Claims
- 1. In a presensitized plate, for use in lithography, having a support member with a metal surface and an overlying layer on said metal surface, said layer comprises a photosensitive composition further comprising a diazo compound relative to light, the improvement which comprises employing a diazo compound which has been subjected to treatment prior to preparation of the photosensitive composition, prior to being coated on said metal surface, and prior to imagewise exposure for a time period sufficient to accelerate its light reactivity characteristics thereby improving its relative exposure sensitivity, said treated diazo compound having an absorbance at 375 nm of 0.40-0.79 and at 650 nm of 0.90-2.0, and wherein said treatment comprises (a) heating said diazo compound to a temperature above about 35.degree. C. up to about 120.degree. C., (b) ultraviolet light, (c) laser beam, or (d) electron beam.
- 2. In the lithographic plate of claim 1 wherein said treatment comprises heating said diazo compound to a temperature above about 35.degree. C. up to about 120.degree. C. for a time period sufficient to accelerate its light reactivity characteristics.
- 3. In the lithographic plate of claim 2 wherein the period of heating ranges from about 1 to about 150 hours.
- 4. In the lithographic plate of claim 1 wherein said treatment comprises treatment of the diazo compound with ultra-violet light.
- 5. In the lithographic plate of claim 1 wherein said treatment comprises treatment of the diazo compound with a laser beam.
- 6. In the lithographic plate of claim 1 wherein said treatment comprises treatment of the diazo compound with an electron beam.
- 7. In a presensitized plate for use in lithography, having a support member with an aluminum surface and an overlying layer on said aluminum surface, said layer comprising a photosensitive composition further comprising a diazo compound reactive to light to define printing and non-printing areas, the improvement which comprises heating said diazo compound, prior to preparation of the photosensitive composition, prior to being coated on said aluminum surface, and prior to imagewise exposure, to a temperature of from above about 35.degree. C. up to about 120.degree. C. for about 1 to about 150 hours whereby the light reactivity characteristic of the diazo compound has been accelerated thereby improving its relative exposure sensitivity, said treated diazo compound having an absorbance at 375 nm of 0.40-0.79 and at 650 nm of 0.90-2.0.
- 8. In the lithographic plate of claim 7 wherein the diazo compound is a salt of the condensation product of formaldehyde with p-diazodiphenylamine.
- 9. In the lithographic plate of claim 7 wherein the diazo compound is a salt of the condensation product of formaldehyde with 4'-diazo-p-methoxydiphenylamine.
- 10. In the lithographic plate of claim 7 wherein the diazo compound is a salt of the condensation product of formaldehyde with 4-diazo-2,5-dimethoxy-4'-methyldiphenylsulfide.
- 11. In a process for preparing a presensitized plate, for use in lithography, by applying to a support member with a metal surface an overlying coating of a photosensitive composition comprising a diazo compound reactive to light to define printing and non-printing area, the improvement which comprises subjecting the diazo compound to treatment prior to preparation of the photosensitive composition, prior to being coated on said metal surface, and prior to imagewise exposure to accelerate its reactivity in the presence of light thereby improving its relative exposure sensitivity, said treated diazo compound having an absorbance at 375 nm of 0.40-0.79 and at 650 nm of 0.90-2.0, and wherein said treatment comprising (a) heating said diazo compound to a temperature above about 35.degree. C. up to about 120.degree. C., (b) ultraviolet light, (c) laser beam, or (d) electron beam.
- 12. In the process of claim 11 wherein said support metal surface is aluminum.
- 13. In the process of claim 11 wherein the treatment comprises heating the diazo compound to a temperature of above about 35.degree. C. up to about 120.degree. C., for a period of time sufficient to accelerate its light reactivity characteristics.
- 14. In the process of claim 13 wherein the period of heating ranges from about 1 to about 150 hours.
- 15. A method of accelerating the reactivity of a photosensitive diazo compound and improving its relative exposure sensitivity to light which comprises heating said diazo compound to a temperature of from above about 35.degree. C. to about 120.degree. C., for about 1 to about 150 hours prior to exposing said diazo compoud to light, prior to formulating a photosensitive composition with said diazo compound, and prior to coating said diazo compound on a metal substrate, said heating diazo compound having an absorbance at 375 nm of 0.40-0.79 and at 650 nm of 0.90-2.0.
Parent Case Info
This application is a continuation of Ser. No. 510,456, filed July 1, 1983, now abandoned; which was a continuation of Ser. No. 388,046, filed June 14, 1982, now abandoned; which in turn was a continuation of Ser. No. 173,229, filed July 28, 1980, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (1)
| Number |
Date |
Country |
| 956337 |
Apr 1964 |
GBX |
Continuations (3)
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Number |
Date |
Country |
| Parent |
510456 |
Jul 1983 |
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| Parent |
388046 |
Jun 1983 |
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| Parent |
173229 |
Jul 1980 |
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