Patent Application
20160218263
The present application is based on, and claims priority from Taiwan Application Number 104102655, filed Jan. 27, 2015, the disclosure of which is hereby incorporated by reference herein in its entirety.
1. Technical Field
The present disclosure relates to semiconductor packages, and, more particularly, to a light emitting package.
2. Description of Related Art
With the rapid development of the electronic industry, the form factors of the electronic products are tended towards compactness and miniaturization, while their functionalities are heading in the directions of high performance, high functionalities, and high speeds. Light Emitting Diodes (LEDs) are widely used in electronic products with lighting requirements due to advantages such as their long life, small size, high shock resistance and low power consumptions. As a result, their applications are being seen in industries, various electronic products, home appliances and the like.
In the LED package 1, since the substrate 10 is required to carry the LED 11, the LED package 1 has thickness and width increased, which is contradictory to the requirement of miniaturization.
Moreover, the fluorescent layer 13 is separated too far from the LED 11, resulting in a poor luminous efficiency.
Furthermore, as the LED 11 is encapsulated in the encapsulant 13, poor heat dissipation occurs. Issues such as yellowing of the encapsulant, poor luminous efficiency due to overheating of the fluorescent powder may occur, especially for the encapsulant at a side face 11c of the LED 11.
Therefore, there is a need for a solution that addresses the aforementioned issues in the prior art.
In view of the aforementioned shortcomings of the prior art, the present disclosure provides a package structure, which may include: at least one light emitting element including opposite first and second sides and side faces adjacent to the first and second sides; a coating body in contact with and combined with the side faces of the light emitting element, wherein the coating body is made of a non-transparent material; and at least one metal structure disposed at the first side of the light emitting element.
The present disclosure further provides a method for manufacturing a package structure, which may include the following steps of: combining at least one light emitting element on a carrier, wherein the light emitting element includes a first side combined with the carrier, a second side opposite to the first side, and side faces adjacent to the first and second sides; forming on the carrier a coating body that is in contact with and combined with the side faces of the light emitting element, wherein the coating body is exposed from the second side of the light emitting element and made of a non-transparent material; removing the carrier to expose the first side of the light emitting element; and forming at least one metal structure at the first side of the light emitting element.
In summary, the package structure is manufactured by wafer-level packaging. Therefore, there is no need for a substrate to carry the light emitting elements as required in the prior art, and the package structure has thickness and width greatly reduced, which satisfies the requirement for miniaturization.
The package structure according to the present disclosure shortens the distance between the fluorescent layer and the light emitting element by allowing the fluorescent layer to combine and be in contact with the second side of the light emitting element, thereby achieving a better luminous efficiency.
Additionally, the side faces of the light emitting element are in contact with and combined with the coating body. As a result, no light will be emitted from the side faces of the light emitting element. Therefore, the heat generated is reduced, and problems such as yellowing of the encapsulant and poor luminous efficiency due to overheating of the fluorescent powder are solved. The metal structure also improves heat dissipation.
The present disclosure can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
The present disclosure is described by the following specific embodiments. Those with ordinary skills in the arts can readily understand other advantages and functions of the present disclosure after reading the disclosure of this specification.
It should be noted that the structures, ratios, sizes shown in the drawings appended to this specification are to be construed in conjunction with the disclosure of this specification in order to facilitate understanding of those skilled in the art. They are not meant, in any ways, to limit the implementations of the present disclosure, and therefore have no substantial technical meaning. Without affecting the effects created and objectives achieved by the present disclosure, any modifications, changes or adjustments to the structures, ratio relationships or sizes, are to be construed as fall within the range covered by the technical contents disclosed herein. Meanwhile, terms, such as “up”, “down”, “bottom”, “first”, “second”, “a” and the like, are for illustrative purposes only, and are not meant to limit the range implementable by the present disclosure. Any changes or adjustments made to their relative relationships, without modifying the substantial technical contents, are also to be construed as within the range implementable by the present disclosure.
As shown in
In an embodiment, the light emitting elements 21 are LEDs, and each of the LEDs has a first side 21a combined with the carrier 20, a second side 21b opposite to the first side 21a, and side faces 21c adjacent to the first side 21a and the second side 21b. The second side 21b includes a plurality of electrodes 211.
In an embodiment, the second side 21b of the light emitting elements 21 is a light emitting side.
In an embodiment, the carrier 20 can be of various types, and there is no particular constraint on the type of the carrier 20.
As shown in
In an embodiment, the coating body 22 can be made of a non-transparent material such as white glue. The coating body 22 is defined with the first surface 22a combined with the carrier 20 and a second surface 22b opposite to the first surface 22a, such that the second side 21b of the light emitting elements 21 is on the same side as the second surface 22b of the coating body 22.
In an embodiment, the second side 21b of the light emitting elements 21 is flush with the second surface 22b of the coating body 22, such that the second surface 22b of the coating body 22 is exposed from the second side 21b of the light emitting elements 21.
In another embodiment, holes are further formed on the second surface 22b of the coating body 22, to expose the second side 21b of the light emitting elements 21.
In an embodiment, the wirings 210 can be formed by spin coating, and extend onto the second surface 22b of the coating body 22. A plurality of conductive pads 220 are disposed on the second surface 22b of the coating body 22. The wirings 210 are electrically connected to the conductive pads 220 and the electrodes 211.
As shown in
In an embodiment, the fluorescent layer 23 coats the wirings 210 on the second side 21b of the light emitting elements 21, and exposes the wirings 210 on the second surface 22b of the coating body 22.
In another embodiment, solder wires 210′ can be used in place of the wirings 210, and external pads 220′ can be used in place of the conductive pads 220, as shown in
In an embodiment, a translucent layer such as glass can also be used to replace the fluorescent layer 23. The glass would be a cover-all layer, and thus covers both the second side 21b of the light emitting elements 21 and the second surface 22b of the coating body 22.
As shown in
In an embodiment, the first side 21a of the light emitting elements 21 is flush with the first surface 22a of the coating body 22, and the metal structure 24 is used as a heat dissipating element.
Moreover, in another embodiment, the metal structure 24 can be formed first, and then singulation is performed.
Therefore, the package structures 2 according to the present disclosure are manufactured by wafer-level packaging, and there is no need for a substrate to carry the light emitting elements 21, as required in the prior art, thus greatly reducing the thickness and width of the package structures 2, satisfying the requirement for miniaturization.
Also, the package structures 2 according to the present disclosure shorten the distance between the fluorescent layer 23 and the light emitting element 21 by allowing the fluorescent layer 23 to combine by contact with the second side 21b of the light emitting element 21, thus achieving a better luminous efficiency.
The side faces 21c of the light emitting element 21 are in contact with and combined with the coating body 22. As a result, no light will be emitted from the side faces 21c of the light emitting element 21. Therefore, the heat generated is reduced, and problems such as yellowing of the encapsulant and poor luminous efficiency due to overheating of the fluorescent powder are solved. The first side 21a of the light emitting element 21 acts as a heat dissipating side, and heat generated by the package structure 2 of the present disclosure is dissipated through the metal structure 24, thus improving heat dissipation.
As shown in
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As shown in
In an embodiment, the fluorescent layer 23 coats the second side 21b of the light emitting elements 21, as well as the whole second surface 22b of the coating body 22.
In another embodiment, the fluorescent layer 23 coats the second side 21b of the light emitting elements 21 and only a portion of the second surface 22b of the coating body 22.
As shown in
In an embodiment, the metal structure 24 is connected with the electrodes 311, and acts as a conductive wire or a heat-dissipating component.
As shown in
In an embodiment, a subsequent manufacturing step following
Therefore, the package structures 3 according to the present disclosure are manufactured by wafer-level packaging, and there is no need for a substrate to carry the light emitting elements 21 as required in the prior art, thus greatly reducing the thickness and width of the package structures 3, satisfying the requirement for miniaturization.
The package structures 3 according to the present disclosure shorten the distance between the fluorescent layer 23 and the light emitting element 21 by allowing the fluorescent layer 23 to combine by contact with the second side 21b of the light emitting element 21, thus achieving a better luminous efficiency.
The side faces 21c of the light emitting elements 21 combine by contact with the coating body 22. As a result, no light will be emitted from the side faces 21c of the light emitting elements 21. Therefore, the heat generated is reduced, and problems such as yellowing of the encapsulant and poor luminous efficiency due to overheating of the fluorescent powder are solved. The first side 21a of the light emitting elements 21 acts as a heat dissipating side, and heat generated by the package structure 3 according to the present disclosure is dissipated through the metal structure 24, thus improving heat dissipation.
As shown in
As shown in
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As shown in
In an embodiment, the fluorescent layer 23 coats the second side 21b of the light emitting elements 21, as well as the whole second surface 22b of the coating body 22.
In another embodiment, the fluorescent layer 23 coats the second side 21b of the light emitting element 21 and only a portion of the second surface 22b of the coating body 22.
As shown in
In an embodiment, the metal structure 24 connects by contacts the electrodes 311, and acts as a conductive wire or a heat-dissipating component.
As shown in
The above embodiments are only used to illustrate the principles of the present disclosure, and should not be construed as to limit the present disclosure in any way. The above embodiments can be modified by those with ordinary skill in the art without departing from the scope of the present disclosure as defined in the following appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 104102655 | Jan 2015 | TW | national |
