Processing of workpieces, such as semiconductor wafers, using an RF plasma requires that the output impedance of the RF generator be matched to the load impedance presented by the plasma and reactor chamber. The load impedance tends to vary during processing of the workpiece, due to fluctuations of the plasma in the reactor chamber. Fluctuations in load impedance create fluctuations in the RF power delivered to the plasma and RF power reflected back to the RF generator. As RF impedance mismatch increases, the amount of RF power that is reflected back to the RF generator increases, while the amount of RF power delivered to the plasma decreases. Such fluctuations change the plasma conditions and therefore affect the plasma processing of the workpiece, making it difficult to control process parameters, such as (for example) etch rate or deposition rate, etc. Therefore, in order to maintain process control, a plasma reactor typically employs a dynamic impedance match circuit connected between the RF generator and the RF power applicator of the reactor chamber. A dynamic impedance match circuit is employed because it is capable of responding to changes in the plasma load impedance that would otherwise create an unacceptably large impedance mismatch. A dynamic impedance match circuit responds to changes in measured reflected RF power by changing reactances of various reactive components constituting the RF match circuit in such a manner as to minimize the amount of RF power reflected back to the RF generator. These changes are determined by a complex gradient-based algorithm involving gradient searching. Such an algorithm responds to sensed reflected RF power at the RF generator as a feedback control signal to govern the impedance match circuit.
The RF power applicator may be an electrode or a coil antenna, for example. The electrode may be at the reactor chamber ceiling or may be an internal electrode within a workpiece support, or the electrode may be any other part or wall of the reactor chamber. There may be plural RF power applicators of the reactor chamber, with different RF generators of different frequencies coupled to different ones of the RF power applicators through individual dynamic impedance matches.
One problem with dynamic impedance matches is that the gradient-based algorithms they employ must be sufficiently robust to provide optimal control for all of the variable reactive elements of the impedance match circuit that are to be controlled. Such algorithms are necessarily complex, and require a significant amount of time to respond to fluctuations in load impedance. During the time required for the algorithm to respond to a given change in load impedance, the delivered power and plasma conditions may fluctuate in an uncontrolled manner, resulting in at least a slight variation in process conditions (e.g., process rate) from the desired ones. In the past, such temporary variations were acceptable because the variations in process rate were small. However, as device sizes have now been miniaturized to a much greater degree than in the past, it has become more critical to restrict process variations to extremely small amounts. This requires a much faster response that conventional dynamic impedance match circuits are incapable of providing.
An impedance match is provided in a plasma reactor system including a reactor chamber having process gas injection apparatus, an RF power applicator and an RF power generator. The impedance match includes an impedance match circuit coupled between the RF power generator and the RF power applicator, the impedance match circuit including plural reactive elements arrayed in a circuit topology. A reflected power sensing circuit is coupled to the RF power generator. The impedance match further includes plural minimum-seeking loop controllers having respective feedback input ports coupled to receive a reflected RF power signal from the reflected power sensing circuit and respective control output ports coupled to govern reactances of respective ones of the reactive elements. Each one of the plural minimum-seeking loop controllers includes a source of a predetermined time-varying signal, a first transformer for transforming the reflected RF power signal to a transformed reflected RF power signal, a combiner for combining the predetermined time-varying signal with the transformed reflected RF power signal to produce a combined signal, a second transformer for transforming the combined signal to produce a transformed combined signal, and an integrator for integrating the transformed combined signal to produce an output signal to the respective output port.
In one embodiment, each minimum-seeking loop controller is a perturbation-based minimum-seeking controller in which the predetermined time-varying signal is a sine wave signal α[sin(ωt)], the first transformer is a high pass filter; the combiner is a multiplier, the second transformer is a low pass filter, and the integrator provides an integration over time.
In another embodiment, each minimum-seeking loop controller is a sliding scale-based minimum-seeking loop controller, in which the predetermined time-varying signal is a time-increasing ramp signal g(t), the first transformer performs a sign reversal of the reflected RF power signal, the combiner comprises an adder, the second transformer computes a periodic switching function that depends upon the output of the combiner, and the integrator performs an integration over time. This embodiment may include a match criteria processor that hold the loop controller output at its latest value whenever a sufficient impedance match is attained.
So that the manner in which the exemplary embodiments of the present invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. It is to be appreciated that certain well known processes are not discussed herein in order to not obscure the invention.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
An extremely fast minimum-seeking impedance match controller is employed that responds quickly to fluctuations in load impedance. The minimum-seeking impedance match controller is much simpler and faster than conventional gradient-based controllers, and yet is capable of simultaneously controlling any number of variable reactances included in the impedance match circuit.
Referring to
Plasma RF source power is furnished by an RF source power generator 130 through a minimum-seeking impedance match 132 to the RF power applicator 112. Plasma RF bias power may be furnished by an RF bias power generator 134 through a bias impedance match 136 to the internal workpiece support electrode 110. The bias impedance match 136 may be connected to the electrode 110 through a center conductor 138 of a coaxial RF feed 139.
The minimum-seeking impedance match 132 includes an impedance match circuit 140 and plural minimum-seeking loop controllers 142-1, 142-2, 142-3, 142-4. The impedance match circuit 140 includes plural reactive elements (capacitors and inductors) including variable reactive elements 144-1, 144-2, 144-3, 144-4, which may be coupled together in any suitable topology, such as (for example) a pi-circuit as depicted in
The minimum-seeking impedance match 132 senses the level of RF power reflected backward from the source power applicator 112 toward the RF generator 130. This sensing may be performed by a directional coupler 150 or other conventional device capable of sampling reflected RF power. The directional coupler 150 has a power input port 152 and a power output port 154, and introduces minimum insertion loss between the power ports 152, 154. The power ports 152, 154 are connected in series between the RF generator 130 and the impedance match circuit 140. In addition, the directional coupler 150 has a reflected power indicator port 156 providing a measurement signal indicative of the magnitude of reflected RF power traveling back toward the RF generator 130. The measurement signal from the reflected power indicator port 156 is coupled through an optional signal conditioner 158 to inputs of the minimum-seeking loop controllers 142-1 through 142-4. In one embodiment, the reflected power indicator port 156 was provided as an integral part of the RF generator 130 using internal RF voltage and current sensor apparatus within the RF generator 150, eliminating the need for the separate directional coupler 150.
The minimum-seeking bias impedance match 136 includes an impedance match circuit 240 and plural minimum-seeking loop controllers 242-1, 242-2, 242-3, 242-4 etc. The impedance match circuit 240 includes plural reactive elements (capacitors and inductors) including variable reactive elements 244-1, 244-2, 244-3, 244-4, etc., which may be coupled together in any suitable topology, such as (for example) a pi-circuit as depicted in
The minimum-seeking impedance match 136 senses the level of RF power reflected back toward the RF generator 134 by a directional coupler 250 or other conventional device capable of sampling reflected RF power. The directional coupler 250 has a power input port 252 and a power output port 254, and introduces minimum insertion loss between the power ports 252, 254. The power ports 252, 254 are connected in series between the RF generator 134 and the impedance match circuit 240. In addition, the directional coupler 250 has a reflected power indicator port 256 providing a measurement signal indicative of the reflected RF power traveling back toward the RF generator 134. The measurement signal from the reflected power indicator port 256 is coupled through an optional signal conditioner 258 to inputs of each of the minimum-seeking loop controllers 242-1 through 242-4.
Each of the loop controllers 142-1 through 142-4 of
In accordance with a first embodiment, each loop controller is configured to perform a perturbation-based minimum-seeking algorithm. A typical one of the four loop controllers 142-1 through 142-4 is depicted in
The phase relation between two sinusoids Y(t) and αi[sin(ωit)] multiplied by the multiplier 315 is affected by whether the loop controller output xi is above or below a value at which the reflected power Y(t) is minimum. The output of the low pass filter 320 may be viewed as a low frequency or D.C. component of the product of the two sinusoids. This low frequency component (the output of the filter 320), and may be regarded as a function behaving similarly to the derivative of the reflected power Y(t) with respect to the loop controller output xi. The output of the integrator 325 may be regarded as a gradient update based upon this derivative.
As described above, each of the loop controllers 142-1 through 142-4 may be of the same structure, but they are each physically separate from one another and operate independently. Thus, the high pass filter frequency ωHi, the low pass filter frequency ωLi, the perturbation signal frequency ωi and the output xi of one loop controller (i.e., the ith one of the four loop controllers 142-1 through 142-4) differs from that of the other loop controllers.
There are some constraints on the selections of the parameters for each loop controller. Specifically, αi, ωi, ωHi, ωLi and ki are each positive real numbers. Also, the perturbation source frequency ωi should be different in each different loop controller, and should not be harmonically related to the perturbation source frequency of any other loop controller.
In accordance with a second embodiment, each of the loop controllers 142-1 through 142-4 is configured to perform a sliding scale-based minimum-seeking algorithm. A typical loop controller 142 in accordance with this second embodiment is depicted in
A match criteria processor 450 governing a switch 445 determines whether a sufficient impedance match has been attained in accordance with a predetermined criteria. This criteria, for example, may be satisfied by a determination of whether the reflected power Y(t) is less than 3% of the total power, for example. A threshold other than 3% may be employed. If the criteria is not currently met, then the output of the integrator 430 is continuously applied through the switch 445 to output 460 of the loop processor 142 as the loop controller output signal xi. This output signal is also applied as an update to a previous sample memory 440. Otherwise, if the match criteria processor 450 finds that a nearly ideal impedance match has been achieved (e.g., reflected power Y(t) less than some threshold such as 3% of total power), then the current value of the loop controller output xi is stored in a memory 440, updating of the memory 440 is stopped, and the contents of the memory 440 is applied through the switch 445 as a constant value to the loop controller output 460.
The values of ki and αi are real positive numbers that may be determined empirically and may be on the order of about 1 or 10, for example. The slope d/dt(gi(t)) of the sliding scale function gi(t) is selected empirically in accordance with a desired rate of convergence of the loop controller and may be on the order of 0.5, for example. Each of the loop controllers operates independently, and its parameters, ki, αi and d/dt(gi(t)) and output xi are different from those of the other loop controllers.
The loop controllers 142-1 through 142-4 of
An advantage of the extremum seeking control described above is that the calculation of the gradient is performed by two filters, and is therefore inherently fast and accurate. In contrast, traditional approaches require a measurement of the gradient or a numerical calculation of the gradient using finite differences, requiring more computations and resulting in inferior accuracy.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.