feature surface and in optical communication with each other. Each optical module may comprise a housing being commonly-shaped with other housings, and each housing having a bottom wall defining a module mating feature surface coupled with a respective area of the base mating feature surface and at least one sidewall with an optical communication opening therein aligned with the at least one optical communication opening of an adjacent housing. The method includes mounting a respective optical device within each housing.
Other objects, features and advantages of the present invention will become apparent from the detailed description of the invention which follows, when considered in light of the accompanying drawings in which:
The present description is made with reference to the accompanying drawings, in which exemplary embodiments are shown. However, many different embodiments may be used, and thus, the description should not be construed as limited to the particular embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. Like numbers refer to like elements throughout.
Referring initially to
Each optical module 40 includes a housing 44 that is commonly-shaped with other housings forming each optical module, such as shown by the common shape of each of the three removed optical modules in
In this example, each opening 50 may include conductive traces 52 that may contact conductive traces 36 on a mounting post 32. Each optical module 40 includes at least one side wall 54, which is illustrated as four side walls (
As shown in
Each housing 44 of an optical module 40 has a top wall 74 defining a top wall mating feature surface 78 (
As illustrated, each top wall 74 has at least one optical communication opening 58 therein and illustrated as four optical communication openings that align with respective optical communication openings 58 on the bottom wall 46, such as shown by the optical modules 40 of
Whether optical modules 40 are in side-by-side or stacked relation, one or more optical communication openings 58 for a first optical module 40 align with the respective optical communication openings in a second adjacent or stacked optical module. To ensure that optical signals from one optical communication opening 58 pass to an adjacent opening, each optical communication opening includes a respective lens 84 such as a ball lens positioned therein as best shown in the schematic plan view of first and second optical modules 40a, 40b in
The optical device 62 could be an active or passive photonic integrated circuit. For example, an active photonic integrated circuit as the optical device 62 may be at least one of a source, a filter, a multiplexer, a receiver, a matrix math device, a switch, a demultiplexer, a tunable dispersion compensator, and a channel add/drop device. A passive photonic integrated circuit as the optical device 62 may be at least one of a waveguide, a splitter, and a combiner. Thus, depending on the type of active or passive photonic integrated circuit, one or more optical communication openings 58 located on the bottom wall 46, side wall 54, or top wall 74 of an optical module 40 could be employed for communication by the photonic integrated circuit and communicate with another optical communication opening in a stacked or side-by-side positioned optical module.
An example of how the optical communication openings 58 align is shown in the schematic diagram of
Examples of schematic diagrams of optical modules 40 and a legend indicating the functions for the optical modules imparted by respective different optical devices 62 are shown in
An example of an assembled optical assembly 20 is illustrated in the schematic block diagram of
In an example, the base 24 and optical modules 40, including the housings 44 and the top wall 74 as a lid of each optical module, may be manufactured from photocured polymer such as by additive manufacturing as explained in greater detail below. The flowchart in
An example of an additive manufacturing process allows a one micrometer manufacturing resolution using a 3-D printed high precision package for photonic systems. A common plastic like ABS and polypropylene may be applied to achieve a one-micron resolution with a 50×50×100 mm build volume, which includes micron and sub-micron levels of resolution and surface finish. A digital light processor (DLP) engine may be combined with adaptive optics to ensure a repeatable micron level of resolution.
In the example of the manufactured optical module 40 shown in
The optical assembly 20 may be designed for testing and evaluation purposes or for direct end-use commercial applications. For example, different optical modules 40 may be selected and arranged in both planar and stacked, vertical orientation to form a test circuit or be formed as an end-use commercial product.
Many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is understood that the invention is not to be limited to the specific embodiments disclosed, and that modifications and embodiments are intended to be included within the scope of the appended claims.
Number | Name | Date | Kind |
---|---|---|---|
4894040 | Bach | Jan 1990 | A |
5994774 | Siegel et al. | Nov 1999 | A |
6801254 | Nishio | Oct 2004 | B1 |
6833628 | Brandenburg et al. | Dec 2004 | B2 |
7139448 | Jain et al. | Nov 2006 | B2 |
7596473 | Hansen et al. | Sep 2009 | B2 |
8885355 | Stanley | Nov 2014 | B2 |
10645812 | Maccurdy et al. | May 2020 | B2 |
10748867 | Wicker et al. | Aug 2020 | B2 |
10826499 | Sullam et al. | Nov 2020 | B2 |
20100321880 | Yeo | Dec 2010 | A1 |
20120207426 | Doany et al. | Aug 2012 | A1 |
20130301264 | Van Gompel | Nov 2013 | A1 |
20130308898 | Doerr et al. | Nov 2013 | A1 |
20160361662 | Karunaratne | Dec 2016 | A1 |
20180003912 | Sedor | Jan 2018 | A1 |
20180132056 | Leedy | May 2018 | A1 |
20180217337 | Smith | Aug 2018 | A1 |
20190178473 | Mignot | Jun 2019 | A1 |
20200261818 | Kaersgaard et al. | Aug 2020 | A1 |
20220030449 | Boledovic | Jan 2022 | A1 |
Number | Date | Country |
---|---|---|
101632156 | Jun 2012 | CN |
102176465 | May 2014 | CN |
2003317851 | Nov 2003 | JP |
569053 | Jan 2004 | TW |
200532761 | Oct 2005 | TW |
WO-2016099260 | Jun 2016 | WO |
Entry |
---|
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Number | Date | Country | |
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20230107643 A1 | Apr 2023 | US |