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Arrangements for reducing stress or warp in rigid printed circuit boards

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Industry

  • CPC
  • H05K1/0271
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards
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