1. Field of the Invention
The present invention relates to a perforation arrangement through which individual substrates are to be divided from aggregate substrate and to aggregate substrate having the perforation arrangement.
2. Description of the Related Art
The aggregate substrate 1 can be divided into individual substrates 2 by bending it aggregate substrate along the perforations after parts have been mounted on the individual substrates 2. Therefore, stress is applied by the bending to the parts mounted around the perforation. Thus, it is important to reduce the stress applied to the periphery of the perforations 5 when being divided into individual substrates 2 in order to prevent a large amount of stress from being applied to the mounted parts.
A certain level of strength is required for the perforations 5 through which individual substrates 2 are connected in the aggregate substrate 1. The higher the strength is, the greater the amount of stress required is at the time of dividing through the perforations 5.
The centers of a number of small holes 5a are aligned in a straight line in a perforation 5 so that webs remained between the holes of the perforation 5 can be broken at the same time, and therefore, such a problem arises that the generated stress is high.
In Japanese Unexamined Patent Publication H7 (1995)-326828, auxiliary perforation is formed so as to be approximately parallel to the perforations. The auxiliary perforation is not intended to contribute to divide individual substrates from each other, but for preventing cracks created from a perforation from extending to a circuit pattern, and thus do not contribute to stress reduction when the individual substrates are divided from each other.
In view of the above-described problem with the prior art, an object of the present invention is to provide a perforation arrangement along which individual substrates can be divided from aggregate substrate by bending the aggregate substrate with a smaller force, and to provide aggregate substrate having such a perforation arrangement.
The present invention provides a perforation arrangement formed of a number of small holes provided in connection portions for connecting individual substrates to each other in aggregate substrate, and in the perforation arrangement, the centers of the small holes are not aligned in a straight line. Thus, the perforation arrangement is characterized in that the centers of the small holes are arranged in an arc form or a V shape.
The present invention also provides aggregate substrate where a perforation formed of a number of small holes is provided in connection portions for connecting individual substrates to each other in aggregate substrate, and the aggregate substrate is characterized in that the centers in the perforations are not aligned in a straight line. Thus, the perforations are characterized in that the centers of the small holes are arranged in an arc form or a V shape.
The present invention can provide a perforation arrangement along which individual substrates can be divided from aggregate substrate by bending the aggregate substrate with a smaller force, and can provide aggregate substrate having such a perforation arrangement.
The above-described and other objects and features of the present invention will be clarified from the following descriptions of the embodiments in reference to the accompanying drawings, from among which:
The preferred embodiments of the present invention will be described below with reference to the drawings. Here, the same symbols are attached to the components that are similar to those in the prior art for description. In aggregate substrate 1, a number of individual substrates are connected through connection portions in the same manner as in the prior art.
The small holes 25a are arranged in or in proximity to the connection portion 24 in such a manner that the distance of the center of each small hole 25a from the line segment between the facing ends 23a of the slits is different. The perforation 25 has such a perforation arrangement that the individual substrates 22 are connected to each other in the aggregate substrate 1 through the perforation, and the centers of the small holes 25a thereof are arranged in an arc form, and thus are arranged so as not to be aligned in a straight line connecting the ends of the slits.
Slits 33 are provided between individual substrates 32 in aggregate substrate 1. A perforation 35 formed of a number of small holes 35a is provided in or in proximity to a connection portion 34 between slits 33.
The small holes 35a are arranged in or in proximity to the connection portion 34 in such a manner that the distance of the center of each small hole 35a from the line segment between the facing ends 33a of the slits is different. In the perforation 35, the centers of the small holes 35a are arranged in a V shape so as not to be aligned in a straight line.
According to the present invention, the amount of stress concentrated on a perforation can be reduced, and therefore, the amount of stress applied to the parts mounted around the perforation can also be reduced in the case where aggregate substrate is bent to be divided. The perforation arrangement has such a form that holes are not aligned in a straight line, and thus, connection webs in a perforation can be prevented from breaking all at once when the substrate is bent to divide along the perforation. All the connection webs do not crack at the same time, and therefore, the amount of stress can be reduced.
The perforation arrangement according to the present invention is not limited to any of the embodiments in
Though the preferred embodiments of the present invention are described in the above, the present invention is not limited to the above-described embodiments, and any appropriate modification can be applied or the invention can be implemented in other variations.
Number | Date | Country | Kind |
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2015-168220 | Aug 2015 | JP | national |