Organometallic compound and method

Abstract

A class of organometallic compounds is provided. The compounds correspond in structure to Formula 1 (A)x-M-(OR3)4-x wherein: A is selected from the group consisting of —NR1R2, —N(R4)(CH2)nN(R5R6), —N═C(NR4R5)(NR6R7), OCOR1, halo and Y; R1 and R2 are independently selected from the group consisting of H and a cyclic or acyclic alkyl group having from 1 to 8 carbon atoms, with the proviso that at least one of R1 and R2 must be other than H; R4, R5, R6 and R7 are independently selected from the group consisting of H and an acyclic alkyl group having from 1 to 4 carbon atoms; Y is selected from the group consisting of a 3- to 13-membered heterocyclic radical containing at least one nitrogen atom; R3 is a cyclic or acyclic alkyl group having from 1 to 6 carbon atoms; M is selected from the group consisting of Si, Ge, Sn, Ti, Zr and Hf; x is an integer from 1 to 3; and n is an integer from 1 to 4. Compounds of the invention may be useful as precursors in chemical phase deposition processes such as atomic layer deposition (ALD), chemical vapour deposition (CVD), plasma assisted ALD and plasma assisted CVD. Methods of low temperature vapour phase deposition of metal oxide films, such as SiO2 films, are also provided.

Description

FIELD OF THE INVENTION

The invention relates to organometallic compounds which may be useful as precursors for metal oxide vapour phase deposition. The organometallic compounds of the invention comprise one or more ligands which are strong Lewis bases. The invention also relates to the low temperature vapour phase deposition of metal oxides using such compounds as a catalyst, in the presence of an oxidant.

BACKGROUND OF THE INVENTION

As the size of transistors keeps decreasing, challenges arise with the use of standard methods for the thermal deposition of SiO₂ and other metal oxides at high temperature. The use of high temperature causes diffusion of some elements. This diffusion changes the basic properties of transistors. Consequently, the devices are damaged. Therefore, low temperature thermal deposition of good quality SiO₂ and metal oxides for high k applications is preferred. However, in general, thermal (i.e. high temperature) deposition of SiO₂ is preferred as plasma-assisted deposition can damage the underlying device structures. Silicon dioxide (SiO₂) is a common dielectric material in silicon microelectronic devices. High quality SiO₂ has been formed by the thermal oxidation of silicon between 700-900° C. SiO₂ has also been deposited by chemical vapour deposition (CVD); some such approaches have utilized plasma techniques. However, CVD is not conformal in high aspect ratio structures and displays void formation in trenches and vias.

Atomic layer deposition (ALD) methods can be used to obtain conformality and atomic layer control of thin film growth. Atomic layer deposition (ALD) is a growth method based on sequential, self-limiting surface reactions. A variety of materials, including oxides, nitrides, and various metals have been deposited using ALD.

Despite its importance, SiO₂ ALD has been difficult to achieve. SiO₂ ALD using SiCl₄ and H₂O requires high temperatures (>325° C.) and large reactant exposures (>109 L (1 L) 10⁻⁶ Torr s). The use of NH₃ or pyridine permits the use of temperatures close to room temperature and exposures of ˜103-104 L. However, the by-products generated by these methods may cause blockage of the vacuum lines, incorporation of the amine hydrochloride salts into the films and, thus, the final quality of the films are very poor.

However, the use of halides in these methods results in the release of corrosive HCl during deposition. In addition, the HCl liberated can react with the amine catalyst to form chloride salts, leading to film contamination and thus poor film quality.

To avoid using halides, SiO₂ ALD has been attempted using a variety of reactants such as alkoxysilanes, aminosilanes and isocyanates, using a variety of different catalysts and reaction conditions. These methods suffer from a number of disadvantages, such as requiring large reactant exposures, long deposition times or resulting in contamination of the deposited film.

SUMMARY OF THE INVENTION

A class of organometallic compounds is provided. The compounds correspond in structure to Formula 1:(A)_x-M-(OR³)_4−x

wherein:

A is selected from the group consisting of —NR¹R², —N(R⁴)(CH₂)_nN(R⁵R⁶),

—N═C(NR⁴R⁵)(NR⁶R⁷), OCOR¹, halo and Y;

R¹ and R² are independently selected from the group consisting of H and a cyclic or acyclic alkyl group having from 1 to 8 carbon atoms, with the proviso that at least one of R¹ and R² must be other than H;

R⁴, R⁵, R⁶ and R⁷ are independently selected from the group consisting of H and an acyclic alkyl group having from 1 to 4 carbon atoms;

Y is selected from the group consisting of a 3- to 13-membered heterocyclic radical containing at least one nitrogen atom;

R³ is a cyclic or acyclic alkyl group having from 1 to 6 carbon atoms;

M is selected from the group consisting of Si, Ge, Sn, Ti, Zr and Hf;

x is an integer from 1 to 3; and

n is an integer from 1 to 4.

Such compounds may be useful as precursors for metal oxide vapour phase deposition. The compounds of the invention comprise one or more ligands which are strong Lewis bases. Exemplary bases comprise acetates, halides and neutral, nitrogen-containing species with high proton affinity such as phosphazenes, amidines and guanidines.

These compounds may have utility as precursors for vapour deposition processes such as CVD, ALD, plasma assisted ALD and plasma assisted CVD.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic representation of an ALD system for thin film deposition.

FIG. 2 shows the NMR spectrum of (pyrrolodinyl)Si(OMe)₃

FIG. 3 shows the NMR spectrum of (pyrrolodinyl)₂Si(OMe)₂

FIG. 4 shows the TGA of (pyrrolodinyl)₂Si(OMe)₂

FIG. 5 shows the vapour pressure of (pynolodinyl)₂Si(OMe)₂

FIG. 6 shows the thermal stability of (pyrrolodinyl)₂Si(OMe)₂

FIG. 7 shows the NMR spectrum of (pyrrolodinyl)₃Si(OMe)

FIG. 8 shows the TGA of (pyrrolodinyl)₃Si(OMe)

FIG. 9 shows the vapour pressure of (pynolodinyl)₃Si(OMe)

FIG. 10 shows the NMR spectrum of (Tetramethylguanidinyl)Si(OMe)₃

FIG. 11 shows the NMR spectrum of (Tetramethylguanidinyl)₂Si(OMe)₂

FIG. 12 shows the NMR spectrum of (Et₂N)Si(OMe)₃

FIG. 13 shows the NMR spectrum of ClSi(OMe)₃

FIG. 14 shows the NMR spectrum of Cl₂Si(OMe)₂

FIG. 15 shows the NMR spectrum of (AcO)Si(OMe)₃

FIG. 16 shows the NMR spectrum of (Me₂N)₂Si(OMe)₂

FIG. 17 shows the vapour pressure of (Me₂N)₂Si(OMe)₂

FIG. 18 shows the thermal stability of (Me₂N)₂Si(OMe)₂

FIG. 19 shows the CVD growth rate vs. temperature of of SiO₂ using (pyrrolodinyl)₂Si(OMe)₂ and H₂O at 80 Torr.

FIG. 20 shows the CVD growth rate vs. temperature and pressure of of SiO₂ using (pyrrolodinyl)₂Si(OMe)₂ and O₃.

FIG. 21 shows the ALD of SiO₂ using (pyrrolodinyl)₂Si(OMe)₂ and O₃, showing linear film thickness with number of ALD cycles.

FIG. 22 shows the ALD of SiO₂ using (pyrrolodinyl)₂Si(OMe)₂ and O₃, showing the temperature effect on the growth rate.

FIG. 23 shows the wet etching rate of SiO₂ films in dilute HF acid (0.1%), films prepared by CVD at 250° C. and various pressures using (pyrrolodinyl)₂Si(OMe)₂ and O₃.

FIG. 24 shows the wet etching rate of SiO₂ films in dilute HF acid (0.1%), films prepared by CVD and ALD at various temperatures using (pyrrolodinyl)₂Si(OMe)₂ and O₃.

FIG. 25 Table showing the wet etching rate comparison of the new material with commercially available material used to carry out deposition of silicon oxide films using the same conditions

DETAILED DESCRIPTION OF THE INVENTION

A class of organometallic compounds is provided. The compounds correspond in structure to Formula 1:(A)_x-M-(OR³)_4−x

wherein:

A is selected from the group consisting of —NR¹R², —N(R⁴)(CH₂)_nN(R⁵R⁶),

• • —N═C(NR⁴R⁵)(NR⁶R⁷), OCOR¹, halo and Y;

R¹ and R² are independently selected from the group consisting of H and a cyclic or acyclic alkyl group having from 1 to 8 carbon atoms, with the proviso that at least one of R¹ and R² must be other than H;

R⁴, R⁵, R⁶ and R⁷ are independently selected from the group consisting of H and an acyclic alkyl group having from 1 to 4 carbon atoms;

Y is selected from the group consisting of a 3- to 13-membered heterocyclic radical containing at least one nitrogen atom;

R³ is a cyclic or acyclic alkyl group having from 1 to 6 carbon atoms;

M is selected from the group consisting of Si, Ge, Sn, Ti, Zr and Hf;

x is an integer from 1 to 3; and

n is an integer from 1 to 4.

Such compounds may be useful as precursors for metal oxide vapour phase deposition. The compounds of the invention comprise one or more ligands which are strong Lewis bases. Exemplary bases comprise acetates, halides and neutral, nitrogen-containing species with high proton affinity such as phosphazenes, amidines and guanidines.

Strong bases catalyze the formation of SiO₂ much more effectively and more efficiently than a base such as NH₃, which is a typical example of a base used in the art. The use of a strongly basic catalyst allows for CVD and ALD deposition of SiO₂ at a low temperature. It also results in a good quality SiO₂ film.

Compounds of the invention may be useful as precursors in chemical phase deposition processes such as atomic layer deposition (ALD), chemical vapour deposition (CVD), plasma assisted ALD and plasma assisted CVD.

The use of a compound of the invention in the process outlined above has the advantage that deposition may be carried out at lower temperatures (0-500° C.) than processes previously known in the art.

The temperature range at which the reaction proceeds may be adjusted by changing the number of (NR¹R²)_x groups attached to a compound of Formula 1 (i.e. changing x), and by changing the nature of the (NR¹R²) group.

The reaction temperature may be in the range of from 0-500° C., more preferably from 100-350° C.

Incorporation of a strongly basic ligand into a compound of Formula 1 also allows for simpler process compared to processes of the art, which use two components (Si precursor plus catalyst), improving uniformity of exposure and film quality.

A compound of Formula 1 can be designed to provide desirable characteristics such as volatility and stability to facilitate application to the substrate. This can be affected by adjusting the number (x) and identity of the strongly basic ligand(s) A and of the alkyl group(s) (OR³).

Compounds of the invention include those in which M is selected from the group consisting of Si, Ge, Sn, Ti, Hf and Zr. Preferred compound include those in which M is selected from the group consisting of Si, Ge and Sn. More preferred compounds include those in which M is Si.

Compounds of the invention also include those in which R³ is a cyclic or acyclic alkyl group having from 1 to 6 carbon atoms. Preferred compounds are those in which R³ is a linear or branched lower alkyl group having from 1 to 4 carbon atoms. Yet other preferred compounds are those in which R³ is selected from the group consisting of methyl and ethyl.

Compounds of the invention also include those in which A is selected from the group consisting of —NR¹R², —N(R⁴)(CH₂)_nN(R⁵R⁶), —N═C(NR⁴R⁵)(NR⁶R⁷), OCOR¹, halo and Y. Preferred compounds include those in which A is selected from the group consisting of acetate, tetraethylguanidinyl, dimethylethylenediaminyl, bromo, iodo and an —NR¹R² group. More preferred compounds include those in which A is an —NR¹R² group.

Other preferred compounds are those in which R¹ and R² are independently selected from the group consisting of H and a cyclic or acyclic alkyl group having from 1 to 8 carbon atoms.

More preferred compounds of the invention include those in which R¹ and R² are independently selected from the group consisting of an alkyl group having from 1 to 4 carbon atoms. Other referred compounds of the invention include those in which R¹ and R² are independently selected from the group consisting of methyl, ethyl and isobutyl.

Compounds of the invention also include those in which Y represents a 3- to 13-membered heterocyclic radical containing at least one nitrogen atom.

Preferred compounds of the invention include those in which Y is a radical such as aziridinyl, azetidinyl, pyrrolidinyl, pyrrolyl, piperidinyl, pyridinyl, azepanyl, or azepinyl.

Further compounds of the invention include those in which Y contains at least one other heteroatom, such as an oxaziridinyl, imidazolidinyl, pyrazolidinyl, oxazolidinyl, isoxazolidinyl, piperazinyl, morpholiny, imidazolyl, pyrazolyl, oxazolinyl, isoxazolyl, diazinyl, or oxazinyl radical.

Preferred compounds are those in which Y is selected from the group consisting of pyrrolidinyl, azetidinyl and aziridinyl.

Compounds of the invention also include those in which R⁴, R⁵, R⁶ and R⁷ are independently selected from the group consisting of H and an acyclic alkyl group having from 1 to 4 carbon atoms. Preferred compounds are those in which are independently selected from the group consisting of methyl and ethyl.

Compounds of the invention may be useful as precursors for thin film deposition, using methods such as ALD or CVD. For example, one way in which the deposition of SiO₂ films by ALD may be carried out is as follows:

• • a) Providing at least one substrate having functional O—H groups covering the surface,
  • b) delivering to said substrate at least one compound of Formula 1 (wherein M=Si) in the gaseous phase,
  • c) purging substrate with purge gas;
  • d) delivering to said substrate an oxygen source in gaseous phase,
  • e) purging substrate with purge gas,
  • f) repeat steps b) through e) until a desired thickness of silicon oxide is deposited.

Suitable oxygen sources include, but are not limited to, compounds such as H₂O in gaseous phase, H₂O₂ in gaseous phase, O₂, O₃ and hydrazine

A typical schematic for an ALD system is shown in FIG. 1.

For the half cycle of precursor A reaction, an inert carrier gas (1) such as Ar is passed through manual valve (2) and mass flow controller (3) at a controlled flow rate to bubbler 1 (7) containing precursor A and carries vaporized precursor A to the reaction chamber (10). The automatic switch valves (ASV) 4 and 8 for bubbler 1 open automatically for the period of time that is pre-set. ASV 4 and 8 then close automatically, followed by purging and vacuuming of the reaction chamber for a pre-set period of time. The half cycle reaction for precursor A is finished. Automatically, ASV 13 and 17 open up, an inert carrier gas (1) such as Ar is passed through manual valve (2) and mass flow controller (3) at a controlled flow rate to bubbler 2 (15) containing precursor B and carries vaporized precursor B to the reaction chamber (10). After the pre-set period of time, ASV 13 and 17 close automatically, followed by purging and vacuuming of the reaction chamber for a pre-set period of time. The half cycle reaction for precursor B is finished. A full reaction cycle is finished, i.e. one atomic layer of product is deposited on substrate (20). The cycle is repeated to obtain the desired thickness. The temperature is controlled by a heater (18) and thermocouple (19). The pressure in the reaction chamber is controlled by pressure regulating valve (12), which is connected to vacuum pump.

Compounds of the invention may be prepared by processes known in the art. The examples below are illustrative of such processes, but are not intended to be limiting.

Example 1

Synthesis of (pyrrolodinyl)Si(OMe)₃

[(CH₂)₄N]—Si(OCH₃)₃  Chemical formula:

7.1 g pyrrolidine and 100 mL hexane were charged into a 250 mL flask under N₂, followed by the addition of 40 mL of 2.5M BuLi. After stirring for 1 hr, 15.2 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered and a clear liquid collected. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 2.

Example 2

Synthesis of (pyrrolodinyl)₂Si(OMe)₂

[(CH₂)₄N]₂—Si(OCH₃)₂  Chemical formula:

7.1 g pyrrolidine and 100 mL hexane were charged into a 250 mL flask under N₂, followed by the addition of 40 mL of 2.5M BuLi. After stirring for 1 hr, 7.6 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered to collect a clear liquid. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 3. As seen in FIG. 4, the TGA curve shows a stable material with minimal residue. Vapour pressure measurements shown in FIG. 5 demonstrate good volatility and FIG. 6 demonstrates the thermal stability of the compound up to 450° C.

Example 3

Synthesis of (pyrrolodinyl)₃Si(OMe)

[(CH₂)₄N]₃—Si(OCH₃)  Chemical Formula:

7.1 g pyrrolidine and 100 mL hexane were charged into a 250 mL flask under N₂, followed by the addition of 40 mL of 2.5M BuLi. After stirring for 1 hr, 5.1 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered to collect a clear liquid. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 7. As seen in FIG. 8, the TGA curve shows a stable material with minimal residue. Vapour pressure measurements shown in FIG. 9 demonstrate good volatility.

Example 4

Synthesis of (Tetramethylguanidinyl)Si(OMe)₃

[NC(N(CH₃)₂)₂]—Si(OCH₃)₃  Chemical formula:

10 g Tetramethylguanidine and 100 mL hexane were charged into a 250 mL flask under N₂, followed by the addition of 35 mL of 2.5M BuLi. After stirring for 1 hr, 13.2 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered to collect a clear liquid. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 10.

Example 5

Synthesis of (Tetramethylguanidinyl)₂Si(OMe)₂

[NC(N(CH₃)₂)₂]₂—Si(OCH₃)₂  Chemical formula:

10 g Tetramethylguanidine and 100 mL hexane were charged into a 250 mL flask under N₂, followed by the addition of 35 mL of 2.5M BuLi. After stirring for 1 hr, 6.6 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered to collect a clear liquid. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 11.

Example 6

Synthesis of (Tetramethylguanidinyl)₃Si(OMe)

[NC(N(CH₃)₂)₂]₃—Si(OCH₃)  Chemical formula:

10 g Tetramethylguanidine and 100 mL hexane were charged in a 250 mL flask under N₂, followed by the addition of 35 mL of 2.5M BuLi. After stirring for 1 hr, 4.4 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered to collect a clear liquid. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation.

Example 7

Synthesis of (Et₂N)Si(OMe)₃

[(CH₃CH₂)₂N]—Si(OCH₃)₃  Chemical formula:

3.7 g diethylamine and 100 mL hexane were charged in a 250 mL flask under N₂, followed by the addition of 20 mL of 2.5M BuLi. After stirring for 1 hour, 7.6 g tetramethyl orthosilicate was added. After stirring overnight, the reaction mixture was filtered to collect a clear liquid. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 12.

Example 8

Synthesis of Cl—Si(OMe)₃

Cl—Si(OCH₃)₃  Chemical formula:

To a 250 mL flask were charged 5.1 g acetyl chloride, 7.6 g tetramethyl orthosilicate and 0.02 g aluminum trichloride, under N₂. The mixture was heated to reflux for 3 hours and then allowed to cool to room temperature. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 13.

Example 9

Synthesis of Cl₂—Si(OMe)₂

Cl₂—Si(OCH₃)₂  Chemical formula:

To a 250 mL flask were charged 4 g (pyrrolodinyl)₂Si(OMe)₂ and 50 mL diethyl ether, followed by the addition of 35 mL of 2M HCl in diethyl ether. After stirring for 1 hr the reaction mixture was filtered. Volatiles were removed from the filtrate under vacuum whilst cooling in an ice/acetone bath. NMR analysis confirmed the product, as shown in FIG. 4.

Example 10

Synthesis of (AcO)i(OMe)₃

(AcO)—Si(OCH₃)₃  Chemical formula:

To a 100 mL flask were charged 22.8 g tetramethyl orthosilicate and 15.3 g acetic anhydride, under N₂. The mixture was heated at 120° C. for 4 hours and then allowed to cool to room temperature. Volatiles were removed under vacuum. Fractional distillation was then carried out to collect the desired product. NMR analysis confirmed the product, as shown in FIG. 15.

Example 11

Synthesis of (Me₂N)₂Si(OMe)₂

[(CH₃)₂N]₂—Si(OCH₃)₂  Chemical formula:

40 mL of 2.5M BuLi in hexane was charged into a 250 mL flask under N₂, followed by the passing of dimethylamine gas till the completion of the reaction. After stirring for 1 hr, 7.6 g tetramethyl orthosilicate was added. After stiffing overnight, the reaction mixture was filtered and a clear liquid collected. Volatiles were removed under vacuum. The obtained liquid product was then purified by distillation. NMR analysis confirmed the product, as shown in FIG. 16. Vapour pressure measurements shown in FIG. 17 demonstrate very good volatility. Thermal decomposition tests carried out in sealed ampoules shown in FIG. 18 show that this material is thermally stable up to 450° C.

Example 12

SiO₂ Deposition Using (pyrrolidinyl)₂Si(OMe)₂

SiO₂ films have been prepared by CVD and ALD from the precursor (pyrrolidine)₂Si(OMe)₂ using O₃ or H₂O as an oxidant, at various temperatures and pressures. Data has been obtained on growth rate of the SiO₂ films, and film quality was measured by density and wet etching rate (WER) in dilute HF acid.

Growth rates of films prepared by CVD as a function of temperature and gas pressure are shown in FIGS. 19 and 20. These show that when H₂O is used as the oxidant the growth rate is relatively slow, 3 A/min or less (the scale in FIG. 19 is in nm/min which is 10 A/min). Subsequent tests used O₃ as the oxidizing agent, resulting in approximately ten times higher growth rates, as shown in FIG. 20. Growth rate is largely independent of deposition pressure and appears to be optimized in the 200-300° C. temperature range.

Subsequent tests measured film growth per cycle using ALD. FIG. 21 shows linear film thickness growth vs. number of cycles, and flat growth rate per cycle with increasing exposure time as expected if the single atomic layer per cycle deposition process is working correctly.

FIG. 22 illustrates the temperature dependence of the growth rate per cycle as a function of temperature indicating an optimal temperature range of 250-400° C.

Quality of the produced films was measured by measuring density and the wet etching rate in 0.1% HF acid. FIG. 23 shows the WER and density of films prepared by CVD at 250° C. and various deposition pressures. FIG. 24 compares WER for films prepared at various temperatures by CVD and ALD, showing the superior quality of ALD prepared films (lower WER is considered indicative of superior film quality).

For comparison WER for films prepared by various methods are referenced from literature. WER for Thermal SiO2 has been measured at 1.8 A/min, this is the best quality film but required high temperatures incompatible with many applications. Films prepared by plama enhanced CVD and ALD using standard precursors were measured at 60 A/min and 40 A/min respectively. These are substantially higher than the WER for ALD films demonstrated here, as shown in FIG. 25.

1. Inert carrier gas input

2. Manual valve controlling inert gas input

3. Mass flow controller controlling the inert gas input digitally

4. Automatic switch valve for input of inert carrier gas to bubbler 1

5. Manual valve on the bubbler for input of inert carrier gas

6. Manual valve on the bubbler for output of inert carrier gas containing vaporized precursor

7. Bubbler containing precursor A

8. Automatic switch valve for input of inert carrier gas containing vaporized precursor to reaction chamber

9. Automatic switch valve for removal of any residues in the line.

10. Reaction chamber

11. Automatic switch valve for removal of precursors and residues in the line

12. Pressure regulating valve to vacuum pump controlling gas pressure in reaction chamber

13. Automatic switch valve for input of inert carrier gas to bubbler 2

14. Manual valve on the bubbler for input of inert carrier gas

15. Bubbler containing precursor B

16. Manual valve on the bubbler for output of inert carrier gas containing vaporized precursor

17. Automatic switch valve for input of inert carrier gas containing vaporized precursor to reaction chamber

18. Heater

19. Thermocouple

20. Substrate

Claims

1. A method for forming a metal oxide film by an atomic layer deposition (ALD) process, the ALD method comprising the steps of: a. Providing at least one substrate having functional O—H groups covering the surface,b. delivering to said substrate at least one compound of Formula 1 in the gaseous phase: (A)x-M-(OR3)4−x

2. The method of claim 1, wherein M is Si.

3. The method of claim 1, wherein A is selected from the group consisting of acetate, tetraethylguanidinyl, dimethylethylenediaminyl, and Y.

4. The method of claim 1, wherein A is OCOR1, and wherein R1 is independently selected from the group consisting of an acyclic alkyl group having from 1 to 4 carbon atoms.

5. The method of claim 3, wherein A is Y, and wherein Y is selected from the group consisting of aziridinyl, azetidinyl, pyrrolidinyl, pyrrolyl, piperidinyl, pyridinyl, azepanyl, and azepinyl.

6. The method of claim 1, wherein R3 is an acyclic alkyl group having from 1 to 4 carbon atoms.

7. The method of claim 3 wherein A is pyrrolidinyl, and R3 is selected from the group consisting of methyl and ethyl.

8. The method of claim 1, wherein the oxygen source is selected from H2O in gaseous phase, H2O2 in gaseous phase, O2, O3 and hydrazine.

9. The method of claim 1, wherein A is —NMe2.

10. The method of claim 4, wherein R1 is independently selected from the group consisting of methyl, ethyl and isobutyl.

11. The method of claim 5, wherein Y is selected from the group consisting of aziridinyl, azetidinyl and pyrrolidinyl.

12. The method of claim 6, wherein R3 is selected from the group consisting of methyl and ethyl.

13. The method of claim 12, wherein R3 is a methyl group.

14. The method of claim 1, wherein A is —N(R4)(CH2)nN(R5R6) or —N═C(NR4R5)(NR6R7).

15. The method of claim 14, wherein R4, R5, R6 and R7 are independently selected from the group consisting of methyl and ethyl.