Claims
- 1. A photoresist composition which comprises a sensitizing compound, a resin and, as a light absorber, styryl compound of the general formula (I) or (II): ##STR49## wherein R.sub.1 and R.sub.2 are the same or different and are a hydrogen atom; a C.sub.1 -C.sub.10 alkyl group; a C.sub.1 -C.sub.10 alkyl group substituted with --OH, --CN, --COOH, --SO.sub.3 H, --NHSO.sub.3 H, --Cl, --Br, --F, --I or --COOR.sub.14 in which R.sub.14 is a lower alkyl group; a C.sub.2 -C.sub.10 alkenyl group; a C.sub.2 -C.sub.10 alkenyl group substituted with --OH, --CN, --COOH, --SO.sub.3 H, --NHSO.sub.3 H, --Cl, --Br, --F, --I or --COOR.sub.14 in which R.sub.14 is a lower alkyl group; or ##STR50## in which R.sub.14 ' is a lower alkylene group; R.sub.3 is --OCOR.sub.5 or --OSi(R.sub.5).sub.3 in which R.sub.5 is a lower alkyl group; and n is a number of 2 to 15.
- 2. A composition of claim 1 comprising a compound of the formula ##STR51##
- 3. A composition of claim 1 comprising a compound of the formula ##STR52##
- 4. A composition of claim 1 comprising a compound of the formula ##STR53##
- 5. A composition of claim 1 comprising a compound of the formula ##STR54##
Priority Claims (2)
Number |
Date |
Country |
Kind |
62-332110 |
Dec 1987 |
JPX |
|
63-177752 |
Jul 1988 |
JPX |
|
Parent Case Info
This application is a divisional of copending application Ser. No. 07/290,264, filed on Dec. 27, 1988 not U. S. Pat. No. 5,218,136 issued Jun. 8, 1993, the entire contents of which are hereby incorporated by reference.
US Referenced Citations (6)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0029412 |
Nov 1980 |
EPX |
0231522 |
Dec 1986 |
EPX |
0312950 |
Apr 1989 |
EPX |
61-93445 |
May 1985 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Chem. Abs. 105:216698t (1986) Novel photoresist compositions. |
Divisions (1)
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Number |
Date |
Country |
Parent |
290264 |
Dec 1988 |
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