The invention relates to optical communications modules. More particularly, the invention relates to an optical communications module having a crossed-beam optics system that improves space utilization, reduces optical and electrical crosstalk and improves signal integrity.
A variety of optical communications modules exist for transmitting and/or receiving optical data signals over optical waveguides (e.g., optical fibers). Optical communications modules include optical receiver modules, optical transmitter modules and optical transceiver modules. Optical receiver modules have one or more receive channels for receiving one or more optical data signals over one or more respective optical waveguides. Optical transmitter modules have one or more transmit channels for transmitting one or more optical data signals over one or more respective optical waveguides. Optical transceiver modules have one or more transmit channels and one or more receive channels for transmitting and receiving respective optical transmit and receive data signals over respective transmit and receive optical waveguides. For each of these different types of optical communications modules, a variety of designs and configurations exist.
On the receive side of an optical receiver or transceiver module, an optical data signal passing out of the end of an optical fiber is coupled by an optics system onto an optical detector, such as a P-intrinsic-N (PIN) diode or other type of photodiode. The optical detector converts the optical data signal into an electrical data signal, which is then amplified and processed to recover the data. The amplification process is typically performed by a transimpedance amplifier (TIA) and the data recovery process is typically performed by a receiver integrated circuit (IC). On the transmit side of an optical transmitter or transceiver module, a driver IC outputs electrical data signals to an optical source, such as a laser diode or a light emitting diode (LED), to cause the optical source to generate optical data signals. An optics system couples the optical data signals into an end of an optical fiber. The optical source, optical detector, driver IC and receiver IC are typically mounted on and electrically interconnected with a printed circuit board (PCB) of the module.
In order to meet ever-increasing demands for higher information bandwidth, state-of-the-art digital communication switches, servers, and routers often use multiple rows of optical communications modules arranged in very close proximity to one another to increase module density. More recently, bidirectional (BiDi) optical communications modules have been developed to further increase information bandwidth capabilities by both transmitting and receiving optical data signals over each optical channel using multiple wavelengths. In other words, each optical channel is a bidirectional optical channel that uses different wavelengths for the optical signals being transmitted and received over the channel. Optics systems of BiDi optical communications modules include optical elements, such as optical filters, for example, that perform optical wavelength division multiplexing (MUXing) and demultiplexing (DeMUXing) operations to combine and separate optical signals of different wavelengths. The optics systems typically also include various other optical elements that perform reflecting, focusing and collimating operations.
One of the disadvantages of current BiDi optical communications modules is that they typically utilize space in front of each optical port for placement of the optical elements that perform the MUXing and DeMUXing operations on the optical signals being coupled into and out of the port. Because of space limitations in the modules, this use of the space in front of the ports imposes constraints on the placement of other components of the module, such as the laser diode die and the PIN diode die. In particular, the use of the space in front of the ports for MUXing and DeMUXing optical elements typically results in the laser diode die and the PIN diode die being placed very close to one another on the module PCB. This close proximity of the laser diode die and the PIN diode die to one another tends to increase both optical and electrical crosstalk. In addition, the placement constraints also often result in the driver and receiver IC dies being separated from the laser diode die and the PIN diode die, respectively, by significant distances. Consequently, the electrically-conductive traces that interconnect these components are typically relatively long, which can lead to signal integrity problems due to the high inductances of the traces.
Accordingly, a need exists for a BiDi optical communications module that has improved space utilization that reduces or eliminates the occurrence of electrical and optical crosstalk in the module and that improves signal integrity and overall performance of the module.
In accordance with illustrative, or exemplary, embodiments described herein, a BiDi optical communications module is provided that utilizes a crossed-beam optics system configuration that improves space utilization in the module while also reducing the occurrence of electrical and optical crosstalk in the module. The crossed-beam optics system configuration causes the optical pathways associated with each port to cross in an area that is typically an unused, or wasted, area in existing BiDi optical communications modules. By utilizing this typically unused area, the aforementioned constraints on the placement of module components are relaxed, which allows the optical source die and the optical detector die to be positioned far enough apart from one another that electrical and optical crosstalk do not occur, or at least are greatly reduced.
In accordance with an illustrative embodiment, the crossed beams are collimated beams over most of the optical pathways. The collimated shapes of the beams allow smaller optical elements (e.g., lenses) to be used in the optics system compared to if the beams were non-collimated beams (i.e., diverging beams). Also, using collimated beams provides larger tolerance limits for optical alignment. Using smaller lenses allows the IC dies (e.g., receiver and driver IC dies) that communicate with the optical source and optical detector dies to be placed very close to the optical source and detector dies, which allows the electrical traces that electrically connect the IC dies to the optical detector and optical source dies to be kept short. The short trace lengths result in the traces having low inductances, which leads to improvements in signal integrity and overall performance.
In addition, in accordance with an illustrative embodiment, most of the optical pathways are in air rather than some other medium (e.g., plastic or glass), which reduces optical losses and birefringence. Reducing optical losses and birefringence leads to further improvements in coupling efficiency of the light and overall performance.
Illustrative embodiments of the BiDi optical communications module are described herein with reference to the figures, in which like reference numerals represent like elements, features or components. It should be noted that features, elements or components in the figures are not necessarily drawn to scale, emphasis instead being placed on demonstrating principles and concepts of the invention.
The first and second optical ports 2 and 3 have optical elements (not shown) that operate on first and second beams of light of first and second wavelengths, respectively, passing out of the ends of the first and second optical fibers 4 and 5, respectively. The optical ports 2 and 3 are mechanically coupled with ends of the first and second optical fibers 4 and 5, respectively. The optical ports 2 and 3 may be configured to mate directly with ends of the optical fibers 4 and 5 or with optical connectors (not shown) disposed on the ends of the optical fibers 4 and 5. The phrase “mechanically coupled with,” as that phrase is used herein, is intended to denote a direct or indirect mechanical or physical connection.
The optical elements (e.g., one or more total internal reflection (TIR) lenses) of the optical ports 2 and 3 collimate the received light beams into first and second collimated light beams, respectively, and direct the first and second collimated light beams along first and second optical pathways 6 and 7, respectively, toward optical components 9 and 10, which are first and second filter elements. The first and second collimated light beams cross or overlap one another in a central region in between the optical ports 2 and 3. The central region is represented generally by the dashed circle labeled with reference numeral 8 (
The first and second filter elements 9 and 10 are reflective to light of the first and second wavelengths, respectively, and are transmissive to light of the second and first wavelengths, respectively. Optical components 13 and 14 receive the first and second collimated light beams reflected by the first and second filter elements 9 and 10, respectively, and focus and direct the received first and second collimated light beams onto first and second optical detectors 15 and 16, respectively (
Optical components 11 and 12 of the optics system 1 receive respective light beams produced by first and second optical sources 21 and 22 (
As indicated above, in existing BiDi optical communications modules, the optical components that are used for performing the MUXing and DeMUXing operations are typically located in front of their respective optical ports. The central region 8 (
One advantage of using collimated light beams is that it allows small optical elements (e.g., lenses) to be used in performing the collimation, reflection and focusing operations. Using smaller optical elements allows the driver and receiver IC dies (not shown) to be placed in closer proximity to the optical source dies 21, 22 and to the optical detector dies 15, 16, respectively. When larger lenses are used in existing BiDi modules, there is typically insufficient space underneath the lenses to accommodate the height and/or the area of the driver and receiver IC dies due to the lengths of the lenses. For that reason, the driver and receiver IC dies are typically mounted off to the side of the respective optical source or optical detector die, which are typically centered on and mounted beneath the respective lenses. Such mounting arrangements typically require the use of relatively long traces for interconnecting the optical source or optical detector dies with the driver IC die or receiver IC die, which often leads to signal integrity problems.
Using collimated beams on the optical pathways 6 and 7 allows smaller lenses to be used for these purposes due to the narrow diameters of the collimated beams. Another important benefit of using the collimated beams is that larger tolerances are acceptable for optical alignment. As a result, the small lenses could be aligned with the respective optical ports 2 or 3 without having to maintain a high precision alignment between different optical elements. Also, using smaller lenses allows the driver and receiver IC dies to be mounted in very close proximity to the optical source dies 21, 22 and to the optical detector dies 15, 16, respectively, which, in turn, allows shorter trace lengths to be used in the module. Using shorter trace lengths leads to improvements in signal integrity. In addition, because almost the entire lengths of the optical pathways 6 and 7 are in air rather than in some other medium, such as plastic or glass, optical losses and birefringence are reduced, which also improves the optical coupling efficiency of the optical beam.
The filter element 10 may be a single-sided filter element comprising a filter coating applied to side 10a of the filter element 10. Light of the first wavelength produced by optical source die 22 (
For light of the second wavelength received at the optical port 3 from the end of the optical fiber 5, the collimated light beam is reflected off of side 10a of the filter element 10 toward the optical component 14. With reference to
In the crossed-beam optics system 1 described above, the optical elements that perform the MUXing and DeMUXing operations are located in front of the other optical port instead of being in front of the optical port that receives or transmits the light that is MUXed or DeMUXed. For example, optical components 10, 12 and 14 and the optical source 22 and detector 16 (
With reference again to
Like the optics system 1 shown in
As will be understood by those of skill in the art, there are an almost infinite number of ways in which to mount the components shown in
One way to accomplish this is to use a component mounting block (CMB) or a lens frame for holding the optical components 9-14. The CMB or lens frame may be part of a module printed circuit board (PCB) or it may be a separate part that is mounted on the module PCB. In either case, there is a precise relationship between the CMB or lens frame and the dies on the module PCB. The CMB or lens frame is configured to hold the optical components 9-14 at predetermined, precise locations and with predetermined, precise orientations to achieve desired, precise spatial relationships between the optical ports 2 and 3 and the respective optical components 9-14 and between the respective optical components 9-14 and the dies 15, 16, 21 and 22. The dies 15, 16, 21 and 22 are mounted at precise locations on the module PCB such that there is a precise spatial relationship between the CMB or lens frame and the dies. Because the CMB or lens frame is configured to hold the optical components 9-14 at precise locations and with precise orientations, securing the optical components 9-14 to the CMB or lens frame at their predetermined locations with their predetermined orientations results in precise passive alignment of the dies 15, 16, 21 and 22 with the respective optical components 11-14. The CMB or lens frame and the dies 15, 16, 21 and 22 can be aligned with high precision with respect to each other independent of the precision with which the dies 15, 15, 21 and 22 are mounted on the module PCB.
The optical components 9, 11 and 13 in
The filter elements 9, 10 and 51 may be, for example, glass blocks with filter coatings located on one or both sides thereof. Typically, the filter coatings will only be on the sides 9a, 10a and 51a of the blocks, i.e., the sides that face the optical detector dies 15 and 16. Locating the filter coatings only on one side (e.g., side 10a in
As indicated above, the use of collimated light beams over most of the optical pathways 6 and 7 allows relatively small optical elements to be used in the optical components 11-14. An additional advantage of having the ability to use small optical elements is that they are easier to passively align with the respective optical detector and source dies 15, 16, 21 and 22 and with other optical elements in the optical path. For example, if a CMB or lens frame is used for mounting the optical components 11-14 in the module, the optical components 11-14 can be secured to respective shelves of the CMB or lens frame using a curable adhesive material (e.g., an ultraviolet light (UV)-curable epoxy) to hold them in position. If the optical components 11-14 that are used are small in size, which is possible due to the collimated shapes of the beams, [AT1] epoxy will be sufficiently strong to permanently hold them in position.
With reference again to
The IC dies 71 and 72 are positioned in close proximity to the optical source dies 21 and 22 and the optical detector dies 15 and 16 so that the electrical traces (not shown) of the PCB 70 that interconnect the dies 15, 16, 21, 22 with the respective dies 71 and 72 are kept relatively short, which leads to improvements in signal integrity. Although the dies 15, 16, 21, 2271, and 72 are shown as being mounted directly on the upper surface PCB 70, some or all of the dies 15, 16, 21, 22, 71, and 72 could instead be mounted on one or more mounting blocks, such as one or more metal heat sink or heat spreader blocks, which are mounted on the PCB 70. Therefore, although the dies 15, 16, 21, 22, 71, and 72 are shown mounted directly on the PCB 70, they may be mounted indirectly on the PCB 70 by using some one of these other types of mounting structures (not shown).
The manner in which BiDi optical communications modules operate is known in the art. With reference again to
It should be noted, however, that filter elements 9 and 10 could be configured or designed to reflect portions of the light of the second and first wavelengths, respectively, produced by the optical source dies 21 and 22, respectively, onto optional respective monitor photodiodes (not shown). The monitor photodiodes would then be used to monitor the power levels of light being produced by the optical source dies 21 and 22. This could be accomplished by placing filter coatings on the sides of the filter elements 9 and 10 that face the optical components 11 and 12. The filter coatings would be designed to pass portions of the light produced by the respective optical source dies 21 and 22 and to reflect portions of the light onto the monitor photodiodes. In some applications, the Fresnel reflection from those surfaces even without filter coatings is enough to provide the monitoring signal, which allows the filter block to be a single-side coated element.
It should be noted that the invention has been described with respect to illustrative embodiments for the purposes of describing the principles and concepts of the invention. The invention is not limited to these embodiments, as will be understood by persons of skill in the art. For example, while the invention has been described with reference to a particular BiDi optical communications module configuration, the principles and concepts of the invention apply to other optical communications module configurations or other MUX and DeMUX schemes. As will be understood by those skilled in the art in view of the description being provided herein, many modifications may be made to the embodiments described herein while still achieving the goals of the invention, and all such modifications are within the scope of the invention.