Claims
- 1. An optical device including an optical module, comprising:
an optical component; a relative reference mount having a registration configured to couple to a reference substrate; a bonding material configured to fix the optical component relative to the registration feature of the relative reference mount; and an electrical connection to the optical component.
- 2. The optical device of claim 1 including an optical component mount configured to fixedly couple to the optical component.
- 3. The optical device of claim 2 wherein the electrical connection extends between a first electrical pad on the optical component mount and a second electrical pad on the reference substrate.
- 4. The optical device of claim 3 wherein the second electrical pad couples to an electronic circuit.
- 5. The optical device of claim 4 wherein the electronic circuit is mounted on the reference substrate.
- 6. The optical device of claim 2 wherein the relative reference mount includes a via and the electrical connection extends therethrough.
- 7. The optical device of claim 6 wherein the second electrical pad couples to an electronic circuit.
- 8. The optical device of claim 2 wherein the bonding material is electrically conductive and provides at least a portion of the electrical connection to the optical component.
- 9. The optical device of claim 2 including an electrical circuit mounted on the optical component mount.
- 10. The optical device of claim 1 wherein the bonding material comprises solder.
- 11. The optical device of claim 2 wherein the optical component mount comprises first and second plates with the optical element secured therebetween.
- 12. The optical device of claim 1 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 13. The optical device of claim 1 wherein the bonding material comprises adhesive.
- 14. The optical device of claim 1 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 15. The optical device of claim 14 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 16. The optical device of claim 15 wherein the bonding material is operably coupled to only one of the optical component and the relative reference mount when in a first state.
- 17. The optical device of claim 16 wherein the bonding material is activated to fill the gap.
- 18. The optical device of claim 1 wherein the relative reference mount is substantially planar.
- 19. The optical device of claim 1 wherein the reference substrate comprises a substantially planar substrate.
- 20. The optical device of claim 1 wherein the bonding material has a first state in which the optical component can move with up to 6 degrees of freedom relative to the relative reference mount.
- 21. The optical device of claim 2 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.
- 22. The optical device of claim 1 wherein the bonding material is heat activated and at least one heater element is thermally coupled to the bonding material.
- 23. The optical device of claim 2 including a heater element carried on at least one of the relative reference mount and the optical component mount.
- 24. The optical device of claim 1 wherein the relative reference mount comprises silicon.
- 25. The optical device of claim 2 wherein the optical component mount comprises silicon.
- 26. The optical device of claim 1 wherein the relative reference mount comprises a semiconductor.
- 27. The optical device of claim 1 wherein the relative reference mount comprises a ceramic.
- 28. The optical device of claim 1 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 29. The optical device of claim 1 wherein the optical component comprises a laser.
- 30. The optical device of claim 1 wherein the optical component comprises an optical sensor.
- 31. An optical device including an optical module, comprising:
an optical component; a substantially planar mount plate coupled to the optical element; a substantially planar relative reference mount configured to couple to a substantially planar fixed reference, the reference mount bonded by a bonding material to the component mount plate; and an electrical connection to the optical component.
- 32. The optical device of claim 31 wherein the bonding material comprises solder.
- 33. The optical device of claim 31 including an optical component mount coupled to the optical component.
- 34. The optical device of claim 32 wherein a electrical connection extends between a first electrical pad on the optical component mount and a second electrical pad on the fixed reference.
- 35. The optical device of claim 34 wherein the second electrical pad couples to an electronic circuit.
- 36. The optical device of claim 35 wherein the electronic circuit is mounted on the fixed reference.
- 37. The optical device of claim 31 wherein the relative reference mount includes a via and the electrical connection extends therethrough.
- 38. The optical device of claim 37 wherein the second electrical pad couples to an electronic circuit.
- 39. The optical device of claim 31 wherein the bonding material is electrically conductive and provides at least a portion of the electrical connection to the optical component.
- 40. The optical device of claim 32 including an electrical circuit mounted on the optical component mount.
- 41. The optical device of claim 31 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 42. The optical device of claim 31 wherein the bonding material comprises adhesive.
- 43. The optical device of claim 31 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 44. The optical device of claim 31 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 45. The optical device of claim 44 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state.
- 46. The optical device of claim 45 wherein application or removal of heat causes a change in state of the bonding material.
- 47. The optical device of claim 31 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.
- 48. The optical device of claim 31 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.
- 49. The optical device of claim 31 wherein the relative reference mount comprises silicon.
- 50. The optical device of claim 41 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 51. The optical device of claim 31 wherein the optical component is an active device and the optical module includes a means for dissipating heat from the active device.
- 52. An optical device including an optical module, comprising:
an optical component; an optical component mount configured to fixedly couple to the optical component; a relative reference mount configured to couple to a reference substrate; a fixed spacial orientation between the optical component mount and the relative reference mount; and an electrical connection configured to extend between the optical component and the reference substrate.
- 53. The optical device of claim 52 wherein the electrical connection extends between a first electrical pad on the optical component mount and a second electrical pad on the reference substrate.
- 54. The optical device of claim 53 wherein the second electrical pad couples to an electronic circuit.
- 55. The optical device of claim 54 wherein the electronic circuit is mounted on the reference substrate.
- 56. The optical device of claim 53 wherein the relative reference mount includes a via and the electrical connection extends therethrough.
- 57. The optical device of claim 56 wherein the second electrical pad couples to an electronic circuit.
- 58. The optical device of claim 52 including bonding material which is electrically conductive and provides at least a portion of the electrical connection to the optical component.
- 59. The optical device of claim 52 including an electrical circuit mounted on the optical component mount.
- 60. The optical device of claim 52 including bonding material to fix the relative spacial location.
- 61. The optical device of claim 60 wherein the bonding material comprises solder.
- 62. The optical device of claim 61 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 63. The optical device of claim 62 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 64. The optical device of claim 60 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 65. The optical device of claim 52 wherein the relative reference mount is substantially planar.
- 66. The optical device of claim 52 wherein the optical component mount comprises silicon.
- 67. The optical device of claim 52 wherein the optical component is an active device and the optical module includes a means for dissipating heat from the active device.
- 68. The optical device of claim 52 wherein the optical component comprises an optical sensor.
- 69. An optical device including an optical module, comprising:
an optical component; a relative reference mount having a registration feature configured to couple to a substrate; bonding material configured to fixedly secure the optical component at a orientation and position relative to the registration feature of the relative reference mount; and an electrical connection to the optical component.
- 70. The optical device of claim 69 wherein the bonding material comprises solder.
- 71. The optical device of claim 69 including an optical component mount configured to couple the optical component to the relative reference mount.
- 72. The optical device of claim 71 wherein the electrical connection extends between a first electrical pad on the optical component mount and a second electrical pad on the substrate.
- 73. The optical device of claim 72 wherein the second electrical pad couples to an electronic circuit.
- 74. The optical device of claim 73 wherein the electronic circuit is mounted on the substrate.
- 75. The optical device of claim 72 wherein the relative reference mount includes a via and the electrical connection extends therethrough.
- 76. The optical device of claim 75 wherein the second electrical pad couples to an electronic circuit.
- 77. The optical device of claim 69 wherein the bonding material is electrically conductive and provides at least a portion of the electrical connection to the optical component.
- 78. The optical device of claim 69 including an electrical circuit mounted on the optical component mount.
Parent Case Info
[0001] The present application is based on and claims the benefit of U.S. provisional patent application Serial No. 60/276,335, filed Mar. 16, 2001, the present application is also a Continuation-In-Part of U.S. patent application Ser. No. 09/789,125, filed Feb. 20, 2001, Ser. No. 09/789,185, filed Feb. 20, 2001, Ser. No. 09/789,124, filed Feb. 20, 2001, and Ser. No. 09/789,317, filed Feb. 20, 2001 and is also a it, Continuation-In-Part of PCT Ser. No. PCT/US02/______ (A48.13-0002), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0003), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0004), filed Feb. 20, 2002, and PCT Ser. No. PCT/US02/______ (A48.13-0005), filed Feb. 20, 2002, the contents of which are hereby incorporated by reference in their entirety
[0002] Cross-reference is made to co-pending applications Ser. No. 09/789,125, filed Feb. 20, 2001, entitled OPTICAL MODULE; Ser. No. 09/789,185, filed Feb. 20, 2001, entitled OPTICAL MODULE WITH SOLDER BOND; Ser. No. 09/789,124, filed Feb. 20, 2001, entitled OPTICAL DEVICE; Ser. No. 09/789,317, filed Feb. 20, 2001, entitled OPTICAL ALIGNMENT SYSTEM; Ser. No. 60/276,323, filed Mar. 16, 2001, entitled OPTICAL CIRCUIT PICK AND PLACE MACHINE; Ser. No. 60/276,335, filed Mar. 16, 2001, entitled OPTICAL CIRCUITS WITH ELECTRICAL SIGNAL ROUTING; Ser. No. 60/276,336, filed Mar. 16, 2001, entitled OPTICAL CIRCUITS WITH THERMAL MANAGEMENT; Ser. No. 09/894,872, filed Jun. 27, 2001, entitled AUTOMATED OPTO-ELECTRONIC ASSEMBLY MACHINE AND METHOD; Ser. No. 09/920,366, filed Aug. 1, 2001, entitled OPTICAL DEVICE; Ser. No. 60/318,399, filed Sep. 10, 2001, entitled OPTICAL CIRCUIT PICK AND PLACE MACHINE; Ser. No. 60/288,169, filed May 2, 2001, entitled OPTICAL CIRCUIT PICK AND PLACE MACHINE, and Ser. No. 60/340,114, filed Dec. 14, 2001, entitled OPTICAL MODULE AND DEVICE, PCT Ser. No. PCT/US02/______ (A48.13-0002), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0003), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0004), filed Feb. 20, 2002, and PCT Ser. No. PCT/US02/______ (A48.13-0005), filed Feb. 20, 2002, which are incorporated by reference herein in their entirety.
Provisional Applications (3)
|
Number |
Date |
Country |
|
60276335 |
Mar 2001 |
US |
|
60288169 |
May 2001 |
US |
|
60340114 |
Dec 2001 |
US |
Continuation in Parts (6)
|
Number |
Date |
Country |
Parent |
09789125 |
Feb 2001 |
US |
Child |
10099920 |
Mar 2002 |
US |
Parent |
09789185 |
Feb 2001 |
US |
Child |
10099920 |
Mar 2002 |
US |
Parent |
09789124 |
Feb 2001 |
US |
Child |
10099920 |
Mar 2002 |
US |
Parent |
09789317 |
Feb 2001 |
US |
Child |
10099920 |
Mar 2002 |
US |
Parent |
PCT/US02/05497 |
Feb 2002 |
US |
Child |
10099920 |
Mar 2002 |
US |
Parent |
PCT/US02/05415 |
Feb 2002 |
US |
Child |
10099920 |
Mar 2002 |
US |