Patent Application
20070235637
These and other features, aspects, and advantages of the present invention will be better understood through the following description, appended claims, and accompanying drawings. In the explanation of the drawings, identical notation is applied to identical elements and overlapping explanations will be omitted.
A plurality of holes 22 into which an optical fiber is inserted and which open on the distal end surface 21 are arranged in a row in the width-wise direction of the molded article 20 at prescribed intervals. End portions 11a of optical fibers 11 can be inserted in the optical fiber insertion holes 22, and terminal surfaces 11b of the inserted optical fibers 11 are exposed on the distal end surface 21 of the molded article 20.
The distal end surface 21 of the molded article 20 is slanted relative to the axial direction of the optical fiber insertion holes 22. Specifically, the distal end surface 21 gradually recedes from a bottom surface 23 (the surface on which the molded article 20 is mounted on the substrate 40; on the lower side of the example shown in the drawings) to an upper surface 24. The angle between the distal end surface 21 and the bottom surface 23 is thus an acute angle. The angle is preferably 80° or more and 88° or less. The distal end surface 21 is slanted so that the terminal surfaces 11b of the optical fibers 11 that are inserted in the optical fiber insertion holes 22 do not strike and damage an active layer 32 of the photoelectric conversion unit 30 (described hereunder) mounted on the distal end surface 21. The active layer 32 is smaller than the outside diameter of the fiber, and therefore collisions with the active layer 32 of the photoelectric conversion unit 30 can be avoided by forming the distal end surface 21 at a slant.
Electrical wiring 25 is provided on the distal end surface 21 of the molded article 20. The electrical wiring 25 includes: long electrodes 26 that are provided across the entire thickness of the molded article 20; and short electrodes 27 that are provided from the lower end of the molded article 20 so as to terminate near the center in the thickness direction. The long electrodes 26 and short electrodes 27 are provided in pairs to each of the optical fiber insertion holes 22. The long electrodes 26 are positioned beside the optical fiber insertion holes 22, and the short electrodes 27 are positioned below the optical fiber insertion holes 22. Terminal surfaces 26a, 27a on the lower ends of the long electrodes 26 and short electrodes 27 slightly protrude from and are exposed on the bottom surface 23 of the molded article 20. The amount of protrusion is preferably 0.005 mm or more and 0.1 mm or less. The terminal surfaces 26a, 27a of the long electrodes 26 and the short electrodes 27 are plated with metal.
The photoelectric conversion unit 30 is provided with at least one photoelectric conversion element 31. The active layer 32 and a terminal electrode 33 are provided to the mounting surface (the surface on the side of the molded article 20) of the photoelectric conversion element 31. The photoelectric conversion unit 30 is mounted on the molded article 20 such that the active layer 32 of the photoelectric conversion element 31 is held in a position at a location that faces the optical fiber insertion holes 22 and the terminal electrode 33 is electrically connected to the long electrode 26 and the short electrode 27 of the molded article 20.
The photoelectric coupling assembly 10 having the optical fibers 11 inserted into the optical fiber insertion holes 22 is mounted on the substrate 40 in a state where the bottom surface 23 of the molded article 20 contacts with the substrate 40. In this state, the terminal surfaces 26a, 27a of long electrode 26 and short electrode 27, respectively, are soldered and connected to a wiring pattern (not shown) on the substrate 40. The terminal electrode 33 of the photoelectric conversion element 31 and the wiring pattern of the substrate 40 are thereby electrically connected via the electrical wiring 25 of the molded article 20. As a result, the photoelectric conversion element 31 receives drive signals supplied from the substrate 40 and transmits optical signals to the optical fibers 11; alternatively, the photoelectric conversion element 31 converts optical signals from the optical fibers 11 into electrical signals and transmits the signals to the substrate 40.
A method for manufacturing the photoelectric coupling assembly 10 will be described next.
A mold 50 used to form the molded article 20 has an upper die 51 and a lower die 52, as shown in
A height adjustable convexity 57 for regulating the height of the first slide core 55 is provided in a nested configuration to the center of the lower die 52. The convexity 57 supports the first slide core 55 from the lower side during resin injection and forms an adhesive-injection port 28, which is described hereinafter, for injecting an adhesive to fix the optical fibers 11 to the photoelectric coupling assembly 10.
Mutually opposing surfaces of the lower die 52 and the second slide core 56 are molding surface 52a and 56b which are slanted at the same angle as the distal end surface 21 of the molded article 20. Holding holes 52b are formed on the lower die 52 and holding pins 56c are provided to the second slide core 56. The second slide core 56 is positioned to the lower die 52 by inserting the holding pins 56c into the holding holes 52b.
As shown in
The lead 62 has a long lead 64 and a short lead 65 that are alternatingly formed between top long side 63a and bottom long side 63b of a long hole 63. The long lead 64 is formed across the space between the top long side 63a and bottom long side 63b of the long hole 63, and the short lead 65 extends from the lower long side 63b of the long hole 63 to near the center of the long hole 63 in the height direction, where one end thereof terminates. In the lead 62, the center portion of the long hole 63 is a rectangular molded region B that is inserted into the distal end surface 21 of the molded article 20.
Holding holes 66, into which are inserted the holding pins 56c that are formed in the second slide core 56 of the mold 50, are formed at intervals in the height direction on both sides of the lead 62. The holding pins 56c are inserted into the holding holes 66, whereby the wiring plate 60 is held with high precision relative to the mold 50.
In this manner, the cavity 53 for forming the molded article 20 is formed by the upper die 51 and the lower die 52, as shown in
A resin is then injected into the cavity 53. Once the resin has cured, the upper die 51 and the second slide core 56 are separated from the lower die 52 as shown in
The wiring plate 60, which is insert-molded in the distal end surface 21 of the molded article 20, is then cut off at the upper and lower ends of the molded article 20 by a dicing machine. This action will result in a completed molded article 20 that is provided on the slanted distal end surface 21 with a long electrode 26 and a short electrode 27, which is made of the long lead 64 and the short lead 65.
The wiring plate 60 is cut off at lower end of the molding article 20 in a state in which the lower ends of the long lead 64 and the short lead 65 slightly protrude from the bottom surface 23 of the molded article 20. Non-electrolytic plating is then carried out on the terminal surfaces 26a, 27a of the lower ends of the long electrode 26 and the short electrode 27 that protrude from the bottom surface 23 of the molded article 20.
Once the molded article 20 has been insert-molded as described above, the photoelectric conversion unit 30 is mounted on the distal end surface 21, which is the slanted surface of the molded article 20, thereby completing the photoelectric coupling assembly 10. Since the distal end surface 21 of the molded article 20 is a slanted surface in this instance, the active layer 32 of the photoelectric conversion element 31 that is mounted on the distal end surface 21 is also positioned slantwise. Interference between the terminal surfaces 11b of the optical fibers 11 and the active layer 32 can thereby be suppressed when the optical fibers 11 are inserted in the optical fiber insertion holes 22, and damage to the active layer 32 and the optical fibers 11 is prevented.
According to the aforedescribed photoelectric coupling assembly 10 and the method of manufacture thereof, when insert molding is performed, the short lead 65 is supported as a cantilever on the side of the bottom surface 23, which forms an acute angle with the distal end surface 21, and therefore the entire lead 62, which includes the short lead 65, can be bent by the lower die 52 and the second slide core 56. As a result, the short lead 65, which becomes the short electrode 27, is not embedded within the resin and can be readily wired from the bottom surface to the end surface (conversely, if, when insert-molding is performed, the short lead 65 is supported as a cantilever on the side of the upper surface 24, which forms an obtuse angle with the distal end surface 21, the short lead 65 will penetrate into the interior of the cavity 53 without bending along the slant of the distal end surface 21 and will be embedded within the resin that forms the molded article 20). Drive signals are therefore able to be supplied to the photoelectric conversion element 31 via the electrical wiring 25 of the photoelectric coupling assembly 10, and signals can be transmitted from the photoelectric conversion element 31.
The terminal surfaces 26a, 27a of the long electrode 26 and the short electrode 27 are plated with metal. Therefore, the electrodes 26, 27 can be reliably soldered and connected to the circuit pattern of the substrate 40, and the reliability of the connection points can be increased. The electrodes 26, 27 protrude slightly beyond the bottom surface 23 of the molded article 20, and therefore the electrodes are made to contact the circuit pattern of the substrate 40 under pressure-when the photoelectric coupling assembly is mounted on a substrate, allowing the reliability of the connection points to be increased.
The long lead 64 and short lead 65 of the wiring plate 60 are cut by a dicing machine, and therefore cutting accuracy can be improved. The terminal surfaces are cut by using a dicing machine and polished thereby; an extremely favorable surface roughness can accordingly be ensured at the terminal surfaces 26a, 27a of the long electrode 26 and the short electrode 27, which have been made of the long lead 64 and the short lead 65.
The long lead 64 and the short lead 65 of the wiring plate 60 may be cut with a laser or by being punched out with a stamping die. Punching out with a stamping die or cutting with a laser will allow the wiring plate 60 to be readily cut with an adequately reliable degree of accuracy, and will allow productivity to be improved.
The present invention is not limited to the configuration of the embodiments above. For example, a molded article 20A may be also be configured having a transition part 212 between a distal end surface 211 and a bottom surface 231, as shown in
This invention has been described in connection to what are currently considered to be the most practical and preferred embodiments thereof, but is not limited to the disclosed embodiments. However, the invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
The entire disclosure of Japanese Patent Application No. 2006-104203, filed on Apr. 5, 2006, including specification, claims, drawings, and summary, is incorporated herein by reference in its entirety.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2006-104203 | Apr 2006 | JP | national |
