This application claims priority to TW Patent Application No. 100148725 filed on Dec. 26, 2011, the contents of which are incorporated by reference herein.
The disclosure generally relates to heat transfer apparatuses typically used in electronic devices, and particularly to a plate type heat pipe with high heat transfer performance.
Heat pipes have excellent heat transfer performance and are therefore effective means for transfer or dissipation of heat from heat sources. Currently, heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers. A heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”). Preferably, a wick structure is provided inside the heat pipe, lining an inner wall of the casing, for drawing the working medium back to the evaporator section after it is condensed at the condenser section. A screen mesh inserted into the casing and held against the inner wall thereof is usually used as the wick structure of the heat pipe.
In operation, the evaporator section of the heat pipe is maintained in thermal contact with a heat-generating component. The working medium contained in the evaporator section absorbs heat generated by the heat-generating component and then turns into vapor. Due to the difference in vapor pressure between the two sections of the heat pipe, the generated vapor moves and thus carries the heat towards the condenser section where the vapor is condensed into condensate after releasing the heat into the ambient environment via, for example, fins thermally contacting the condenser section. Due to the difference in capillary pressure which develops in the wick structure between the two sections, the condensate is then brought back by the wick structure to the evaporator section where it is again available for evaporation.
Typically, the screen mesh is attached to the whole inner wall of the casing from the evaporator section to the condenser section. As a result, a space in the heat pipe for the vaporized working medium to flow through may be inadequate. This leads to a high flow resistance for the working medium, and thereby retards the heat transfer capability of the heat pipe.
Therefore, it is desirable to provide a heat pipe with improved heat transfer capability.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like. The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected.
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The working medium 20 is saturated in the wick structure 30 and is usually selected from a liquid such as water, methanol, or alcohol, which has a low boiling point and is compatible with the wick structure 30. Thus, the working medium 20 can easily evaporate to vapor when it absorbs heat at the evaporator section 102 of the heat pipe 100.
The wick structure 30 is attached to an inner wall of the tube 10. The wick structure 30 extends along an axial direction of the tube 10 from the evaporator section 102 to the condenser section 104. The wick structure 30 is a porous screen mesh structure, and provides a capillary force to drive condensed working medium 20 at the condenser section 104 to flow towards the evaporator section 102 of the heat pipe 100.
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According to the disclosure, a total area of the wick structure 30 is reduced due to the openings being defined in the wick structure 30, thereby increasing a space in the heat pipe 100 for the vaporized working medium 20 to flow therethrough. Therefore, compared with conventional heat pipes, the heat pipe 100 has not only a low flow resistance, but also a large capillary force. These advantages facilitate improving the heat transfer capability of the heat pipe 100.
Table 1 below shows an average of maximum heat transfer rates (Qmax) and an average of heat resistances (Rth) of a conventional mesh type heat pipe and certain of the heat pipes 100 in accordance with the present disclosure. The conventional mesh type heat pipe and the heat pipes 100 in Table 1 all have a thickness of 1 mm. Qmax represents the maximum heat transfer rate of each heat pipe at an operational temperature of 50° C. Rth is obtained by dividing the difference between an average temperature of the evaporator section of the heat pipe and an average temperature of the condenser section of the heat pipe by Qmax.
The average of Rth of the heat pipes 100 with the mesh 31a defining one opening 32a is substantially equal to that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31a defining one opening 32a is significantly more than that of the conventional mesh type heat pipe. The average of Rth of the heat pipe 100 with the mesh 31 defining two openings 32 (i.e., the heat pipe of the first embodiment) is significantly less than that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31 defining two openings 32 is slightly more than that of the conventional mesh type heat pipe. The average of Rth of the heat pipe 100 with the mesh 31c defining three openings 32c and the copper sheet 33 is significantly more than that of the conventional mesh type heat pipe, and the average of Qmax of the heat pipe 100 with the mesh 31c defining three openings 32c and the copper sheet 33 is significantly more than that of the conventional mesh type heat pipe.
The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a plate type heat pipe. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above can be modified within the scope of the claims.
Number | Date | Country | Kind |
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100148725 | Dec 2011 | TW | national |
Number | Date | Country | |
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Parent | 13710482 | Dec 2012 | US |
Child | 15205009 | US |