relating to heat extraction or cooling elements

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CPC
H01L2933/0075

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups

Current Industry

H01L2933/0075relating to heat extraction or cooling elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
LED packaging structure
- Patent number 12,176,473
- Issue date Dec 24, 2024
- Peng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet disposed below panel, and display device including the same
- Patent number 12,166,163
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Jae-Hwan Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light source device having a bonding layer...
- Patent number 12,046,705
- Issue date Jul 23, 2024
- Nichia Corporation
- Takashi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes with enhanced thermal sinking and associated...
- Patent number 12,015,114
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Kevin Tetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 11,990,577
- Issue date May 21, 2024
- Quanzhou San'an Semiconductor Technology Co., Ltd.
- Shaohua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,978,831
- Issue date May 7, 2024
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical assembly having heat dissipation, and method for pr...
- Patent number 11,942,588
- Issue date Mar 26, 2024
- Harting AG
- Michael Spirgi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical solid-state transducers and high voltage solid-state trans...
- Patent number 11,843,087
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device with LED stack for display and display appara...
- Patent number 11,804,511
- Issue date Oct 31, 2023
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of manufacture for LED packages having fill and d...
- Patent number 11,769,865
- Issue date Sep 26, 2023
- BRIDGELUX CHONGQING CO., LTD.
- Tao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes with enhanced thermal sinking and associated...
- Patent number 11,688,842
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Kevin Tetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and fabricating method for display device
- Patent number 11,682,659
- Issue date Jun 20, 2023
- Samsung Display Co., Ltd.
- Hyung Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light source device having a bonding layer...
- Patent number 11,677,062
- Issue date Jun 13, 2023
- Nichia Corporation
- Takashi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component that dissipates heat
- Patent number 11,588,088
- Issue date Feb 21, 2023
- OSRAM OLED GmbH
- Luca Haiberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component joining apparatus, component joining method and mounted s...
- Patent number 11,574,888
- Issue date Feb 7, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical solid-state transducers and high voltage solid-state trans...
- Patent number 11,563,158
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Upper substrate for miniature LED component, miniature LED componen...
- Patent number 11,545,607
- Issue date Jan 3, 2023
- TUNGHSU GROUP CO., LTD.
- Yihau Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method thereof
- Patent number 11,511,467
- Issue date Nov 29, 2022
- Lumileds LLC
- Nan Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Folded heatsink design for thermal challenging LED applications
- Patent number 11,508,892
- Issue date Nov 22, 2022
- Lumileds LLC
- Jeroen Den Breejen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible lighiing device and display panel using micro LED chips
- Patent number 11,482,568
- Issue date Oct 25, 2022
- LUMENS CO., LTD.
- Jeongwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dense hybrid package integration of optically programmable chip
- Patent number 11,476,238
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor device and method for forming an optoe...
- Patent number 11,437,557
- Issue date Sep 6, 2022
- Osram Opto Semiconductors GmbH
- Asliza Alias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device with high flexibility in connecting electrical comp...
- Patent number 11,430,933
- Issue date Aug 30, 2022
- Lumileds LLC
- Harry Gijsbers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting arrangement
- Patent number 11,424,223
- Issue date Aug 23, 2022
- Lumileds LLC
- Michael Deckers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-sided thermal management device for electronic apparatus
- Patent number 11,411,153
- Issue date Aug 9, 2022
- Dana Canada Corporation
- Doug Vanderwees
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight module and manufacturing method of same
- Patent number 11,374,156
- Issue date Jun 28, 2022
- Weikang Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device and method of producing an optoelectronic device
- Patent number 11,349,051
- Issue date May 31, 2022
- Osram Opto Semiconductors GmbH
- Alan Piquette
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR...
- Publication number 20240405176
- Publication date Dec 5, 2024
- Nichia Corporation.
- Atsushi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY, AND PREPARATION METHOD FOR LIGHT-EM...
- Publication number 20240355993
- Publication date Oct 24, 2024
- Xiamen Extremely PQ Display Technology Co., Ltd.
- Gang MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED...
- Publication number 20240339582
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Kevin Tetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS
- Publication number 20240322067
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jongyoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240304776
- Publication date Sep 12, 2024
- QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.
- SHAOHUA HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR LED DISPLAY HEAT DISSIPATION
- Publication number 20240250231
- Publication date Jul 25, 2024
- Corning Incorporated
- SEAN MATTHEW GARNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid State Light Sheet Having Wide Support Substrate and Narrow St...
- Publication number 20240243224
- Publication date Jul 18, 2024
- QUARKSTAR LLC
- Louis Lerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE WITH HEAT SINK AND MANUFACTURING METHOD THEREOF
- Publication number 20240234670
- Publication date Jul 11, 2024
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTIN...
- Publication number 20240213432
- Publication date Jun 27, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Shanwei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED SUPPORT, PREPARATION METHOD THEREOF, AND DEVICE
- Publication number 20240170630
- Publication date May 23, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
- Haojie GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...
- Publication number 20240128426
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOSPHOR CERAMIC, LIGHT-EMITTING DEVICE AND MANUFACTURING METHODS T...
- Publication number 20230383181
- Publication date Nov 30, 2023
- Nichia Corporation.
- Takeshi SADAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING BRIGHTNESS UNIFORMITY A...
- Publication number 20230387376
- Publication date Nov 30, 2023
- Facebook Technologies, LLC
- Alex Ockfen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT SOURCE DEVICE HAVING A BONDING LAYER...
- Publication number 20230261166
- Publication date Aug 17, 2023
- Nichia Corporation.
- Takashi MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20230187598
- Publication date Jun 15, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...
- Publication number 20230163266
- Publication date May 25, 2023
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...
- Publication number 20230155055
- Publication date May 18, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230082985
- Publication date Mar 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Wook KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, MANUFACTURE METHOD THEREOF AND DISPLAY APPARATUS
- Publication number 20230020481
- Publication date Jan 19, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Chaoxue QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component and Method for Producing the Same
- Publication number 20220320403
- Publication date Oct 6, 2022
- Osram Opto Semiconductors GmbH
- Ivar TÅNGRING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN...
- Publication number 20220320404
- Publication date Oct 6, 2022
- Osram Opto Semiconductors GmbH
- Ivar TÅNGRING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SUBSTRATE THEREOF, AND MANUFACTURING ME...
- Publication number 20220254975
- Publication date Aug 11, 2022
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Device Mounting Structure with Embedded Heatsink Ele...
- Publication number 20220231199
- Publication date Jul 21, 2022
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Michael Shur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURIN...
- Publication number 20220199882
- Publication date Jun 23, 2022
- Lightizer Co., Ltd.
- Jae Sik MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLAY SUBSTRATE AND LIGHT EMITTING DEVICE USING INLAY SUBSTRATE
- Publication number 20220059744
- Publication date Feb 24, 2022
- Citizen Electronics Co., Ltd.
- Takashi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A LIGHT-EMITTING DEVICE WITH METAL INLAY A...
- Publication number 20220029050
- Publication date Jan 27, 2022
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220005993
- Publication date Jan 6, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Shaohua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20210391508
- Publication date Dec 16, 2021
- Shinko Electric Industries Co., LTD.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation-Emitting Component
- Publication number 20210384395
- Publication date Dec 9, 2021
- Osram Opto Semiconductors GmbH
- Norwin von Malm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflective and Heat-Insulating QLED Package Device and Method for P...
- Publication number 20210367126
- Publication date Nov 25, 2021
- Tianjin Zhonghuan Electronic Lighting Technology Co., Ltd.
- Jianming HONG
- B82 - NANO-TECHNOLOGY

relating to heat extraction or cooling elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED packaging structure

Sheet disposed below panel, and display device including the same

Method of manufacturing light source device having a bonding layer...

Light emitting diodes with enhanced thermal sinking and associated...

Light-emitting device and method for manufacturing the same

Light emitting device

Electro-optical assembly having heat dissipation, and method for pr...

Vertical solid-state transducers and high voltage solid-state trans...

Carrier, assembly comprising a substrate and a carrier, and method...

Light emitting device with LED stack for display and display appara...

System and method of manufacture for LED packages having fill and d...

Silicon heat-dissipation package for compact electronic devices

Light emitting diodes with enhanced thermal sinking and associated...

Display device and fabricating method for display device

Method of manufacturing light source device having a bonding layer...

Optoelectronic component that dissipates heat

Component joining apparatus, component joining method and mounted s...

Vertical solid-state transducers and high voltage solid-state trans...

Upper substrate for miniature LED component, miniature LED componen...

Light emitting device and manufacturing method thereof

Folded heatsink design for thermal challenging LED applications

Flexible lighiing device and display panel using micro LED chips

Jointing material, fabrication method for semiconductor device usin...

Dense hybrid package integration of optically programmable chip

Optoelectronic semiconductor device and method for forming an optoe...

Lighting device with high flexibility in connecting electrical comp...

LED lighting arrangement

Multi-sided thermal management device for electronic apparatus

Backlight module and manufacturing method of same

Optoelectronic device and method of producing an optoelectronic device

Patents Applicationslast 30 patents

SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR...

LIGHT-EMITTING DEVICE, DISPLAY, AND PREPARATION METHOD FOR LIGHT-EM...

LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED...

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATES FOR LED DISPLAY HEAT DISSIPATION

Solid State Light Sheet Having Wide Support Substrate and Narrow St...

CERAMIC SUBSTRATE WITH HEAT SINK AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTIN...

LED SUPPORT, PREPARATION METHOD THEREOF, AND DEVICE

VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...

PHOSPHOR CERAMIC, LIGHT-EMITTING DEVICE AND MANUFACTURING METHODS T...

APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING BRIGHTNESS UNIFORMITY A...

METHOD OF MANUFACTURING LIGHT SOURCE DEVICE HAVING A BONDING LAYER...

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...

METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...

DISPLAY DEVICE

DISPLAY MODULE, MANUFACTURE METHOD THEREOF AND DISPLAY APPARATUS

Semiconductor Component and Method for Producing the Same

OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN...

SEMICONDUCTOR STRUCTURE AND SUBSTRATE THEREOF, AND MANUFACTURING ME...

Optoelectronic Device Mounting Structure with Embedded Heatsink Ele...

LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURIN...

INLAY SUBSTRATE AND LIGHT EMITTING DEVICE USING INLAY SUBSTRATE

METHODS OF MANUFACTURING A LIGHT-EMITTING DEVICE WITH METAL INLAY A...

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING DEVICE

Radiation-Emitting Component

Reflective and Heat-Insulating QLED Package Device and Method for P...