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Arrangements for reducing stress or warp in rigid printed circuit boards

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250081335
    • Publication date Mar 6, 2025
    • Industrial Technology Research Institute
    • Yi-Rong Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DAMPING STRUCTURE
    • Publication number 20250071888
    • Publication date Feb 27, 2025
    • Apple Inc.
    • Shawn X. ARNOLD
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071887
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • In Gun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS AND APPARATUS FOR PRESENCE MONITORING
    • Publication number 20250071536
    • Publication date Feb 27, 2025
    • Ouraring Inc.
    • Denis MARS
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH PASSIVE VIBRATION DAMPING
    • Publication number 20250056714
    • Publication date Feb 13, 2025
    • Continental Automotive Technologies GmbH
    • Ralf Scheib
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250056713
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ho-Jae LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME
    • Publication number 20250056107
    • Publication date Feb 13, 2025
    • LG Innotek Co., Ltd.
    • Sang Yeon HAN
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ASIC BUSBAR WITH REMOTE POWER PHASES FOR TELECOMMUNICATIONS AND NET...
    • Publication number 20250056709
    • Publication date Feb 13, 2025
    • CIENA CORPORATION
    • Daniel Rivaud
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20250048542
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLAT MOUNT COMPONENT
    • Publication number 20250048540
    • Publication date Feb 6, 2025
    • KEITH JON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250048541
    • Publication date Feb 6, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Wei-Jhen CIOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    3D-SHAPED MODULE WITH INTEGRATED DEVICES AND METHOD
    • Publication number 20250040037
    • Publication date Jan 30, 2025
    • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    • Stephan Harkema
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
    • Publication number 20250040038
    • Publication date Jan 30, 2025
    • Samsung Electronics Co., Ltd.
    • Minseok LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
    • Publication number 20250040036
    • Publication date Jan 30, 2025
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • LI-CHUN HUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STIFFENER MEMBER WITH ONE OR MORE VIAS
    • Publication number 20250038085
    • Publication date Jan 30, 2025
    • Avago Technologies International Sales Pte. Limited
    • Walter Dauksher
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE FILM AND MANUFACTURING METHOD THEREOF
    • Publication number 20250029903
    • Publication date Jan 23, 2025
    • SAMSUNG DISPLAY CO., LTD.
    • Ji Ye LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CERAMIC WIRING MEMBER
    • Publication number 20250024592
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...
    • Publication number 20250024593
    • Publication date Jan 16, 2025
    • Phil Geng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Anti-Break Structure for Setting Buffer Sheets at Circuit Board Edges
    • Publication number 20250024591
    • Publication date Jan 16, 2025
    • MEC ADDHEAT (KAIPING) CO., LTD.
    • CHIENCHOU CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERAS FOR SMALL FORM FACTOR DEVICES
    • Publication number 20250013002
    • Publication date Jan 9, 2025
    • Meta Platforms Technologies, LLC
    • Gue Hyung Kwon
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250016912
    • Publication date Jan 9, 2025
    • KYOCERA CORPORATION
    • Takafumi OYOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
    • Publication number 20240422896
    • Publication date Dec 19, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chulmun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
    • Publication number 20240414841
    • Publication date Dec 12, 2024
    • MITSUBISHI MATERIALS CORPORATION
    • Akira Sakurai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT
    • Publication number 20240407080
    • Publication date Dec 5, 2024
    • Micron Technology, Inc.
    • Quang Nguyen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY
    • Publication number 20240404937
    • Publication date Dec 5, 2024
    • Murata Manufacturing Co., Ltd.
    • Sami NURMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SWITCHING BOARD AND SOLDERING METHOD THEREOF
    • Publication number 20240407126
    • Publication date Dec 5, 2024
    • AEWIN TECHNOLOGIES CO., LTD.
    • Cheng-En LIU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR MEMORY SYSTEM
    • Publication number 20240405010
    • Publication date Dec 5, 2024
    • KIOXIA Corporation
    • Hayato MASUBUCHI
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20240397614
    • Publication date Nov 28, 2024
    • Mettler-Toledo GmbH
    • Wendelin Albrecht
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THIN FILM CIRCUIT BOARD
    • Publication number 20240389224
    • Publication date Nov 21, 2024
    • Chipbond Technology Corporation
    • Kung-Tzu Tu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD
    • Publication number 20240381524
    • Publication date Nov 14, 2024
    • Western Digital Technologies, Inc.
    • MyungJin Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR