The instant invention relates to optical coupling devices, optical communication systems comprising such optical coupling devices, and their method of manufacture.
Most communication systems involve a number of system-cards. Such cards are usually manufactured as so-called printed circuit boards (PCBs). Because of the ever increasing requirements in data rates, due for example to the Internet, the limits of using electrical communications are being reached. It has become difficult to guarantee good signal integrity over the electrical lines.
To respond to this bandwidth demand, high speed systems are now being built with optical layers (optical fibre or planar waveguide) incorporated in replacement of the electrically-conducting metal. Indeed, light does not suffer from the same limitations as electricity.
Optical coupling devices are usually used to interconnect an optical layer of a PCB, or so-called optical circuit board (OCB), with an external optical device. In order to ensure efficient transfer of light through the optical coupling device, a very precise positioning of it along a vertical direction with respect to the circuit board is necessary. Then, a fixation part of the optical coupling device is glued to a fixation surface of the optical circuit board.
It is required to improve the fixation of the optical coupling devices to the optical circuit boards.
It is provided an optical coupling device for an optical communication system. The optical coupling device comprises a first face, which is to face a support of the optical coupling device. This support has a reception face facing upwards and adapted to receive the optical coupling device.
The optical coupling device further comprises a cavity mouthing to the first face, and adapted to receive glue to fix the optical coupling device to the support.
The cavity is surrounded by a wall comprising a second face facing at least partly upwards.
With these features, cured glue will act as an anchor, further contributing to the prevention of the tearing away of the coupling device.
In some embodiments, one might also use one or more of the features defined in the dependant claims.
According to another aspect, it is provided an optical coupling device for an optical communication system. The optical coupling device comprises:
a bottom face adapted to face a support of the optical coupling device, and
a top face opposed to the bottom face.
A through hole extends between said top face and said bottom face. The through hole can receive glue to fix the optical coupling device to the support.
This allows glue to be dispensed from over the optical coupling device rather than from the side thereof, which is much easier to perform, and allows to glue in other places than only the periphery of the optical coupling device.
In some embodiments, one might also use one or more of the features defined in the dependant claims.
Other characteristics and advantages of the invention will readily appear from the following description of four of its embodiments, provided as non-limitative examples, and of the accompanying drawings.
On the drawings:
On the different Figures, the same reference signs designate like or similar elements.
The terms “top”, “bottom”, “up”, “down” or the like are given in reference to the direction Z, normal to the top surface 1a of the PCB, and pointing toward a mating optical device 4 to be optically coupled to the PCB. The top surface of the PCB extends parallel to an X-Y plane, with X and Y being artificially defined. For example, X corresponds to the direction of propagation of light in the layer 107 and Y to the direction transverse thereto.
The optical layer 107 of the layer stack 1 is made of a plurality of tubes 2 integrated or embedded in a body 3 having a lower refractive index than the tubes 2. Thus, the tubes 2 and the body 3 constitute respectively the cores and the cladding of waveguides. Embedded waveguides may be polymer waveguides, glass sheet waveguides or waveguides obtained by embedded fibre technology, or the like.
It will be understood that a part of the PCB is removed from
As can be seen on
The wall where the tubes 2 mouth into the cut-out defines an optical interface of the PCB. Namely, all cores 2 mouth into the cut-out 27 to define the optical interface 9 of the PCB (
Optical signals, transferred to or from a mating optical device 4, such as an optical device or opto-electrical device or an other PCB, are provided over a first optical path 6 to/from the cores 2 of the layer stack 1, which core 2 provides a second optical path 7 for the optical signal parallel to the X-Y plane. In the present example, the optical device 4 can for example comprise a mechanical-transfer ferrule (“MT-ferrule”) comprising a high precision sleeve 21 in which ends of optical fibers 22 extend in precisely defined relative locations. The mating optical device 4 thus has an optical interface 10 defined as the set of optic fibre ends directed toward the PCB. In the present drawing, this interface extends parallel to the X-Y plane.
The optical interface 10 of the mating connector has the same number of transmission regions as the optical interface 9 of the PCB. Each transmission region of the optical interface 10 of the mating optical device corresponds to a respective transmission region of the optical interface 9 of the PCB. This means that transmission regions are associated two by two and that light normally exited through the transmission region of one of the interfaces is to be transmitted to the corresponding transmission region of the other interface.
The printed circuit board 1 further comprises a Z-reference. The Z-reference is a part of the printed circuit board the location of which along the Z direction is precisely known with respect to the optical interface 9. For example, it corresponds to the bottom of the bottom cladding layer (or rather to the coinciding top 23 (see
In order to achieve an optimal optical coupling between the first and second optical paths, that are perpendicular to each other for the optical system here, an optical coupling device 8 is provided for alignment purposes. In the present example, the optical coupling device 8 is provided as a single unitary component, although this is not necessarily always the case. Only the central part of the optical coupling device, which is used for optical coupling, is visible on
The coupling device 8 is, for example, a unitary piece manufactured by moulding a translucent suitable material. The optical coupling device 8 comprises a first face 24 defining a first optical interface 25 which is to be put in optical coupling with the optical interface 9 of the PCB. The first optical interface 25 has transmission regions 13 which are to be placed opposite in free space (sometimes through a translucent coupling medium such as air or a suitable glue) a corresponding transmission region of the interface of the PCB. Hence, the arrangement of the first optical interface 25 directly derives from that 9 of the printed circuit board, and it will not be described in further details here.
The optical coupling device 8 comprises a second face 11b which, in the present case, extends normal to the first face, i.e. extends parallel to the X-Y plane. It defines a second optical interface 26 which is to be put in optical coupling with the optical interface of the mating optical device 4. The second optical interface 26 has transmission regions 13′ which are to be placed opposite (sometimes through a translucent coupling medium such as air or a suitable glue) a corresponding transmission region of the interface of the mating optical device 4. Hence, the arrangement of the second optical interface 26 directly derives from that of the mating optical device 4, and it will not be described in further details here.
An optical path is defined between the first and second interfaces 25, 26 of the coupling device 8. Namely, diverging light entering the coupling device 8 at its first interface 25, coming from the interface of the printed circuit board 1 will be propagated through the coupling device 8 to the second interface 26 as a substantially collimated light beam, and will be focussed into the interface of the mating optical device 4. Light propagates in the opposite direction in a similar way.
In particular, each transmission region of each interface of the coupling device 8 can be provided with a light beam forming structure 15, 15′ such as a lens. The lenses 15 optimise the optical coupling of the optical signals of the cores 2 to/from the coupling device 8. The lenses 15′ optimise the optical coupling of the optical signals of the ferrule 4 to/from the coupling device 8.
Since lenses 15 and 15′ focus the optical signals at the entry of each core 2 and respectively at the entry of each optical fibre 22, the manufacture tolerance of the coupling device 8, the ferrule 4 and the layer stack 1 are increased in comparison with an optical coupling system without lenses.
As shown in the present example, the lenses 15, 15′ may form an integral part of the coupling device 8. They are located at the first and second interfaces. They could be of the Fresnel-type or of the aspheric type, for example. It will be appreciated that, for each interface, all lenses of the interface could be performed identical.
Further, the optical coupling device 8 is provided with Z-reference parts 12. Z-reference parts 12 are parts of the optical coupling device 8, the location of which along the direction Z is precisely known with respect to the first optical interface 25. These parts are for example surfaces extending parallel to the X-Y surface. For example, three such parts can be provided on three feet 14 which project from the face 11a. These feet can be provided unaligned, and of the same length, so that the three Z-reference parts 12 precisely define a plane.
The optical coupling device 8 further comprises fixation parts. These fixation parts are used to fix the optical coupling device 8 to the printed circuit board 1. The fixation parts are for example provided at the periphery of the optical coupling device 8, such as in the present first embodiment. For example, a first fixation part is a peripheral ridge 17 which extends continuously around the whole periphery of the device. Further, a second fixation part is provided as a second peripheral ridge 19, which extends continuously around the whole periphery of the device. The second peripheral ridge also surrounds the first peripheral ridge 17. Thus, the second peripheral ridge 19 is an outer fixation part, while the first peripheral ridge 17 is an inner fixation part. Hence, the first peripheral ridge 17 is located between the second peripheral ridge 19 and the body 16.
The fixation parts 17, 19 project from the face 11a of the optical coupling device.
As can be seen in
In theory, in this position, the optical coupling device and the printed circuit board are so positioned with respect to one another along the direction Z, that an efficient optical coupling occurs between the interface 9 (out of the plane of
the interface 9 of the circuit board with the Z-reference 23 by construction of the circuit board,
the Z-reference 23 with the Z-reference part 12 of the optical coupling device 8 by co-operation, and
the Z-reference part 12 with the optical interface 25, by construction of the coupling device.
If necessary, X-Y reference means (not shown) are used to carefully place the coupling device with respect to the circuit board in the X-Y plane.
The Z axis is oriented in a direction out of the main plane of the circuit board, toward the mating optical device 4. This is the direction of light exiting the circuit board.
The fixation surface 20 of the printed circuit board is used to cooperate with the fixation parts 17, 18 of the optical coupling device 8 to fix the optical coupling device 8 to the circuit board 1. For example, the fixation surface 20 corresponds to the accessible top face 1a of the printed circuit board, either being for example the top face of the copper layer 101 or that of the pre-preg layer 102 if the copper layer 101 has been removed in this area.
When the optical coupling device 8 is placed on the printed circuit board, the inner and outer fixation parts 17, 19 are spaced apart from the surface 20, to enable the Z-reference part 12 to lay on the Z-reference 23 of the circuit board.
Further, the heights of these fixation parts differ from one another. In the present embodiment, they may differ by at least 50 micrometers.
In particular, the first (inner) fixation part 17 is closer to the fixation surface 20 than the second (outer) fixation part 19.
Once the optical coupling device is positioned, glue is made to flow from the periphery of the coupling device, for example using a syringe along the arrow 29. Glue 28 will flow between the bottom surface of the first fixation part 17 and the fixation surface 20 of the circuit board, directly opposed thereto. Fixation will occur between these two surfaces.
The coupling device is provided with a recess 30 located between the first and second fixation parts. In the present example where the first and second fixation parts are peripheral ridges running all along the periphery of the coupling device, the recess 30 can be provided as a groove also running all along the periphery of the coupling device (see
As can be seen on
When the glue 28 flows in the recess 30, it will flow in the second portion 32. Once cured, the glue 28 hardens, so that it will mechanically cooperate with the face 33 of the optical coupling device in case removal forces are exerted along the axis Z which would tend to remove the optical coupling device from the circuit board 1. The glue will act as an anchor means to improve the retention of the optical coupling device to the circuit board 1.
It is only in some local areas 34 that the recess 30 is performed as a through hole. In intermediate regions 35, intermediate between two local areas 34, the cross-section of the recess 30 may be as shown on
When the recess 30 is provided as a through hole, such as shown on
As shown on
Number | Date | Country | Kind |
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PCT/IB2010/003163 | Nov 2010 | IB | international |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2011/069447 | 11/4/2011 | WO | 00 | 10/29/2013 |