Claims
- 1. An optical device including an optical module, comprising:
an optical component; a relative reference mount having a registration configured to couple to a reference substrate; a bonding material configured to fix,the optical component relative to the registration feature of the relative reference mount; and a thermal conductor thermally coupled to the optical component configured to dissipate heat from the optical component.
- 2. The optical device of claim 1 including an optical component mount configured to fixedly couple to the optical component.
- 3. The optical device of claim 1 wherein the thermal conductor comprises a heat sink coupled to the substrate.
- 4. The optical device of claim 1 wherein the thermal conductor comprises a heat sink coupled to the relative reference mount.
- 5. The optical device of claim 1 wherein the thermal conductor comprises a thermal electric cooler coupled to the substrate.
- 6. The optical device of claim 1 wherein the thermal conductor comprises a thermal electric cooler coupled to the optical component.
- 7. The optical device of claim 1 wherein the thermal conductor comprises a channel configured to carry a liquid coolant adjacent the reference substrate.
- 8. The optical device of claim 1 wherein the thermal conductor comprises an underfill thermally coupling the relative reference mount to the reference substrate.
- 9. The optical device of claim 1 wherein the thermal conductor comprises an underfill thermally coupled to the relative reference mount.
- 10. The optical device of claim 1 wherein the thermal conductor comprises a plurality of solder connections configured to dissipate heat.
- 11. The optical device of claim 1 wherein the bonding material comprises solder.
- 12. The optical device of claim 1 wherein the bonding material is electrical conductive.
- 13. The optical device of claim 2 wherein the optical component mount comprises first and second plates with the optical element secured therebetween.
- 14. The optical device of claim 1 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 15. The optical device of claim 1 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 16. The optical device of claim 15 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 17. The optical device of claim 1 wherein the relative reference mount is substantially planar.
- 18. The optical device of claim 1 wherein the reference substrate comprises a substantially planar substrate.
- 19. The optical device of claim 1 wherein the bonding material has a first state in which the optical component can move with up to 6 degrees of freedom relative to the relative reference mount.
- 20. The optical device of claim 2 wherein the optical component mount includes a registration feature configured to register the optical component.
- 21. The optical device of claim 1 wherein the bonding material is heat activated and at least one heater element is thermally coupled to the bonding material.
- 22. The optical device of claim 1 wherein the relative reference mount comprises silicon.
- 23. The optical device of claim 1 wherein the relative reference mount comprises a semiconductor.
- 24. The optical device of claim 1 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 25. An optical device including an optical module, comprising:
an optical component; a substantially planar mount plate coupled to the optical element; a substantially planar relative reference mount configured to couple to a substantially planar fixed reference, the reference mount bonded by a bonding material to the component mount plate; and a thermal conductor thermally coupled to the optical component and configured to dissipate heat from the optical component.
- 26. The optical device of claim 25 wherein the thermal conductor comprises a heat sink coupled to the mount plate.
- 27. The optical device of claim 25 wherein the thermal conductor comprises a heat sink coupled to the relative reference mount.
- 28. The optical device of claim 25 wherein the thermal conductor comprises a thermal electric cooler coupled to the mount plate.
- 29. The optical device of claim 25 wherein the thermal conductor comprises a thermal electric cooler thermally coupled to the optical component.
- 30. The optical device of claim 25 wherein the thermal conductor comprises a channel configured to carry a liquid coolant.
- 31. The optical device of claim 25 wherein the thermal conductor comprises an underfill thermally coupled to the relative reference mount.
- 32. The optical device of claim 25 wherein the thermal conductor comprises a plurality of solder connections configured to dissipate heat.
- 33. The optical device of claim 25 wherein the thermal conductor comprises an underfill coupled to the planar mount plate.
- 34. The optical device of claim 25 wherein the bonding material comprises solder.
- 35. The optical device of claim 25 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 36. The optical device of claim 25 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 37. The optical device of claim 25 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 38. The optical device of claim 25 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.
- 39. The optical device of claim 25 wherein the relative reference mount comprises silicon.
- 40. An optical device including an optical module, comprising:
an optical component; an optical component mount configured to fixedly couple to the optical component; a relative reference mount configured to couple to a reference substrate; a fixed spacial orientation between the optical component mount and the relative reference mount, and a thermal conductor thermally coupled to the optical component and configured to dissipate heat from the optical component
- 41. The optical device of claim 40 wherein the thermal conductor comprises a heat sink coupled to the substrate.
- 42. The optical device of claim 40 wherein the thermal conductor comprises a heat sink coupled to the relative reference mount.
- 43. The optical device of claim 40 wherein the thermal conductor comprises a thermal electric cooler coupled to the substrate.
- 44. The optical device of claim 40 wherein the thermal conductor comprises a thermal electric cooler coupled to the optical component.
- 45. The optical device of claim 40 wherein the thermal conductor comprises a channel configured to carry a liquid coolant.
- 46. The optical device of claim 40 wherein the thermal conductor comprises an underfill thermally coupled to the relative reference mount.
- 47. The optical device of claim 40 including a plurality of solder connections configured to dissipate heat.
- 48. The optical device of claim 40 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 49. The optical device of claim 48 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 50. An optical device including an optical module, comprising:
an optical component; a relative reference mount having a registration feature configured to couple to a substrate; bonding material configured to fixedly secure the optical component at a orientation and position relative to the registration feature of the relative reference mount; and a thermal conductor thermally coupled to the optical component and configured to dissipate heat from the optical component.
- 51. The optical device of claim 50 wherein the thermal conductor comprises a heat sink.
- 52. The optical device of claim 50 wherein the thermal conductor comprises a thermal electric cooler.
- 53. The optical device of claim 50 wherein the thermal conductor comprises a channel configured to carry a liquid coolant.
- 54. The optical device of claim 50 wherein the thermal conductor comprises an underfill thermally coupling the relative reference mount.
- 55. The optical device of claim 50 including a plurality of solder connections configured to dissipate heat.
- 56. The optical device of claim 50 wherein the optical component has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
Parent Case Info
[0001] The present application is based on and claims the benefit of U.S. provisional patent application Serial No. 60/276,336, filed Mar. 16, 2001, the present application is also a Continuation-In-Part of U.S. patent application Ser. No. 09/789,125, filed Feb. 20, 2001, Ser. No. 09/789,185, filed Feb. 20, 2001, Ser. No. 09/789,124, filed Feb. 20, 2001, and Ser. No. 09/789,317, filed Feb. 20, 2001 and is also a Continuation-In-Part of PCT Ser. No. PCT/US02/______ (A48.13-0002), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0003), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0004), filed Feb. 20, 2002, and PCT Serial No. PCT/US02/______ (A48.13-0005), filed Feb. 20, 2002, the contents of which are hereby incorporated by reference in their entirety.
[0002] Cross-reference is made to co-pending applications Ser. No. 09/789,125, filed Feb. 20, 2001, entitled OPTICAL MODULE; Ser. No. 09/789,185, filed Feb. 20, 2001, entitled OPTICAL MODULE WITH SOLDER BOND; Ser. No. 09/789,124, filed Feb. 20, 2001, entitled OPTICAL DEVICE; Ser. No. 09/789,317, filed Feb. 20, 2001, entitled OPTICAL ALIGNMENT SYSTEM; Ser. No. 60/276,323, filed Mar. 16, 2001, entitled OPTICAL CIRCUIT PICK AND PLACE MACHINE; Ser. No. 60/276,335, filed Mar. 16, 2001, entitled OPTICAL CIRCUITS WITH ELECTRICAL SIGNAL ROUTING; Ser. No. 60/276,336, filed Mar. 16, 2001, entitled OPTICAL CIRCUITS WITH THERMAL MANAGEMENT; Ser. No. 09/894,872, filed Jun. 27, 2001, entitled AUTOMATED OPTO-ELECTRONIC ASSEMBLY MACHINE AND METHOD; Ser. No. 09/920,366, filed Aug. 1, 2001, entitled OPTICAL DEVICE; Ser. No. 60/318,399, filed Sep. 10, 2001, entitled OPTICAL CIRCUIT PICK AND PLACE MACHINE; Ser. No. 60/288,169, filed May 2, 2001, entitled OPTICAL CIRCUIT PICK AND PLACE MACHINE, and Ser. No. 60/340,114, filed Dec. 14, 2001, entitled OPTICAL MODULE AND DEVICE, PCT Ser. No. PCT/US02/______ (A48.13-0002), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0003), filed Feb. 20, 2002, PCT Ser. No. PCT/US02/______ (A48.13-0004), filed Feb. 20, 2002, and PCT Ser. No. PCT/US02/______ (A48.13-0005), filed Feb. 20, 2002, which are incorporated by reference herein in their entirety.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60279336 |
Mar 2001 |
US |
Continuation in Parts (8)
|
Number |
Date |
Country |
Parent |
09789125 |
Feb 2001 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
09789185 |
Feb 2001 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
09789124 |
Feb 2001 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
09789317 |
Feb 2001 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
PCT/US02/05497 |
Feb 2002 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
PCT/US02/05412 |
Feb 2002 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
PCT/US02/05268 |
Feb 2002 |
US |
Child |
10099907 |
Mar 2002 |
US |
Parent |
PCT/US02/05498 |
Feb 2002 |
US |
Child |
10099907 |
Mar 2002 |
US |