Patent Application
20070048448
The present invention relates to a method of forming a pattern using a coating solution containing ionic components through a simple process at low cost so that precision of the pattern and transfer efficiency of the pattern are improved.
This application claims priority from Korean Patent Application No. 10-2005-0075193 filed on Aug. 17, 2005 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
Generally, photolithography has been frequently performed using photoresists to form micropatterns used in display devices such as semiconductor circuit devices and LCDs. The photolithography includes coating, exposing, developing, washing, and curing steps. Even though the photolithography has an advantage in that a desired pattern can be precisely formed, it is disadvantageous in that many steps are performed, many types of materials are used to maximize the effect of the photoresist, and the large amount of photoresist is used in processes such as coating.
Recently, studies have been made to develop pattern transfer and pattern formation using a roll printing process in order to avoid the above-mentioned disadvantages of the photolithography. However, the current roll printing process is disadvantageous in that precision of the pattern and transfer efficiency of the pattern are significantly affected by a blanket and a cliché constituting the roll printing device, a characteristic of the coating solution, and the process condition of the roll printing, and that undesirable large images remain after the transfer. Accordingly, there is a need to develop a method of forming a pattern so that the above-mentioned problems are avoided.
[Technical Problem]
As described above, a known technology is problematic in that processability, cost, coating uniformity, and precision required to micropattern a material such as an electronic material are undesirable.
Accordingly, an object of the invention is to provide a method of forming a pattern, which has advantages of a simple process, low cost, and improved coating uniformity, precision, and transfer efficiency.
[Technical Solution]
The invention provides a method of forming a pattern. The method includes a) applying coatings containing an ionic component having a positive or negative electric charge on a first side of a first substrate; b) bringing the first side of the first substrate into contact with an uneven portion of a first side of a second substrate to transfer a portion of the coatings that corresponds to projections of the second substrate from the first substrate onto the second substrate; and c) bringing the first side of the first substrate or the first side of the second substrate into contact with a print object to transfer the coatings onto the print object, wherein an electrode is provided on a second side, of at least one substrate of the first substrate and the second substrate, which is opposite to the first side of the substrate, the electrode on the first substrate is electrified to have the same electric charge as the ionic component of the coatings in step (b) and/or in step (c), and the electrode on the second substrate is electrified to have the electric charge opposite to the electric charge of the ionic component of the coatings in step (b) and/or to have the same electric charge as the ionic component of the coatings in step (c).
The invention provides a method of forming a pattern of coatings. The method includes a) filling the coatings containing an ionic component having a positive or negative electric charge in a groove of a first side of a first substrate; b) bringing a first side of a second substrate into contact with the first side of the first substrate to transfer the coatings filled in the groove of the first substrate onto the second substrate; and c) bringing the first side of the second substrate into contact with a print object to transfer the coatings from the second substrate onto the print object, wherein an electrode is provided on a second side, of at least one substrate of the first substrate and the second substrate, which is opposite to the first side of the substrate, the electrode on the first substrate is electrified to have the same electric charge as the ionic component of the coatings in step (b), and the electrode on the second substrate is electrified to have the electric charge opposite to the electric charge of the ionic component of the coatings in step (b) and/or to have the same electric charge as the ionic component of the coatings in step (c).
The invention provides a method of producing an electronic device using the above-mentioned method of forming the pattern. The method of producing the electronic device includes micropatterning an electronic material.
In connection with this, the electronic device is a component of an electromagnetic recording, imaging, or circuit apparatus.
The invention provides a coating composition for forming a pattern. The coating composition includes 50 to 95 wt. % of an electronic material based on a total weight of the composition, and 5 to 50 wt. % of a cationic or anionic component based on the total weight of the composition.
The electronic material may be selected from the group consisting of an optical ink, a metal solution for wires, a conductive paste, a resist, an adhesive, and a glue.
The cationic component or the anionic component may be one or more selected from the group consisting of a polymer that is polymerized using monovalent or divalent cationic or anionic monomers; a binder polymer selected from the group consisting of a copolymer that is polymerized using nonionic monomers and monovalent or divalent anionic or cationic monomers, and a derivative thereof; an organic or inorganic surfactant containing monovalent or divalent cationic or anionic components; and a monovalent or divalent cationic or anionic dye, a monovalent or divalent cationic or anionic pigment, and a complex thereof.
The invention provides a paste-type coating composition, of either cationic or anionic, for forming a pattern, which is produced by dispersing one or more selected from a conductive organic or inorganic material, alkali metal oxides, or conductive metal powder in a solvent.
As described above, the coating composition for forming the pattern may be the coating composition including the electronic material and the cationic or anionic component, or the paste-type ionic coating composition.
Meanwhile, the invention provides the electronic device having the pattern that is formed using the coating composition for forming the pattern.
Additionally, the invention provides an electronic apparatus including the electronic device.
The invention provides an apparatus for forming a pattern. The apparatus includes a first substrate; a coater provided so that the coater is capable of being moved along a first side of a first substrate by a coater movement device to coat the first side of the first substrate using coatings containing an ionic component having a positive or negative electric charge; a second substrate provided so that the second substrate is capable of being moved in z-, x-, y-, and θ-axis directions based on a surface of the substrate by a substrate movement device to come into contact with the first side of the first substrate and having projections, which are formed on a first side of the second substrate, to which the coatings applied on the first side of the first substrate is transferred using the coater; and an electrode provided on at least one of the first substrate and the second substrate, wherein the first side of the first substrate or the first side of the second substrate comes into contact with a print object to transfer the coatings onto the print object, thereby forming the pattern on the print object.
The invention provides an apparatus for forming a pattern. The apparatus includes a first substrate having a first side on which a groove where coatings containing an ionic component having a positive or negative electric charge are filled is formed; a second substrate provided so that the second substrate is capable of being moved in z-, x-, y-, and θ-axis directions based on a surface of the substrate by a substrate movement device to come into contact with the first side of the first substrate, the second substrate having a first side onto which the coatings filled in the groove of the first substrate are transferred; and an electrode provided on at least one of the first substrate and the second substrate, wherein the coatings filled in the groove of the first substrate are transferred onto the first side of the second substrate, and the first side of the second substrate comes into contact with the print object to transfer the coatings onto the print object, thereby forming the pattern on the print object.
The invention provides an apparatus for forming a pattern. The apparatus includes a first substrate is rotatably provided and has a roll shape; a coater that coats a surface of the first substrate using coatings containing an ionic component having a positive or negative electric charge; a second substrate having a first side, with projections to which the coatings applied on the first substrate are transferred using the coater; and an electrode provided on at least one of the first substrate and the second substrate, wherein the first substrate is rotated while being in contact with the first side of the second substrate to transfer the coatings applied on the surface of the first substrate onto the projections formed on the first side of the second substrate, and the coatings remaining on the first substrate or the coatings attached to the projections of the second substrate comes into contact with the print object to transfer the coatings onto the print object, thereby forming the pattern on the print object.
[Advantageous Effects]
According to the method of the invention, it is possible to very precisely form a pattern with high transfer pattern efficiency. Therefore, in the case of when electronic materials are micropatterned using the method to produce parts of electronic recording, image, and circuit apparatuses, productivity of electronic devices is significantly improved.
FIGS. 1 to 7 illustrate the formation of a pattern using a coating solution containing cationic components according to an embodiment of the invention;
FIGS. 10 to 15 illustrate the formation of a pattern using a coating solution containing cationic components according to another embodiment of the invention;
FIGS. 16 to 21 illustrate the formation of a pattern using a coating solution containing cationic components according to another embodiment of the invention;
1: second substrate electrode
2: second substrate
2
a: first side of the second substrate
2
b: second side of the second substrate
2
c: projection of uneven portion
3: coater
4: print object
4
a: first side of the print object
4
b: second side of the print object
5: print object electrode
6: first substrate electrode
7: first substrate support
8: first substrate
8
a: first side of the first substrate
8
b: second side of the first substrate
9, 9a, 9b, 9c, 9d: coatings
10: cleaning substrate electrode
11: cleaning substrate
12: print object support
13: second substrate support
14: cleaning substrate support
20: support fixing frame
31: first control screw
32: movement support frame
33: second control screw
34: third control screw
35: stepping motor
40: coater mounting frame
41: linear motor
[Mode for Invention]
Hereinafter, the present invention will be described in detail referring to the accompanying drawings. However, the accompanying drawings and the following detailed description are illustrative but not intended to limit the present invention.
A first embodiment of the invention is shown in FIGS. 1 to 7. According to this embodiment, a method of forming a pattern according to the invention includes a) applying coatings 9 containing an ionic component having a positive charge on a first side 8a of a first substrate 8 (see
The coatings 9a, 9b, 9c, and 9d containing the ionic components are formed on the first sides 8a, 2a, and 4a of the first substrate 8, the second substrate 2, and the print object 4, and electrodes 6, 1, and 5 are formed on second sides 8b, 2b, and 4b that are opposite to the first sides 8a, 2a, and 4a.
As shown in
The first substrate 8, the second substrate 2, and the print object 4 may be precisely moved vertically, right and left, and back and forth, and rotate in conjunction with the supports 7, 13, and 12 in order to maintain micro-alignment and flatness.
As shown in
As shown in
As described above, the second substrate 2 and the second substrate support 13 which are combined with each other may slowly move toward or move away from the first substrate 8 or the print object 4 (vertically) using the first movement device. One first control screw 31 is shown in the drawing, but the number of the first control screw 31 is not limited thereto.
As shown in
A substrate movement device which is provided with the first and the second movement devices may further include a stepping motor 35 that is combined with at least one of the first control screw 31, the second control screw 33, and the third control screw 34 to rotate at least one of the first control screw 31, the second control screw 33, and the third control screw 34. The stepping motor 35 is driven to rotate the control screws 31, 33, and 34 so that positions of the second substrate 2 and the second substrate support 13 combined with each other are precisely controlled. Alternatively, the control screws 31, 33, and 34 may be manually rotated. The substrate movement device having the first movement device and the second movement device is not limited to the substrate movement device shown in the drawings.
Additionally, the substrate movement device that moves the second substrate 2 and the second substrate support 13 which are combined with each other may include a right and left movement unit for moving the second substrate 2 and the second substrate support 13, which are combined with each other, right and left, and a vertical movement unit for vertically moving the second substrate 2 and the second substrate support 13 which are combined with each other.
The right and left movement unit may include a frame where the second substrate 2 and the second substrate support 13 combined with each other are provided, and a linear motor that is connected to the frame to move the frame right and left. Alternatively, the right and left movement unit may be a driving arm.
The vertical movement unit may include a motor that generates power to vertically move the frame where the second substrate 2 and the second substrate support 13 combined with each other are provided, and a gear for transferring the power of the motor to the frame. That is, the second substrate 2 and the second substrate support 13 which are combined with each other may be vertically moved using a gear method. Alternatively, the vertical movement unit may include a motor that generates power to vertically move the frame where the second substrate 2 and the second substrate support 13 combined with each other are provided, and a piston that is connected to the frame so as to be movable in a cylinder by the power of the motor. That is, the second substrate 2 and the second substrate support 13 which are combined with each other may be vertically moved by a piston method using pressure. Alternatively, the vertical movement unit may be a driving arm.
Positions of the first substrate 8 and the print object 4 may be controlled through the same procedure as the position control of the above-mentioned second substrate 2, that is, using the device shown in
Furthermore, the positions of the first substrate 8 and the print object 4 may be controlled using the right and left movement unit and the vertical movement unit of the above-mentioned second substrate 2.
The first substrate 8 and the print object 4 may be provided on a support fixing frame 20 that is provided at the position required in the process using the supports 7 and 12.
The support fixing frame 20 functions to support the first substrate 8 and the print object 4 from below, and is capable of being moved in all directions including x-, y-, z-, and θ-axis directions. Thus, it is convenient to simultaneously move the first substrate 8 and the print object 4 by the same distance.
The first substrate 8 and the print object 4 may be moved using a movement device including a conveyer and a driving arm. That is, after the first substrate 8 and the print object 4 are conveyed to the support fixing frame 20 using the conveyer, the first substrate 8 and the print object 4 are provided on the support fixing frame 20 using the driving arm, and fixed to the support fixing frame 20 using a vacuum absorption device. After the coatings 9d are transferred onto the print object 4, the print object 4 is separated from the print object support 12, moved on the conveyer using the driving arm, and conveyed.
In connection with this, a coater 3 for coating the first substrate 8 using the coatings 9 may coat the first substrate 8 using the coatings 9 while being moved by a coater movement device. The coater 3 may coat the first substrate 8 using the coatings 9 while being moved by the coater movement device. As an example of the coater movement device, as shown in
Steps of a method according to a first embodiment of the invention will be described.
In step (a), as shown in
Examples of the coater 3 for applying the coatings 9 include, but are not limited to a capillary-type or slit-type slot coater.
In the first embodiment, the coatings 9 containing the cationic component are used. However, in the invention, both the cationic component and the anionic component may be used as the ionic component contained in the coatings 9. Any material may be used as the coatings as long as the material contains the cationic component or the anionic component.
In the invention, examples of the coatings containing the ionic component include, but are not limited to an optical ink used to form a color filter for TFT-LCD, a metal solution for wires used to form electronic circuits, a functional resin such as a conductive paste or a resist, and an adhesive and a glue capable of satisfying precision patterning.
In the invention, the coatings containing the ionic component may be a coating composition for forming patterns that includes 50 to 95 wt. % of an electronic material based on the total weight of the composition, and 5 to 50 wt. % of a cationic or anionic component based on the total weight of the composition. In order to improve the coatings property of the coatings applied on an upper surface of the first substrate 8, a fluorine- or silicon-based surfactant may be further added as a leveling agent or a wetting agent. Additionally, an adhesion promoter or an antifoaming agent may be further added to improve adhesion strength to the print object 4.
Materials that are extensively applied to electronic machines, for example, resistor materials such as semiconductors and magnetic materials, contact materials, dielectric materials, and conductive materials, may be used as the electronic material. Examples of the electronic material include an optical ink, a metal solution for wires such as PCBs (printed circuit board), a conductive paste, a resist, an adhesive, and a glue.
The cationic component or the anionic component may be one or more selected from the group consisting of a polymer that is polymerized using monovalent or divalent cationic or anionic monomers; a binder polymer selected from the group consisting of a copolymer that is polymerized using nonionic monomers and monovalent or divalent anionic or cationic monomers, and a derivative thereof; an organic or inorganic surfactant containing monovalent or divalent cationic or anionic components; a monovalent or divalent cationic or anionic dye, a monovalent or divalent cationic or anionic pigment, and a complex thereof.
As described above, a coating composition for forming patterns that includes the electronic material and the cationic or anionic component, or a paste-type ionic coating composition for forming patterns may be used as the coating composition for forming the patterns. For example, the paste-type cationic or anionic coating composition for forming the patterns that is produced by dispersing one or more selected from a conductive organic or inorganic material, alkali metal oxides, or conductive metal powder in a solvent may be used. In order to improve the coatings property of the coatings applied on an upper surface of the first substrate 8, a fluorine- or silicon-based surfactant may be further added as a leveling agent or a wetting agent. Additionally, an adhesion promoter or an antifoaming agent may be further added to improve adhesion strength to the print object 4.
In the above-mentioned embodiment, it is preferable that a substrate having relatively lower adsorption strength to the coatings 9 be used as the first substrate 8 as compared to the second substrate 2 or the print object 4. In the case of when the second substrate 2 or the print object 4 is formed of glass, it is preferable that the first substrate 8 be formed of the material having low surface energy such as silicon rubber. In the case of when the hard plastic material, such as polyethylene terephthalate (PET) or nylon, or glass is used, the surface 8a thereof may be coated with hydrophobic material or hydrophobic surface treatment may be performed using the plasma to form the material having the relatively lower adsorption strength to the coatings 9.
Furthermore, the first substrate 8 may include a first layer formed of soft silicon rubber on which the coatings 9a are applied and a second layer formed of hard PET material which comes into contact with the first substrate support 7. The first substrate 8 maybe fixed to the first substrate support 7 including hard material that is little worn, such as stainless steel, by a vacuum adsorption device for fixing wafers. As a representative example of silicon rubber that is capable of being used to produce the first substrate 8, there is polydimethylsiloxane. Further, any elastomer may be used to form the first substrate 8 as long as the elastomer deforms by external force and is restored to the original state after a predetermined time to form a system where energy is conserved like polyurethanes. For example, a PDMS crude liquid and a curing agent are mixed and then cured on a surface plate to produce the first substrate 8. In connection with this, a spin-type or slit-type coater may be used to obtain a constant thickness. Preferably, the blanket has hardness of rockwell C scale 20 to 69 after the curing, and the hardness may be controlled by denseness of a polymer chain which is to be cured, or by changing the amount of polyurethanes added to PDMS in the case of when polyurethanes are added to PDMS.
It is preferable that a first substrate electrode 6 be formed on the second side 8b of the first substrate 8 having the corresponding area to the entire surface of the first substrate 8.
In the above-mentioned embodiment, it is preferable that a substrate having relatively higher adsorption strength to the coatings 9 be used as the second substrate 2 as compared to the first substrate 8. More preferably, the second substrate 2 have the adsorption strength to the coatings 9 between the adsorption strength of the first substrate 8 and the adsorption strength of the print object 4.
Examples of the material of the second substrate 2 include, but are not limited to metal such as aluminum and stainless steel, hard plastic material such as polyethylene terephthalate (PET) or acryl, and a silicon compound such as glass. A pattern having the depth of 0.1 to 100 μm is formed on the second substrate 2. When the pattern is precisely formed, the pattern may be sophisticated. An aspect ratio of the width and the depth of the pattern is preferably 5:1 to 0.01:1. It is difficult to process the pattern and a risk of breaking during the printing is increased as the aspect ratio of the pattern is increased.
In order to control the adsorption strength of the second substrate 2 to the coatings 9 to be within the above-mentioned range, projections 2c of the first side 2a of the second substrate 2 may be subjected to surface reformation using material having the characteristics of silicon- or fluorine-based surfactants or using a hydrophobic or hydrophilic treating process including plasma treatment.
A second substrate electrode 1 is formed on the second side 2b of the second substrate 2. In order to improve precision of the pattern and transfer efficiency of the pattern, it is preferable that the second substrate electrode 1 have the pattern corresponding in shape to the projections 2c of the uneven portion 2c and 2d formed on the first side 2a of the second substrate 2.
As shown in
A coating portion 9b of the coatings 9a formed on the first side 8a of the first substrate 8 is transferred onto the projections 2c of the second substrate 2, and the residual coating portion 9c remains on the first side 8a of the first substrate 8.
In this step, voltage of 5 to 220 V that is typically used as electrodeposition voltage is applied from a power supplier (not shown) to the first substrate electrode 6 of the first substrate 8 so that the first substrate electrode of the first substrate 8 is electrified to have the same electric charge as the ionic component of the coatings 9a, thereby improving transfer efficiency of the coatings 9a from the first substrate 8 on the second substrate 2. Additionally, voltage is applied to the second substrate electrode 1 of the second substrate 2 so that the second substrate electrode 1 is electrified to have the electric charge opposite to the electric charge of the ionic component of the coatings 9a, thereby improving transfer efficiency of the coatings 9a.
Subsequently, as shown in
Accordingly, as shown in
In this step, high voltage is applied to the second substrate electrode 1 of the second substrate 2 so that the second substrate electrode 1 is electrified to have the same electric charge as the ionic component of the coatings 9b, thereby improving transfer efficiency of the coatings 9b on the print object 4. Additionally, high voltage is applied to the print object electrode 5 so that the print object 4 is electrified to have the electric charge opposite to the electric charge of the ionic component of the coatings 9b, thereby improving transfer efficiency of the coatings 9b.
In the invention, the material having the hard surface that is capable of being used as the substrate of electronic materials and display materials, such as glass, and the polymer material that has the flexible surface, such as polyethylene, polypropylene, or polyvinyl, maybe used as the print object 4. Examples of the material of the print object include, but are not limited to a flexible plastic material such as polyester and PET applied to e-papers or flexible displays; a hard plastic material of polyurethane or epoxy applied to substrates of PCBs; or glass.
It is preferable that the pattern of the coatings 9d transferred onto the print object 4 be fixed to the print object 4 using heat curing and/or photocuring processes. If the pattern of the coatings 9d is solidified, the pattern can endure external physical and chemical changes.
When the coatings 9d are fixed to the print object 4, a convection oven, a hot plate, or a UV exposing machine may be used. In the case of when UV (ultraviolet) curing is used, the curing using the UV exposure and baking may be performed to fix the coatings. All processes known in the art may be applied to fix the coatings 9d transferred on the print object 4.
Meanwhile, in the first embodiment, the electrodes 6, 1, and 5 are provided on all of the first substrate 8, the second substrate 2, and the print object 4, which is preferable to improve the precision of the pattern and the transfer efficiency of the pattern. However, even if the electrode is provided on one or more of the first substrate 8, the second substrate 2, and the print object 4, it is possible to improve the precision of the coating pattern and the transfer efficiency of the coating pattern.
In the first embodiment, step (d) of using a cleaning substrate 11 may be further performed to remove the coatings 9c remaining on the first substrate 8 (see FIGS. 5 to 7).
In step (d), as shown in
As shown in
Step (d) and step (c) may be simultaneously performed. While step (d) is performed, high voltage is applied to the first substrate electrode 6 so that the first substrate electrode 6 is electrified to have the same electric charge as the ionic component of the coatings 9c, thereby improving removal efficiency of the coatings 9c.
Additionally, a cleaning substrate electrode 1O may be further provided on a side of the cleaning substrate 11 that is opposite to the side to which the coatings 9c are attached, and a cleaning substrate support 14 may be further provided on the cleaning substrate electrode 10. In connection with this, the cleaning substrate 11 may be attached to the cleaning substrate support 14 in vacuum. Positions of the cleaning substrate 11 and the cleaning substrate support 14 may be controlled using the same procedure as the above-mentioned position control of the second substrate 2, that is, using the device shown in
When step (d) is performed, high voltage is applied to the cleaning substrate electrode 10 so that the cleaning substrate electrode 10 is electrified to have the electric charge opposite to the electric charge of the ionic component of the coatings 9c, thereby improving removal efficiency of the coatings 9c.
Examples of the cleaning substrate 11 may include a substrate that is formed of an inorganic material having relatively high adsorption strength to the coatings 9c, such as glass, or a hard plastic material such as hydrophilically surface-treated PET or acryl. Preferably, the cleaning substrate 11 is formed of glass.
In the invention, Ag, Al, Pd, Au, Cu, Ti, and Ni may be used as the material of the electrode formed on the first substrate 8, the second substrate 2, the print object 4, or the cleaning substrate 11.
The electrodes 6, 1, 5, and 10 that are formed on the second sides 8b, 2b, and 4b of the first substrate 8, the second substrate 2, the print object 4, or the cleaning substrate 11 may be formed using processes such as thermal evaporation, E-beam evaporation, sputtering, and chemical vapor deposition (CVD).
Additionally, in the case of when the second substrate electrode 1 having the corresponding shape to the uneven portion 2c and 2d is formed on the second side 2b of the second substrate 2 including the first side 2a having the uneven portion 2c and 2d, the formation may be performed by thermal evaporation using a mask, E-beam evaporation, sputtering, chemical vapor deposition, or negative- or positive-type photolithography.
However, the invention is not limited to the above-mentioned electrode materials and formation processes, and the materials and the processes known in the art may be used.
The electrification of the electrodes may be performed using the process known in the art so that the electrodes have the electric charge that is identical or opposite to the coatings. For example, the electrification may be controlled using a controller.
The first substrate electrode 6 is connected to a high voltage power supplier (not shown) to which a switch is connected to control the power supply so as to form a first circuit. Additionally, the second substrate electrode 1 is connected to another high voltage power supplier to which a switch is connected to control the power supply so as to form a second circuit.
In the case of when the first circuit including the first substrate electrode 6 and the second circuit including the second substrate electrode 1 are independently formed, the switch of the first circuit and the switch of the second circuit are turned off so that the first circuit and the second circuit act as open circuits in step (a) shown in
In the case of when the coatings 9a contain the cationic component, the direction of the current flow is controlled so that the second substrate electrode 1 has the negative electric charge and the first substrate electrode 6 has the positive electric charge.
Meanwhile, in the case of when the coatings 9a contain the anionic component, the direction of the current flow is controlled so that the second substrate electrode 1 has the positive electric charge and the first substrate electrode 6 has the negative electric charge.
Alternatively, both the electrodes 6 and 1 may be connected to one high voltage power supplier to which the switch is connected to control the power supply so as to form a single circuit.
In the case of when the second substrate electrode 1 and the first substrate electrode 6 form the single circuit, the switch is turned off so that the single circuit acts as the open circuit in step (a) shown in
In connection with this, in the case of when the coatings contain the cationic component, the direction of the current flow is controlled so that the second substrate electrode 1 has the negative electric charge and the first substrate electrode 6 has the positive electric charge. In the case of when the coatings 9 contain the anionic component, the direction of the current flow is reversely changed.
Furthermore, in the step of transferring the pattern which is transferred onto the first substrate 8 or the second substrate 2 on the print object 4 and in the step of transferring the coatings which remain on the first substrate 8 or the second substrate 2 onto the cleaning substrate 11, the print object electrode 5 and/or the cleaning substrate electrode 10 may be electrified so as to have the negative or positive electric charge using the above-mentioned process.
A second embodiment of the invention is shown in
A third embodiment of the invention is shown in FIGS. 10 to 15. In the embodiment, the method of forming the pattern according to the invention includes a) applying the coatings containing the ionic component having the positive electric charge on the first side of the first substrate (see
In the third embodiment, the electrodes are provided on the first substrate, the second substrate, and the second side of the print object that is opposite to the first side thereof. However, the invention is not limited thereto, and effects of the invention can be obtained even though the electrodes are provided on at least one of the first substrate, the second substrate, and the print object.
The third embodiment is the same as the above-mentioned first embodiment except that the coatings are directly transferred from the first substrate onto the print object in step (c). In the third embodiment, high voltage is applied to the first substrate electrode so that the first substrate electrode is electrified to have the same electric charge as the ionic component of the coatings in step (c), thereby improving transfer efficiency.
The above-mentioned first to third embodiments show the case of when the first substrate and the second substrate are a flat plate. However, in the invention, the first substrate and/or the second substrate may have the roll shape. However, the use of the flat plate may still more improve the precision of the pattern, transfer efficiency of the pattern, and the pattern forming rate.
A fourth embodiment of the invention is shown in FIGS. 16 to 21. The fourth embodiment is the same as the above-mentioned first embodiment except that the first substrate has the roll shape.
The method according to a fifth embodiment of the invention includes a) filling the coatings containing the ionic component having the positive or negative electric charge in the groove of the first side of the first substrate, b) bringing the first side of the second substrate into contact with the first side of the first substrate to transfer the coatings filled in the groove of the first substrate onto the second substrate, and c) bringing the first side of the second substrate into contact with the print object to transfer the coatings from the second substrate onto the print object. The electrode is provided on the second side of at least one of the first substrate and the second substrate that is opposite to the first side thereof.
The electrode provided on the first substrate may be electrified so as to have the same electric charge as the ionic component of the coatings in step (b). Additionally, the electrode on the second substrate maybe electrified so as to have the electric charge opposite to the electric charge of the ionic component of the coatings in step (b) and/or to have the same electric charge as the ionic component of the coatings in step (c).
In the fifth embodiment, the electrodes may be provided on all of the first substrate, the second substrate, and the print object. However, the precision of the coating pattern and the transfer efficiency of the pattern can be improved even though the electrodes are provided on at least one of the first substrate, the second substrate, and the print object. A portion of this embodiment that is not mentioned may be realized referring to the corresponding description of the first embodiment.
Examples of the optimum device that is capable of being applied to the invention may include a device for selectively coating a sealant that is used in a color filter process for LCDs (liquid crystal display), a TFT (thin film transistor) circuit process for LCDs, a PDP (plasma display panel) filter process, a PDP upper and lower plate electrode process, a device for producing a PDP partition, a catalyst micropatterning device for electrochemical deposition, a transfer device for semiconductors, a selective hydrophilic and hydrophobic treatment device, a flexible display, or an E-paper.
In the invention, micropatterns that are used in electronic materials are efficiently transferred using the above-mentioned processes to produce parts of circuit apparatuses such as wires, display devices such as LCDs, OLEDs, PDPs, E-papers, and flexible displays, electromagnetic recording devices, and circuit apparatuses such as wires.
According to the method of the invention, it is possible to significantly improve the precision of the pattern and the transfer efficiency of the pattern.
In the method of the invention, in the case of when the substrate used to form the coating pattern does not have the roll shape but the flat plate shape, a native stone such as marble, an inorganic material such as ceramics, or stainless steel that is little deformed by gravity or the load thereof is processed to form a thin structure, thereby producing the supports 7, 13, and 12 of the substrate. Accordingly, durability of the substrate may be still more improved. In the marble or ceramics, there is no deformation unlike metal or polymer material.
Furthermore, in the method of the invention, in the case of when the substrate does not have the roll shape but the flat plate shape, it is preferable that the surfaces come into vertical contact with the substrate. Further, in the case of when the substrate does not have the roll shape but the flat plate shape, it is preferable that uniform pressure (10−2 to 103 Mpa) be applied to the contact surfaces of the first substrate and the second substrate, or the contact surfaces of the first substrate or the second substrate and the print object. In the case of when the first substrate and the second substrate having the uneven portion are pressed at excessively high pressure, the first substrate may come into contact with the bottom of the second substrate having the uneven portion. The dissolution regarding determination of the pressure must be 1/1000 or more of the allowable minimum pressure. When the first substrate comes close to the second substrate, or when any one of the first substrate and the second substrate comes close to the print object, it is preferable to perform the pressing while alignment is precisely performed using the pressure.
In this case, it is possible to form the uniform coating pattern having the high precision on the print object. In the invention, electrical and optical compression sensing processes may be performed to apply uniform pressure to the entire contact surface.
With respect to the electric process, a piezodielectric sensor[piezodielectric transducer(PZT) or piezodielectric quartz crystal] may be used. For example, the piezodielectric sensor or a laser interferometer is provided on at least two portions, and preferably three portions, of the first substrate and the second substrate to electrically convert the pressure resulting from the pressing, thereby applying the uniform pressure to the entire contact surface.
Additionally, with respect to the optical process, the laser interferometer may be used. For example, the piezodielectric sensor or the laser interferometer may be provided on at least two portions, and preferably three portions, of the first substrate and the second substrate to apply the uniform pressure to the entire contact surface. In the case of the laser interferometer, an access distance may be set to the nanometer (nm) level. The access distance of a few tens nanometers may be detected using a Moire pattern in the laser interferometer. Detection precision is increased as an interval of precision gratings having the cycle used in interference is reduced.
According to the method of the invention, it is possible to precisely form the uniform pattern of the coatings on the large surface. The above-mentioned piezodielectric sensor and the laser interferometer have not been used in the art. However, the a piezodielectric sensor and the laser interferometer, which are typically used in industrial processes of other fields, may be applied to the method of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2005-0075193 | Aug 2005 | KR | national |
