Claims
- 1. A method for manufacturing an optical device, comprising the steps of:
mounting an optical element on a substrate in which a through hole is formed such that an optical section of the optical element is placed to face the through hole; providing light transmissive under-fill material between the substrate and the optical element; and disposing a light transmissive member at the through hole.
- 2. A method for manufacturing an optical device according to claim 1, further comprising disposing a spacer between the optical element and the light transmissive member.
- 3. A method for manufacturing an optical device according to claim 1, wherein the light transmissive member is disposed at the through hole after the under-fill material is provided.
- 4. A method for manufacturing an optical device according to claim 1, wherein the under-fill material is provided after the light transmissive member is disposed at the through hole.
- 5. A method for manufacturing an optical device according to claim 1, wherein the light transmissive member is disposed at the through hole after the optical element is mounted on the substrate.
- 6. A method for manufacturing an optical device according to claim 1, wherein the optical element is mounted on the substrate after the light transmissive member is disposed at the through hole.
- 7. A method for manufacturing an optical device, comprising the steps of:
mounting an optical element on a substrate in which a through hole is formed such that an optical section of the optical element is placed to face the through hole; providing light transmissive under-fill material between the substrate and the optical element; and disposing a lens on the substrate to cover the through hole.
- 8. A method for manufacturing an optical device according to claim 7, further comprising providing a spacer between the substrate and the lens.
- 9. A method for manufacturing an optical device according to claim 7, wherein the lens is mounted after the under-fill material is provided.
- 10. A method for manufacturing an optical device according to claim 7, wherein the under-fill material is provided after the lens is mounted.
- 11. A method for manufacturing an optical device according to claim 7, wherein the lens is mounted on the substrate after the optical element is mounted on the substrate.
- 12. A method for manufacturing an optical device according to claim 7, wherein the optical element is mounted on the substrate after the lens is mounted on the substrate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-395112 (P) |
Dec 2000 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional patent application of U.S. Ser. No. 10/032,227 filed Dec. 21, 2001, claiming priority to Japanese Patent Application No. 2000-395112(P) filed Dec. 26, 2000, all of which are hereby incorporated by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10032227 |
Dec 2001 |
US |
Child |
10865247 |
Jun 2004 |
US |