N. Basavanhally, "Application of soldering technologies for opto-electronic component assembly," ASME Int. Electronic Packaging Conference, New York: ASME, 1993, pp. 1149-1155. |
Y. C. Lee and N. Basavanhally, "Soldering engineering for optoelectronic packaging," J. Metals, Jun. 1994. |
N. R. Basavanhally, M. F. Brady, and D. Bruce Buchholz, "Optoelectronic Packaging of Two-Dimensional Surface Active Devices," IEEE Transactions on Components, Packaging, and Manufacturing Technology--Part B, vol. 19, No. 1, Feb. 1996, pp. 107-115. |