PATTERN FORMING METHOD AND PATTERN FORMING SYSTEM

Abstract

Method of forming a pattern by a nanoimprint technique starts with preparing a mold with nanostructures on its surface. The mold is pressed against a substrate or plate coated with a resin film. The positions of alignment marks formed on the rear surface of the plate coated with the resin film are detected. Thus, a relative alignment between the mold and the plate coated with the resin film is performed.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram schematically illustrating the configuration of a pattern forming system according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a method of forming a pattern using nanoimprinting.

FIG. 3 is a diagram illustrating a method of aligning the rear surface of a wafer in accordance with another embodiment of the invention.

FIG. 4 is a diagram illustrating a method of calibrating alignment in accordance with a further embodiment of the invention.

FIG. 5 is a diagram illustrating a method of forming a pattern in accordance with a yet other embodiment of the invention.

FIG. 6 is a view illustrating mold alignment marks in accordance with a still other embodiment of the invention.

FIG. 7 is a diagram illustrating a method of detecting the positions of mold alignment marks in accordance with a yet further embodiment of the invention.

FIG. 8 is a diagram illustrating a method of applying a pressure by making use of a difference of pressure in accordance with an additional embodiment of the invention.

FIG. 9 is a view illustrating a mold position detector according to a yet additional embodiment of the invention.

FIG. 10 is a diagram illustrating a method of calibrating a mold position detector in a heightwise direction in accordance with other additional embodiment of the invention.

Claims

1. A pattern forming method for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated with a resin film by the use of nanoimprinting, said method comprising the step of: performing a relative alignment between the mold and the plate coated with the resin film by detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film.

2. A pattern forming method as set forth in claim 1, further including the steps of: measuring a distance between the mold and the plate coated with the resin film;stopping the mold immediately before it comes into contact with the plate coated with the resin film;aligning a relative position between the mold and the plate coated with the resin film within a plane in which the nanostructures will be formed; andpressing the mold against the plate coated with the resin film while maintaining the relative position.

3. A pattern forming method as set forth in claim 2, wherein said step of measuring a distance between the mold and the plate coated with the resin film is carried out by illuminating the alignment marks that assume a line-and-space pattern formed on the mold with a beam arising from a light source made of a laser with a given periodic pitch and determining the distance of the mold to the plate coated with the resin film using zeroth-order diffraction light out of diffraction light reflected from the alignment marks.

4. A pattern forming method as set forth in claim 1, further including the steps of: measuring a distance between the mold and the plate coated with the resin film at plural positions;stopping the mold immediately before it comes into contact with the plate coated with the resin film;aligning the relative position between the mold and the plate coated with the resin film within a plane in which the nanostructures will be formed into a given relationship; andpressing the mold against the plate coated with the resin film while maintaining the relative position and securing parallelism between the mold and the plate based on the distance between the mold and the plate measured at the plural positions.

5. A pattern forming method as set forth in claim 1, wherein the mold is pressed against the plate according to a difference of pressure produced between above and below the mold.

6. A pattern forming method as set forth in claim 1, wherein positions on a front surface of the plate which correspond to positions on a rear surface of the plate are detected by finding a phase difference (φ) between beams of light illuminating at least two points of the alignment marks formed on the rear surface of the plate.

7. A pattern forming system for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated which a resin film by the use of nanoimprinting, said pattern forming system comprising: means for pressing the mold against the plate coated with the resin film; andmeans for performing a relative alignment between the mold and the plate coated with the resin film within a plane in which the nanostructures will be formed by detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film.

8. A pattern forming system as set forth in claim 7, further including: means for measuring a distance between the mold and the plate coated with the resin film; andmeans for applying a load while maintaining the position of the mold relative to the plate coated with the resin film within the plane in which the nanostructures will be formed.

9. A pattern forming system as set forth in claim 8, wherein the means for measuring a distance between the mold and the plate coated with the resin film are provided in plural locations, and wherein there is further provided means for applying a load while maintaining the mold and the plate coated with the resin film in a parallel relationship and maintaining the position of the mold relative to the plate coated with the resin film within the plane in which the nanostructures will be formed.

10. A pattern forming system as set forth in claim 7, wherein the means for pressing the mold against the plate coated with the resin film applies pressure by making use of a difference of pressure produced between above and below the mold.

11. A pattern forming system for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated which a resin film, said pattern forming system comprising: a plate stage for holding the plate coated with the resin film;stage-driving means capable of moving the plate stage into a given position;a mold stage for holding the mold;rear surface position detectors for detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film;a mold position detector for detecting a position of a plane in which the nanostructures will be formed on the mold; andmeans for performing a relative alignment between the plate and the mold based on results of the detections performed by the rear surface detectors and mold position detector.

12. A pattern forming system as set forth in claim 11, wherein the mold position detector has a function of detecting a position of the mold in a heightwise direction.

13. A pattern forming system as set forth in claim 11, wherein (A) the mold has alignment marks for alignment,(B) the alignment marks can be detected optically through the mold, and(C) reflected light from the alignment marks is reflected substantially from the alignment marks and does not transmit through the alignment marks.

14. A pattern forming system as set forth in claim 13, wherein the alignment marks formed on the mold assume a line-and-space pattern.

15. A pattern forming system as set forth in claim 13, wherein a reflective film is formed on the alignment marks that are formed on the mold.

16. A pattern forming system as set forth in claim 11, wherein said mold position detector has (a) means for illuminating the mold with light for position detection,(b) a spatial filter for selecting only ± first-order diffraction light out of diffraction light reflected from the alignment marks formed on the mold in response to the light illuminating the mold, the light being for position detection,(c) a spatial filter for selecting only zeroth-order diffraction light, and(d) an optical element for guiding the +first-order diffraction light and the zeroth-order diffraction light to different means of photodetector.

17. A pattern forming system as set forth in claim 11, wherein there is further provided a chip for calibration, the chip being used to constitute a reference position for the rear surface position detectors and for the mold position detector.

18. A pattern forming system as set forth in claim 11, further comprising: a mold upper part chamber and a stage chamber disposed respectively above and below the mold; andmeans for pressing the mold against the plate by making use of a difference of pressure produced between the upper and lower chambers.

19. A pattern forming system as set forth in claim 11, further comprising: means for measuring a gap between the mold and the plate at plural locations;gap position control means; andload control means.