Number | Name | Date | Kind |
---|---|---|---|
3661142 | Flam | May 1972 | A |
3763647 | Shibanai | Oct 1973 | A |
3877411 | MacDonald | Apr 1975 | A |
3922917 | Ayres | Dec 1975 | A |
3998098 | Chilton | Dec 1976 | A |
4030482 | Navato | Jun 1977 | A |
4064872 | Caplan | Dec 1977 | A |
4101696 | Jennen et al. | Jul 1978 | A |
4137769 | Parker | Feb 1979 | A |
4154107 | Giezen et al. | May 1979 | A |
4232552 | Hof et al. | Nov 1980 | A |
4248089 | Heinmets | Feb 1981 | A |
4279152 | Crossland | Jul 1981 | A |
4296631 | Fergason | Oct 1981 | A |
4459046 | Spirg | Jul 1984 | A |
4469452 | Sharpless et al. | Sep 1984 | A |
4682605 | Hoffman | Jul 1987 | A |
4779995 | Santacaterina et al. | Oct 1988 | A |
4829539 | Angus et al. | May 1989 | A |
4878588 | Ephraim | Nov 1989 | A |
4891250 | Weibe et al. | Jan 1990 | A |
4931420 | Asano et al. | Jun 1990 | A |
4933525 | Phillips | Jun 1990 | A |
5131755 | Chadwick et al. | Jul 1992 | A |
5159564 | Swartzel et al. | Oct 1992 | A |
5265957 | Moslehi et al. | Nov 1993 | A |
5282684 | Holzer | Feb 1994 | A |
5401100 | Thackston et al. | Mar 1995 | A |
5484205 | Grupp et al. | Jan 1996 | A |
5580172 | Bhardwaj et al. | Dec 1996 | A |
5658833 | Chen et al. | Aug 1997 | A |
5673028 | Levy | Sep 1997 | A |
5718511 | Mundt | Feb 1998 | A |
5798404 | Monty et al. | Aug 1998 | A |
5953449 | Matsuda et al. | Sep 1999 | A |
5969639 | Lauf et al. | Oct 1999 | A |
6033107 | Farina et al. | Mar 2000 | A |
6126744 | Hawkins et al. | Oct 2000 | A |
Number | Date | Country |
---|---|---|
2728439 | May 1979 | DE |
58-026236 | Feb 1983 | JP |
6315958 | Apr 1988 | JP |
2186229 | Jul 1990 | JP |
02186229 | Jul 1990 | JP |
405107212 | Apr 1993 | JP |
09166501 | Jun 1997 | JP |
1123381 | Jan 1999 | JP |
11123875 | May 1999 | JP |
1045010 | Sep 1983 | SU |
Entry |
---|
“Method for Determining Wafer Temperature During Polishing”, IBM Technical Disclosure Bulletin, vol. 24, Issue No. 6, p. 3021, Published Nov. 1, 1981.* |
Gabriel, C.T. et al., “In Situ Wafer Temperature Measurement During Plasma Etching,” Solid State Technology—Metrology, pps. 99-106, Oct. 1999. |
Brochure of Tempil, Inc., Catalog GC 96 (1998) pps. 2-11. |
Brochure of Reatec AG, (1998) two pages. |
Brochure of Wahl Instruments, Inc., (1996) pps. 44-46. |