Field of the Invention
The invention relates to an optical module of a micro spectrometer with a tapered slit and a slit structure thereof, and more particularly to a tapered slit formed by way of wet etching to serve as an element of an optical module of a micro spectrometer, and a slit structure of the micro spectrometer.
Related Art
A spectrometer is usually utilized to perform the measurement of the photometry of a radiation source, and a slit structure has to be used at a light entrance of the spectrometer to control a quantitative amount of light to enter the spectrometer. A slit with a very smooth and sharp opening has an important effect on the image quality and the resolution at the sensor end. Optically, the edge of this very smooth and sharp opening is referred to as a “knife edge.” However, because the opening of the slit of the conventional spectrometer has to be relatively long to permit the sufficient light input amount, the slit formed by semiconductor manufacturing processes using a substrate made of a silicon material or another semiconductor material appears to be very fragile and inadequate. Thus, the slit structure used in the conventional spectrometer is typically manufactured from a non-semiconductor material by way of electrical discharge machining (EDM).
It is therefore an object of the invention to provide a slit structure, which is suitable for the mass production so that a micro spectrometer equipped with this slit structure or an optical module of the micro spectrometer can have the reduced cost.
Another object of the invention is to provide a slit structure with a smooth slit surface so that the micro spectrometer equipped with this slit structure can have the enhanced efficiency.
The invention achieves the above-identified objects by providing an optical module of a micro spectrometer. The optical module includes an input section and a micro diffraction grating. The input section includes a slit structure, which receives a first optical signal and outputs a second optical signal travelling along a first optical path. The slit structure includes a substrate and a slit, which penetrates through the substrate and has a gradually reduced dimension from a first surface of the substrate to a second surface of the substrate. The micro diffraction grating disposed on the first optical path receives the second optical signal and separates the second optical signal into a plurality of spectrum components travelling along a second optical path.
In addition, the invention also provides a slit structure, which is adapted to an optical module of a micro spectrometer and receives a first optical signal and outputs a second optical signal. The slit structure includes a substrate and a slit. The slit penetrates through the substrate, and has a gradually reduced dimension form a first surface of the substrate to a second surface of the substrate.
The optical module of the micro spectrometer with the tapered slit and slit structure thereof according to the embodiment of the invention can be manufactured in a mass-production manner using the semiconductor manufacturing processes, so that the cost can be decreased, and the slit can have a smooth surface, which avoids the negative effect on the incident light.
In this embodiment, the input section 20 is disposed in the body 10 and includes a slit structure 30, which receives a first optical signal S1 and outputs a second optical signal S2 travelling along a first optical path OP1. In one example, the input section 20 may further include a filter for filtering out the unessential optical signal. In addition, the micro spectrometer of the invention may further include a light emitting device 60 for outputting light passing through a sample 70 to generate the first optical signal S1, wherein the sample is a test strip, for example.
The slit structure 30 includes a substrate 32 and a slit 34, which penetrates through the substrate 32 and has a gradually reduced dimension from a first surface 32A of the substrate 32 to a second surface 32B of the substrate 32. That is, the slit 34 has a substantially tapered structure. The first surface 32A is further from the micro diffraction grating 40 than the second surface 32B. The slit 34 may have a cross-sectional area with a rectangular shape, a circular shape, an elliptic shape or any other geometric shape, which does not intend to restrict the invention.
As shown in
In addition, in order to obtain and process the spectrum components C, the micro spectrometer may further include a photosensor 50, which is disposed on the second optical path OP2 and receives the spectrum components C. It is to be noted that the micro diffraction grating 40 may be an ultra-thin small part, which is manufactured by micro-electro-mechanical-system (MEMS) processes, semiconductor manufacturing processes, lithography electroforming micro molding (as referred to as LIGA) or other manufacturing processes, and is thus referred to as a micro diffraction grating. Thus, the spectrometer of the invention may be referred to as a micro spectrometer. The height of each of diffraction patterns 42 of the micro diffraction grating 40 typically ranges from several tens of microns to several hundreds of microns. The macroscopic profile of the diffraction patterns 42 of the micro diffraction grating 40 contains a curved surface, as shown in
Thus, the photosensor 50 of
Unlike the conventional metal slit structure, the slit structure 30 of the invention is formed by way of wet etching of the semiconductor manufacturing processes.
Therefore, the substrate 32 of the slit structure 30 includes the semiconductor material, such as the silicon material, the III-V compound semiconductor material or any other semiconductor material. It is to be noted that the resist layer 36 may be removed in the subsequent step, and may also be kept to be a portion of the slit structure 30. Alternatively, the resist layer 36 may also be removed so that the final slit structure 30 does not contain the resist layer 36, as shown in
While the present invention has been described by way of examples and in terms of preferred embodiments, it is to be understood that the present invention is not limited thereto. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/CN2010/072336 | 4/29/2010 | WO | 00 | 7/12/2013 |
Publishing Document | Publishing Date | Country | Kind |
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WO2011/134156 | 11/3/2011 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
3680965 | Dilworth | Aug 1972 | A |
3850526 | Corey, III | Nov 1974 | A |
5182609 | Florek et al. | Jan 1993 | A |
5550375 | Peters et al. | Aug 1996 | A |
5902994 | Lisson | May 1999 | A |
5914997 | Van Egeraat | Jun 1999 | A |
6058003 | Hirano et al. | May 2000 | A |
6075609 | Tarkanic et al. | Jun 2000 | A |
7034935 | Kruzelecky | Apr 2006 | B1 |
20020034457 | Reichert et al. | Mar 2002 | A1 |
20040131312 | Ohlander | Jul 2004 | A1 |
20040156590 | Gunn, III | Aug 2004 | A1 |
20050151966 | Packirisamy et al. | Jul 2005 | A1 |
20060055935 | Cheben | Mar 2006 | A1 |
20060262303 | Bonne | Nov 2006 | A1 |
20070291266 | Handa et al. | Dec 2007 | A1 |
20080068748 | Olson et al. | Mar 2008 | A1 |
20080074664 | Ganiere | Mar 2008 | A1 |
20080225392 | Ko | Sep 2008 | A1 |
20090245718 | Li | Oct 2009 | A1 |
20090284741 | Shibayama et al. | Nov 2009 | A1 |
20090290154 | Shibayama et al. | Nov 2009 | A1 |
20100039643 | Park et al. | Feb 2010 | A1 |
20100128263 | Kobayashi | May 2010 | A1 |
20100208259 | Suzuki et al. | Aug 2010 | A1 |
20100225898 | Lenke | Sep 2010 | A1 |
20100315634 | Shibayama | Dec 2010 | A1 |
20110146055 | Shibayama | Jun 2011 | A1 |
20120127467 | Ivanov et al. | May 2012 | A1 |
Number | Date | Country |
---|---|---|
1854696 | Nov 2006 | CN |
1854696 | Nov 2006 | CN |
101021437 | Aug 2007 | CN |
101055323 | Oct 2007 | CN |
63075523 | Apr 1988 | JP |
M370071 | Dec 2009 | TW |
WO 0054030 | Sep 2000 | WO |
WO0054030 | Sep 2000 | WO |
Number | Date | Country | |
---|---|---|---|
20140002820 A1 | Jan 2014 | US |