Arrangements for reducing stress or warp in rigid printed circuit boards

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CPC
H05K1/0271

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device with slim control assembly
- Patent number 12,313,943
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Moonyoung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device mountable in an electrical motor and method for m...
- Patent number 12,301,069
- Issue date May 13, 2025
- Melexis Bulgaria Ltd
- Dirk Leman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and vehicle camera
- Patent number 12,267,948
- Issue date Apr 1, 2025
- LG Innotek Co., Ltd
- Sang Yeal Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed wiring board and battery wiring module
- Patent number 12,267,950
- Issue date Apr 1, 2025
- Sumitomo Electric Printed Circuits, Inc.
- Shuji Hahakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMC filter for a control device
- Patent number 12,245,362
- Issue date Mar 4, 2025
- Robert Bosch GmbH
- Rupert Fackler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for forming the same
- Patent number 12,238,863
- Issue date Feb 25, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illuminated keyboard and backlight module thereof
- Patent number 12,232,251
- Issue date Feb 18, 2025
- Chicony Electronics Co., Ltd.
- Chia-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring and surface packaging assembly
- Patent number 12,232,250
- Issue date Feb 18, 2025
- Huawei Technologies Co., Ltd.
- Chuncheng Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for implementing multipurpose screw h...
- Patent number 12,213,241
- Issue date Jan 28, 2025
- Meta Platforms Technologies, LLC
- Qiuming Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board
- Patent number 12,213,254
- Issue date Jan 28, 2025
- JESS-LINK PRODUCTS CO., LTD.
- Yu-Liang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with reduced height and reduced width, camer...
- Patent number 12,207,396
- Issue date Jan 21, 2025
- Rayprus Technology (Foshan) Co., Ltd.
- Han-Ru Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic apparatus
- Patent number 12,199,009
- Issue date Jan 14, 2025
- Kioxia Corporation
- Kazuyuki Matsuzaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer body
- Patent number 12,193,153
- Issue date Jan 7, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit assemblies including metallic bars
- Patent number 12,185,454
- Issue date Dec 31, 2024
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,177,971
- Issue date Dec 24, 2024
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light board, method for manufacturing the same, and LED backlight m...
- Patent number 12,177,966
- Issue date Dec 24, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Xinghan He
- F21 - LIGHTING
Information Patent Grant
Implantable medical device with relative motion control
- Patent number 12,172,022
- Issue date Dec 24, 2024
- Cardiac Pacemakers, Inc.
- Joel Becklund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including stacked printed circuit boards
- Patent number 12,156,326
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seungbo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,127,336
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Takahito Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,127,335
- Issue date Oct 22, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Jhen Ciou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE AND VEHICLE CAMERA
- Publication number 20250227838
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- SANG YEAL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...
- Publication number 20250212320
- Publication date Jun 26, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERSONAL ANOMALY DETECTION METHODS AND APPARATUS
- Publication number 20250211965
- Publication date Jun 26, 2025
- Ouraring, Inc.
- Denis MARS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250203761
- Publication date Jun 19, 2025
- LG Innotek Co., Ltd.
- Duck Hoon PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194001
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moon JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194004
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ELECTRONIC COMPONENT
- Publication number 20250191845
- Publication date Jun 12, 2025
- Murata Manufacturing Co., Ltd.
- Tatsunori YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250185158
- Publication date Jun 5, 2025
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250185157
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Suguru KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250168981
- Publication date May 22, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20250151207
- Publication date May 8, 2025
- Shanghai AVIC Optoelectronics Co., Ltd.
- Akira FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...
- Publication number 20250142735
- Publication date May 1, 2025
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250126703
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250125270
- Publication date Apr 17, 2025
- ABSOLICS INC.
- Chae Mook LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION
- Publication number 20250120008
- Publication date Apr 10, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250120009
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250120014
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...
- Publication number 20250112144
- Publication date Apr 3, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH STIFFENER
- Publication number 20250106984
- Publication date Mar 27, 2025
- KYOCCERA CORPORATION
- Suguru KADOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250106985
- Publication date Mar 27, 2025
- Innolux Corporation
- Ju-Li Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250105091
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Kazuyuki MATSUZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Arrangements for reducing stress or warp in rigid printed circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device with slim control assembly

Wiring substrate

Electronic device mountable in an electrical motor and method for m...

Multilayer resin substrate and electronic component

Camera module and vehicle camera

Flexible printed wiring board and battery wiring module

Wiring board

EMC filter for a control device

Electronic device and method for forming the same

Illuminated keyboard and backlight module thereof

Stiffener ring and surface packaging assembly

Apparatus, system, and method for implementing multipurpose screw h...

Multi-layer printed circuit board

Semiconductor device, circuit board structure and manufacturing met...

Circuit board assembly with reduced height and reduced width, camer...

Electronic apparatus

Multilayer body

Circuit assemblies including metallic bars

Wiring board

Light board, method for manufacturing the same, and LED backlight m...

Implantable medical device with relative motion control

Method of forming a flexible electronics assembly

Electronic device including stacked printed circuit boards

Hermetic metallized via with improved reliability

Thermosetting resin composition for semiconductor package, prepreg...

Maintaining the shape of a circuit board

Wiring circuit board

Electronic device

Resin multilayer substrate and method for manufacturing resin multi...

Bent laminated printed circuit board

Patents Applicationslast 30 patents

CAMERA MODULE AND VEHICLE CAMERA

METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

PERSONAL ANOMALY DETECTION METHODS AND APPARATUS

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CHIP ELECTRONIC COMPONENT

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

WIRING BOARD

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

WIRING BOARD WITH STIFFENER

NANOTWIN LINER FOR THROUGH GLASS VIAS

ELECTRONIC DEVICE

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

ELECTRONIC APPARATUS

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION