Electronic components, such as semiconductor devices, circuits, and printed circuit board (PCB) assemblies, are frequently tested, during and after their manufacture, using a test system such as an automated test equipment (ATE). To perform these tests, an ATE may include instruments that generate or measure test signals such that a range of operating conditions can be tested on a particular device-under-test (DUT). An instrument, for example, may generate or measure a pattern of digital signals to enable testing of digital logic within a semiconductor device. Digital signals have timings that are represented by the position of data edges, such as rising edges or falling edges, in the time domain within the digital signals.
An ATE is frequently used to apply a test signal with a specific timing, or in some instances, to apply multiple test signals with coordinated timings to one or more test points of the DUT. To coordinate the timing, an ATE may be designed to synchronize the generation of the multiple test signals within different channels. Though, merely synchronizing the times at which test signals are generated may not be adequate to coordinate the time of arrival of the signals at test points of the DUT. Differences in propagation delays through instruments within the ATE can change relative timings of test signals, thereby affecting the accuracy of test results. To increase testing accuracy, one or more delay lines may be employed in the ATE to provide adjustable propagation delays. An ATE may be calibrated by adjusting relative propagation delays through the delay lines. Such calibration may be done at various times, including when an ATE is manufactured, is installed, on a periodic schedule or at times depending on an amount of use.
Aspects of the present application are directed to an apparatus and methods of operating the same to delay the timing of a signal.
According to some embodiments, an apparatus for delaying a signal is provided. The apparatus comprises a splitter circuit having an input and N outputs (N is at least two). The splitter circuit is configured to receive an input signal having a first data rate at the input, and to generate N split signals at the respective outputs, each of the N split signals has a data rate that is less than the first data rate. The apparatus further comprises a delay circuit configured to generate a delayed signal based on the N split signals. The delayed signal is the input signal with a delay.
According to some embodiments, a method for delaying a signal is provided. The method comprises receiving, with a splitter circuit, an input signal having a plurality of rising and falling edges at a first data rate; generating, with the splitter circuit, a first split signal having a plurality of rising and falling edges at a second data rate, and a second split signals having a plurality of rising and falling edges at a third data rate, wherein the second and third data rates are less than the first data rate; generating, at a delay circuit, a delayed signal based on the first and second split signals. The delayed signal is the input signal with a delay.
According to some embodiments, a method for calibrating a test equipment is provided. The test equipment comprises a splitter circuit configured to receive an input signal having a first data rate, and to generate a first and a second split signals each having a data rate that is less than the first data rate; a first delay path configured to delay the first split signal by a first amount; a second delay path configured to delay the second split signal by a second amount; and a combiner circuit configured to receive the delayed first and second split signals at a first input and a second input, respectively, and to generate a delayed signal at an output based on the delayed first and second split signals. The method comprises measuring the delayed signal at an output of the combiner circuit; and calibrating the first amount and the second amount based on the measured delayed signal.
Various aspects and embodiments will be described with reference to the following figures. It should be appreciated that the figures are not necessarily drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing.
The inventors have recognized and appreciated techniques and circuit designs for efficiently producing high speed signals with high timing accuracy, yet low power consumption. Such techniques may entail splitting an input signal having high data rate into parallel split signals having lower data rates. The split signals may be delayed in respective parallel delay paths before being combined to generate a delayed signal that is the input signal with a delay.
Techniques as described herein may be used to generate timing signals in ATE. Each of multiple signal paths may include a delay circuit and the amount of delay introduced by each such delay circuit may be variable. The amount of delay for each delay circuit may be determined based on a desired use of the delayed signal, and may be programmed as part of the programming of the test system, then offset by a calibration value determined during a calibration process such that the amount of delay may calibrate for variations in delay among the signal paths.
Delaying a signal in this fashion may provide high timing accuracy at high data speeds using a compact and modular circuit design. In some embodiments, a high speed delay line may be constructed from multiple lower data rate parallel delay lines that are each modular, simplifying circuit design of the high speed circuit. In one embodiment, a delay line according to aspects of the present application may operate on signals having data speed of at least 10 Gbps. Such a high speed delay line may be implemented with components of bandwidth slower than 10 Gbps, for example with half-rate (5 Gbps) bandwidth components. In one example, the half-rate components may be constructed in a compact design using a few tens of complementary metal-oxide-semiconductor (CMOS) transistors.
A variable delay line of this type may be used, for example, in the pin electronics (PE) of an ATE. Within an ATE, a digital test instrument may be implemented with pin electronics (PE), a timing generator (TG) that incorporate multiple variable delay lines to delay digital data in small time increments. The TG takes in vector data and period information from a pattern generator (PG), and produces timed signals that control the PE by generating receive strobe and drive path edge times. The PE, PG and TG may be separate components, or may be implemented as one or more integrated circuits (ICs) that comprise a large number of transistors. The variable delay for each delay line may be based on the use of the signal output from the delay line. For example, if the delay line output is coupled to a control input of a driver such that the delay line output sets the time of drive path edge, the variable delay may be set to result in a signal that controls the driver to output an edge at a desired time. The amount of delay to produce such a signal may be based on a programmed value for that edge offset by a calibration value that may be determined for signal path, including the delay circuit and the driver and other components that may impact the time at which such an edge is generated.
The inventors have recognized and appreciated that when test signals in the PE have high data rates on the order of multiple Gbps, such as up to 10 Gbps, a delay line that can provide accurate data edge placement with a resolution in the single picosecond range can be achieved using a low cost and low power technology, such as CMOS.
Aspects of the present application are directed to a delay line architecture in which an input signal having a high data rate may be split in a splitter circuit into parallel split signals having lower data rates that are delayed in respective parallel delay paths. Because each of the split signals has a lower rate of data (rising/falling) edges and in general greater timing separation between adjacent data edges compared to the input signal, the parallel delay paths may be implemented using circuitry components of lower bandwidth than the data rate of the input signal, for example using CMOS transistors based on 65 nm or 40 nm node technology. The inventors have recognized and appreciated that using lower bandwidth CMOS components operating at lower data rate reduces overall electrical power consumption of the delay line compared to using a single high data rate delay line, among other benefits. This is true even though the number of components may be larger. The lower bandwidth components may be part of a delay circuit of the parallel delay line architecture.
The delay circuit is configured to apply selective amounts of delays using multiple parallel delay paths to each of the split signals, and to combine the delayed split signals in a combiner to generate the delayed signal that is substantially the same as the input signal with a delay based on the parallel split signals. The amount of delay may be programmable by using variable delay components in each of the parallel delay paths.
In some embodiments, an input signal with a high data rate is split into two signals each having substantially half the data rate of the input signal. For such a signal, and assuming input signal edges can be present only at positions defined by a periodic clock, the minimum data edge separation is twice the minimum data edge separation of the input signal. The average data rate of such a signal will converge to half the data rate for of the input signal for a sufficiently long random input signal. However, the splitter circuit may be implemented with simple circuit components and the instantaneous data rate of each split signal may vary over time based on the pattern of rising and falling edges in the input signal.
Delay circuits having low bandwidth components may be used to delay the two split signals, which, when recombined into a full rate signal, yields a delayed version of the input signal. Such a delayed signal may be produced with reduced electric power consumption of the delay line relative to delay lines implemented in semiconductor technology that delay the full rate signal, while providing accurate amount of delay.
A circuit that splits an input signal into two, substantially half rate signals is described herein for purposes of illustrating the circuit designs for a delay line. It should be appreciated, however, that delay lines may be implemented with a circuit that splits an input signal into N parallel paths, each of which is delayed before being recombined into a delayed version of the input. As an example, a two-fold splitting and combining may be repeated twice in a hierarchical fashion, resulting in four parallel paths. As another example, compact non-hierarchical circuits for splitting into more than two signals and combining them may be used and these are natural generalizations of the exemplary design described below that will be recognized by those skilled in the art.
Any suitable methods may be used to split an input signal into two lower-rate split signals. According to an aspect, a split circuit may be used to receive the input signal at an input and generate first and second split signals at two outputs. In some embodiments, each of the first and second split signals comprises, on average, half the amount of data edges in a given time period compared to the input signal and thus has substantially half the data rate of the input signal.
Because the input signal typically comprises a stream of consecutive and alternating rising and falling edges, the inventor has recognized and appreciated that one way to split the input signal into two half-rate split signals is to alternatively generate rising/falling edges in the two split signals for every rising/falling edge received from the input signal. In one exemplary embodiment, the splitter circuit is configured to generate a first edge in a first split signal but not in a second split signal in response to receiving a rising edge in the input signal, and to generate a second edge in the second split signal but not in the first split signal in response to receiving a falling edge subsequent to the rising edge in the input signal. In effect, each of the data edges in the first split signal corresponds to rising edges of the input signal, while each of the data edges in the second split signal corresponds to falling edges of the input signal. Without wishing to be bound by a particular theory, the inventors have recognized that the splitter circuit in the exemplary embodiment described above effectively operates as a “reverse XOR gate,” such that a logic high at the input corresponds to a logic high and a logic low at the two outputs, and a logic low at the input corresponds to both of the two outputs having the same polarity. It should be appreciated that in such a “reverse XOR gate,” a truth table for the input and two outputs of the splitter circuit is the same as a truth table for an XOR gate, with the input of the splitter circuit corresponding to the XOR gate output in the truth table and the two outputs of the splitter circuit corresponding to the XOR gate inputs in the truth table. The inventors have recognized and appreciated a simple circuit design to implement such a “reverse XOR gate.” In some embodiments, the reverse XOR gate design may be implemented with a small number of CMOS transistors. The CMOS-based delay line circuit design may provide a device having compact footprint and small electric power consumption.
The lower rate signals may be separately processed and then combined back to the full rate of the input signal in an XOR gate. In the example of a delay line, the processing of the lower-rate split signals may entail delaying each signal by a variable amount.
According to an aspect of the present application, individually adjustable delays may be applied to the two split signals, for example by using two parallel delay paths coupled to respective outputs of the splitter circuit. The two delay paths generate two respective delayed split signals, which may be combined in a combiner circuit. The combiner circuit is configured to combine information carried within the data edges in each of the delayed two lower data rate split signals to generate a delayed input signal that has the same amount and relative timing of data edges as the input signal, but with the variable delay. In some embodiments, an XOR gate may be used inside the combiner circuit with two inputs configured to receive the delayed split signals, and the output of the XOR gate configured to generate the delayed input signal.
According to another aspect of the present application, the amount of delay within individual parallel delay paths of the delay circuit may be offset by a calibration value to yield the amount of delay desired for the delayed input signal at the output of the combiner circuit, relative to the original input signal.
Referring to the figures,
It should be appreciated that
Further, it should be appreciated that other components as illustrated are exemplary rather than limiting. For example, although the test computer 12 is illustrated as a personal computer (PC) in
In the diagram shown in
According to an aspect of the present application, input signal 102 may be a digital data stream having a data rate of 5 Gbps, 20 Gbps, between 1 and 100 Gbps, or between 5 and 50 Gbps, although it should be appreciated that various aspects of the technology disclosed herein may be used with a digital data stream having any bandwidth. The delay line circuitry 200 is configured as a high speed delay line circuitry. As a specific example, the data rate may be 10 Gbps. Each of the N split signals 1041-104N has a respective data rate that is lower than the data rate of the input signal 102.
In some embodiments, the delay circuit 230 comprises N delay paths 2301-230N and a combiner circuit 240. Each of the delay paths 2301-230N receives a respective split signals 1041-104N, applies an adjustable amount of delay, and generates a respective delayed split signals 2041-204N. As above, the adjustable delay may include a programmable delay, such as may be applied by a timing generator based on programming in a pattern generator. That programmed delay may be offset by a calibration value that is determined as part of a calibration routine to compensate for variations in propagation delays of different signal paths within the test system. In some embodiments, each of the delay paths 2301-230N may separately delay rising and falling edges of the signals passing through it. Such a configuration enables accurate delays for circuitry that has asymmetric rise and fall times. Each of the delay paths 2301-230N may be implemented by a suitable technique known in the art to apply an adjustable amount of delay to a signal propagated therein.
The combiner 240 receives the N delayed split signals 2041-204N, and generates the delayed signal 106 based on the N delayed split signals 2041-204N.
According to an aspect, because split signals 1041-104N have lower data rate than input signal 102, low bandwidth components may be used in the delay circuit 230 and calibrated at a lower data rate than that of input signal 102. As a result, embodiments of the present application may provide high accuracy in delaying high speed signals. In one non-limiting example, for 10 Gbps input data, each of the delay path may see 5 Gbps data rates and the Trailing Edge Error (TEE) of the delay line may be less than 10 ps. Another advantage is a reduction of electric power consumption from using components operated at lower bandwidth than the data rate of the input signal.
A further advantage is modularity. Because the delay line comprises lower bandwidth components, in some embodiments a delay line that operate on high data rate input signals may comprise parallel modules that are delay lines in themselves but configured to operate on lower data rate input signals. For example, a 10 Gbps delay line may split the input signal into two half-rate split signals having 5 Gbps data rate, and comprise two parallel 5 Gbps sub-delay lines of any suitable design to delay the respective half-rate split signals, before combing the results into a delayed version of the 10 Gbps input signal. Such modularity may simplify circuit design for high speed delay lines.
According to an aspect of the present application, input signal d_1 may be a digital data stream having a data rate of 5 Gbps, 10 Gbps, 20 Gbps, between 1 and 100 Gbps, or between 5 and 50 Gbps, although it should be appreciated that various aspects of the technology disclosed herein may be used with a digital data stream having any bandwidth. \ Each of the two split signals xr and xf has a respective data rate that is lower than the data rate of the input signal d_1. In some embodiments, xr and xf are half-rate signals having a data rate that is substantially half of the data rate in d_1. In one non-limiting example, d_1 has a data rate of 10 Gbps, while xr and xf have data rates of 5 Gbps.
In some embodiments, splitter circuit 320 is configured to operate as a “reverse XOR gate,” such that a logic high at input 322 corresponds to one logic high and one logic low at the two outputs 3241 and 3242, and a logic low at the input 322 corresponds to both of the two outputs 3241 and 3242 having the same polarity. It should be appreciated that in such configuration, a truth table for the splitter circuit 320 between the two outputs 3241, 3242 and the single input 322 would map (00, 01, 10, 11) to (0, 1, 1, 0). As the input switches between 0 and 1, the two outputs change state, 1 bit at a time. For example, for each edge transition, splitter circuit 320 may progress through outputs states (xr, xf) in a repeating sequence of (0,0), (0,1), (1,1), (1,0), returning to (0,0) to repeat the pattern.
An exemplary implementation of a splitter circuit 320 and the relationship between signal waveforms at the input and outputs of the splitter circuit 320 will be discussed in detail below in relation to
Divider circuit 420 shown in
Transistor level circuits for D-latches and inverters are known in the art. Such components may be implemented relatively simply, including using CMOS transistors. A transistor-level schematic for a D-latch, for example may include on the order of 10 transistors. An inverter may be implemented with as few as two transistors. Optionally and for example in a differential circuitry, an inverter may be implemented by a swap of the positive and negative polarity wire, without using any transistors. Divider circuit 420 may thus be implemented with a total of 20-25 transistors, and may be simple to implement and consume low power.
Referring back to
Still referring to
Depending on the initial state at xr and xf, D2FF 420 has two alternative startup modes in response to a data edge received from d_1 at input 422. As shown in
The other split signal xf flips in response to falling edges in input signal d_1. As shown in waveforms 510a-510c in
It should be appreciated that as shown in
It should also be appreciated that as shown in
Referring back to
According to an aspect of the present application, an advantage of delaying a signal using techniques described herein is an improved rise/fall skew (RFS) range. RFS is the difference between rising and falling edge propagation delays. A circuit may be used to adjust relative delays between rising and falling edges in a signal in an operation referred to as rise/fall deskew (RFD). RFD may be used, for example, to modify a single pulse width within a signal stream. According to an aspect, each of delay paths 3301, 3302 in the delay line architecture 300 as shown in
According to an embodiment, input signal d_1 is a 10 Gbps signal and the two split signals are half-rate 5 Gbps signals. A delay line according to aspects of the present application may have a RFD (e.g. xr_r or xr_f vs. xf_r or xf_f edge deskew) range of between −500 and 500 ps. The delay line may have a RRD (e.g. xr_r vs. xr_f edge deskew) range of between −200 and 200 ps. The delay line may have a FFD (e.g. xf_r vs. xf_f edge deskew) range of between −200 and 200 ps. As the xr line processes all the rising edges of the input signal and xf processes all the falling edges of the input signal, RFD range in particular is large, substantially from minus the xr delay line range to plus the xf delay line range, when pulse widening is counted as positive RFD.
One aspect of the present application is related to a method of calibration of the parallel delay paths within the delay line, such as delay line 300 as illustrated in
According to an aspect, delay line 300 may be calibrated while considering its two startup modes. As shown in waveforms 510a-510c and 520a-520c in
An exemplary method for calibrating each of the four edges xr_r, xr_f, xf_r and xf_f will now be discussed with reference to
To calibrate xr_r and xr_f, adjustable delays directed to propagation of rising edge and falling edge in the first delay path 3301 may be tuned, while monitoring the output delayed signal d_2. In some embodiments, the delayed split signal xf′ may be set at a constant level, to allow calibration of xr. Waveforms 610a-610c show that when xf′ is forced to be logic low, the combiner XOR gate 340 would combine a rising edge xr_r with xf′ to generate a rising edge 611 in d_2. Therefore the measured rising edge 611 in d_2 represents a timing delay of rising edge xr_r based on the propagation of xr through first delay path 3301. To calibrate rising edge xr_r, a rising edge propagation delay amount in the delay path 3301 may be adjusted until the monitored rising edge 611 in d_2 is at a desired predetermined timing. Depending on the nature of delay path 3301, any suitable method may be used to adjust its propagation delay amount for rising edges. In an example, a control signal may be sent to the delay path 3301 to indicate a change in rising edge delay amount. The desired predetermined timing for rising edge 611 in d_2 may be a set amount of delay time compared to a known reference, such as the original rising edge 601, although it should be appreciated that any reference timing may be used to calibrate the desired timing for rising edge 611. In one example, the calibration may be relative, i.e. for each edge type such as xr_r, delay settings in the delay path may be adjusted such that the monitored d_2 edge is at a value relative to a reference delay line setting. The reference delay line setting may separately be calibrated by one or more external connections to the delay line circuitry, for example by connecting to external signal generators and oscilloscopes.
Other unique edge types in the delay line may similarly be calibrated using the method described above with respect to calibration of the rising edge xr_r in xr. As shown in waveforms 620a-620c in
Similarly, to calibrate falling and rising edge delays for propagation of xf in the second delay path 3302, the delayed split signal xr′ may be set at a constant logic high (for calibrating xf_r, see waveforms 630a-630c) or a constant logic low (for calibrating xf_r, see waveform 640a-640c). To calibration xf_r, a rising edge propagation delay amount in the delay path 3302 may be adjusted until the monitored falling edge 632 in d_2 is at a desired predetermined timing. To calibration xf_f, a falling edge propagation delay amount in the delay path 3302 may be adjusted until the monitored rising edge 644 in d_2 is at a desired predetermined timing.
According to an aspect of the present application, a full rate delay line can be calibrated by separately calibrating two half rate delay lines.
In some embodiments, feedback path 750 includes a ring loop frequency (RLF) box. The RLF box comprises a ring-oscillator circuit formed by closing an inverting loop around a number of delay elements. Changes in delay of a loop element would result in changes in frequency, allowing precise measurement of timing delays. An exemplary RLF implementation is described in detail in U.S. Pat. No. 9,147,620, the entirety of which is herein incorporated by reference.
Having thus described several aspects of at least one embodiment of this invention, it is to be appreciated that various alterations, modifications, and improvements will readily occur to those skilled in the art.
For example, a splitter was illustrated by a two-way splitter. For an N-way splitter, the splitter may function similarly, distributing each rising and falling edge to a N parallel paths, with each application of a rising or falling edge to a path causing a state change within that path. An N-phase divider where N may be greater than two is known in the art and would be an exemplary generalization of the two-phase divider we have focused on in the description. It would function as an N-way “reverse-XOR”, and at the line exit, signals may be combined with an N-way XOR circuit, also known in the art.
Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention. Further, though advantages of the present invention are indicated, it should be appreciated that not every embodiment of the technology described herein will include every described advantage. Some embodiments may not implement any features described as advantageous herein and in some instances one or more of the described features may be implemented to achieve further embodiments. Accordingly, the foregoing description and drawings are by way of example only.
Various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.
Also, the invention may be embodied as a method, of which an example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.
Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention. Further, though advantages of the present invention are indicated, it should be appreciated that not every embodiment of the invention will include every described advantage. Some embodiments may not implement any features described as advantageous herein and in some instances. Accordingly, the foregoing description and drawings are by way of example only.
Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.
Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” “containing,” “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.
Number | Name | Date | Kind |
---|---|---|---|
4777452 | Hayami et al. | Oct 1988 | A |
5155451 | Gladden et al. | Oct 1992 | A |
5345599 | Paulraj | Sep 1994 | A |
5430337 | Castello et al. | Jul 1995 | A |
5436581 | Oberhauser | Jul 1995 | A |
5977818 | Czarnul et al. | Nov 1999 | A |
6166569 | McQuilkin | Dec 2000 | A |
6246269 | Schuler et al. | Jun 2001 | B1 |
6252441 | Lee et al. | Jun 2001 | B1 |
6526113 | Gutierrez | Feb 2003 | B1 |
6859075 | van der Wagt et al. | Feb 2005 | B1 |
7187742 | Logue et al. | Mar 2007 | B1 |
7671630 | Howe et al. | Mar 2010 | B2 |
8446169 | Marlett et al. | May 2013 | B1 |
8446173 | Faucher et al. | May 2013 | B1 |
8760188 | Gondi et al. | Jun 2014 | B2 |
8779819 | Venditti | Jul 2014 | B1 |
8854108 | Suzuki | Oct 2014 | B1 |
9147620 | van der Wagt et al. | Sep 2015 | B2 |
9231631 | Ke et al. | Jan 2016 | B1 |
9281969 | Gondi et al. | Mar 2016 | B2 |
9397670 | van der Wagt et al. | Jul 2016 | B2 |
9503065 | van der Wagt et al. | Nov 2016 | B1 |
9805822 | Aleksandrowicz | Oct 2017 | B1 |
9887710 | Lim et al. | Feb 2018 | B1 |
10048717 | Chen | Aug 2018 | B1 |
10491436 | Lim et al. | Nov 2019 | B1 |
10554450 | Elzeftawi et al. | Feb 2020 | B2 |
10761130 | van der Wagt et al. | Sep 2020 | B1 |
10942220 | van der Wagt et al. | Mar 2021 | B2 |
20040095701 | Ingino, Jr. | May 2004 | A1 |
20040263204 | Chandler et al. | Dec 2004 | A1 |
20050193356 | Kuekes et al. | Sep 2005 | A1 |
20060010360 | Kojima | Jan 2006 | A1 |
20060238175 | Cho et al. | Oct 2006 | A1 |
20060244479 | Major | Nov 2006 | A1 |
20060256908 | Ludwig | Nov 2006 | A1 |
20060273832 | Matsumoto | Dec 2006 | A1 |
20070126410 | Figoli | Jun 2007 | A1 |
20070229139 | Lin | Oct 2007 | A1 |
20080284466 | Cranford, Jr. et al. | Nov 2008 | A1 |
20090196313 | Ridel | Aug 2009 | A1 |
20100299644 | Kawai | Nov 2010 | A1 |
20110309865 | Cordos | Dec 2011 | A1 |
20120086423 | Dao et al. | Apr 2012 | A1 |
20120158348 | Watanabe et al. | Jun 2012 | A1 |
20130027010 | Groeneweg et al. | Jan 2013 | A1 |
20130342254 | Mazumder | Dec 2013 | A1 |
20140035549 | Hafizi et al. | Feb 2014 | A1 |
20140312865 | Dobkin et al. | Oct 2014 | A1 |
20160065183 | Antonie van der Wagt | Mar 2016 | A1 |
20160112223 | Kitsukawa et al. | Apr 2016 | A1 |
20160173090 | Meinerzhagen et al. | Jun 2016 | A1 |
20160182080 | Vasani et al. | Jun 2016 | A1 |
20160227004 | Conner | Aug 2016 | A1 |
20170155317 | Wang | Jun 2017 | A1 |
20180329440 | Jefremow et al. | Nov 2018 | A1 |
20190074838 | Kitagawa | Mar 2019 | A1 |
20200341059 | van der Wagt et al. | Oct 2020 | A1 |
Number | Date | Country |
---|---|---|
5715525 | May 2015 | JP |
10-0601309 | Jul 2006 | KR |
10-0605498 | Jul 2006 | KR |
10-0618828 | Aug 2006 | KR |
10-0798835 | Jan 2008 | KR |
Entry |
---|
U.S. Appl. No. 16/395,098, van der Wagt et al., filed Apr. 25, 2019. |
U.S. Appl. No. 16/395,104, van der Wagt et al., filed Apr. 25, 2019. |
U.S. Appl. No. 16/395,120, van der Wagt et al., filed Apr. 25, 2019. |
[No Author Listed], LVDS Owner's Manual. Texas Instruments. 4th Edition. 2008. 111 pages, http://www.ti.com/interface/lvds-m-lvds-pecl/technical-documents.html [last accessed: Jul. 17, 2019]. |
Branson, Integrated Tester Pin Electronics. IEEE Design & Test of Computers. 1990;7:4-14. |
Cherry et al., The design of wide-band transistor feedback amplifiers. Proceedings of the Institution of Electrical Engineers. 1963;110(2):375-389. DOI: 10.1049/piee.1963.0050. |
Dettloff et al., A 32mW 7.4Gb/s Protocol-Agile Source-Series-Terminated Transmitter in 45nm CMOS SOI. IEEE International Solid-State Circuits Conference Digest of Technical Papers. Feb. 10, 2010. p. 370-371. DOI: 10.1109/ISSCC.2010.5433825. |
Enz et al., Charge-Based MOS Transistor Modeling. John Wiley & Sons. 2006. Section 4.4.4. p. 41-42. ISBN: 047085541X. |
Ershov et al., EDA software for verification of metal interconnects in ESD protection networks at chip, block, and cell level. 35th Electrical Overstress/Electrostatic Discharge Symposium. Sep. 2013. p. 1-7. |
Esch et al., Near-Linear CMOS I/O Driver With Less Sensitivity to Process, Voltage, and Temperature Variations. IEEE Transactions on VLSI Systems. 2004;12(11):1253-7. DOI: 10.1109/TVLSI.2004.836321. |
Greshishchev et al., A 60-dB Gain, 55-dB Dynamic Range, 10-Gb/s Broad-Band SiGe HBT Limiting Amplifier. IEEE Journal of Solid-State Circuits. 1999;34(12):1914-20. DOI: 10.1109/4.808916. |
Hatamkhani et al., A 10mW 3.6Gbps I/O Transmitter. Symposium on VLSI Circuits. Jun. 2003. p. 97-98. DOI: 10.1109/VLSIC.2003.1221172. |
Knight et al., A Self-Terminating Low-Voltage Swing CMOS Output Driver. IEEE Journal of Solid-State Circuits. 1988;23(2):457-64. DOI: 10.1109/4.1007. |
Kojima et al., 8Gbps CMOS Pin Electronics Hardware Macro with Simultaneous Bi-directional Capability. IEEE International Test Conference. Nov. 2012. p. 1-9. DOI: 10.1109/TEST.2012.6401543. |
Kossel et al., A T-Coil-Enhanced 8.5 Gb/s High-Swing SST Transmitter in 65 nm Bulk CMOS With < -16 dB Return Loss Over 10 GHz Bandwidth. IEEE Journal Solid-State Circuits. 2008;43(12):2905-2920. DOI: 10.1109/JSSC.2008.2006230. |
Laskin, On-Chip Self-Test Circuit Blocks for High-Speed Applications. Thesis submitted for MS of Applied Science Graduate Department of Electrical and Computer Engineering. University of Toronto. 2006. Chapter 2.3. p. 13-16. |
Nauta et al., Analog Line Driver with Adaptive Impedance Matching. IEEE Journal of Solid-State Circuits. 1998;33(12):1992-8. DOI: 10.1109/4.735540. |
O'Reilly, Series-Parallel Generation of m-Sequences. Radio and Electronic Engineer. 1975;45(4):171-6. DOI: 10.1049/ree.1975.0033. |
Sayag et al., Compact Modeling and Comparative Analysis of Silicon-Chip Slow-Wave Transmission lines With Slotted Bottom Metal Ground planes. IEEE Transaction on Microwave Theory and Techniques. 2009;57(4):840-7. DOI: 10.1109/TMTT.2009.2015041. |
Schneider et al., CMOS Analog Design Using All-Region MOSFET Modeling. Cambridge University Press. 2010. Section 1.2.3. p. 7-14. ISBN: 052111036X. |
Tanzawa et al., High-Voltage Transistor Scaling Circuit Techniques for High-Density Negative-Gate Channel-Erasing NOR Flash Memories. IEEE Journal of Solid-State Circuits. 2002;37(10):1318-25. DOI: 10.1109/JSSC.2002.803045. |
Tsividis, Operation and Modeling of the MOS Transistor. Oxford University Press. 2nd Edition. 1999. Section 4.5.2. p. 156-158. ISBN: 0195170146. |
Van Der Wagt et al., 50Gb/s 3.3V Logic ICs in InP-HBT Technology. Symposium on VLSI Circuits Digest of Technical Papers. Jun. 2004. p. 326-329. DOI: 10.1109/VLSIC.2004.1346604. |
Wallinga et al., Design and Analysis of CMOS Analog Signal Processing Circuits by Means of a Graphical MOST Model. IEEE J. Solid-St. Circuits. 1989;24(3):672-80. DOI: 10.1109/4.32024. |
Zheng et al., Capacitive Floating Level Shifter: Modeling and Design. IEEE Region 10 Conference. Nov. 2015. 6 pages. DOI: 10.1109/TENCON.2015.7373013. |
International Search Report and Writen Opinion for International Application No. PCT/US2020/029484, dated Aug. 11, 2020. |
International Search Report and Writen Opinion for International Application No. PCT/US2020/029490, dated Aug. 11, 2020. |
International Search Report and Writen Opinion for International Application No. PCT/US2020/029499, dated Aug. 5, 2020. |
Van Der Wagt et al., Voltage Driver Circuit, U.S. Appl. No. 16/395,098, filed Apr. 25, 2019. |
Van Der Wagt et al., Voltage Driver With Supply Current Stabilization, U.S. Appl. No. 16/395,104, filed Apr. 25, 2019. |
Van Der Wagt et al., Voltage Driver Circuit Calibration, U.S. Appl. No. 16/395,120, filed Apr. 25, 2019. |
Number | Date | Country | |
---|---|---|---|
20200343882 A1 | Oct 2020 | US |