Information
-
Patent Grant
-
6755723
-
Patent Number
6,755,723
-
Date Filed
Friday, September 29, 200024 years ago
-
Date Issued
Tuesday, June 29, 200420 years ago
-
Inventors
-
Original Assignees
-
Examiners
- Hail, III; Joseph J.
- McDonald; Shantese
Agents
- Brinks Hofer Gilson & Lion
-
CPC
-
US Classifications
Field of Search
US
- 481 41
- 481 287
- 481 288
- 481 296
- 481 307
-
International Classifications
-
Abstract
A polishing head assembly for retaining an object that is subject to polishing with a polishing pad is disclosed. The polishing head assembly comprises a head retainer assembly movably coupled to a wafer carrier head. The head retainer assembly includes a gimbal post and a load suspension plate. The gimbal post and the load suspension plate are operable to transfer a loading force to the wafer carrier head during polishing. The gimbal post also provides gimballing to optimize the position of the object in parallel with the polishing pad. In addition, the load suspension plate provides distribution of the loading force to optimize the flatness of the object during polishing.
Description
FIELD OF THE INVENTION
The present invention relates to planarization of semiconductor wafers using a chemical mechanical planarization technique. More particularly, the present invention relates to a wafer polishing head assembly for use in chemical mechanical polishing/planarization of semiconductor wafers.
BACKGROUND
Semiconductor wafers are typically fabricated with multiple copies of a desired integrated circuit design that will later be separated and made into individual chips. Wafers are commonly constructed in layers, where a portion of a circuit is created on a layer and conductive vias are created to electrically connect the circuit to other layers. After each layer of the circuit is etched on the wafer, an oxide layer is put down allowing the vias to pass through but covering the rest of the previous circuit level. Each layer of the circuit can create or add unevenness to the wafer that is typically smoothed before generating the next circuit layer.
Chemical mechanical planarization (CMP) techniques are used to planarize the raw wafer and each layer of material added thereafter. Available CMP systems, commonly called wafer polishers, often use a rotating wafer carrier head that brings the wafer into contact with a polishing pad rotating in the plane of the wafer surface to be planarized. A polishing fluid, such as a chemical polishing agent or slurry containing micro abrasives is applied to the polishing pad to polish the wafer. The wafer is pressed against the rotating polishing pad and is rotated to polish and planarize the wafer. Another CMP technique uses a linear polisher. Instead of a rotating pad, a moving belt is used to linearly move the pad across the wafer surface. The wafer is still rotated to average out the local variations.
The wafer carrier head holds the wafer in place during the polishing operation. In addition, a down force is typically applied to the wafer carrier head to press the wafer into engagement with the polishing pad. The wafer carrier head may also be coupled to a rotating mechanism so that the wafer can rotate while being pressed against a polishing surface. To obtain uniform polishing and planarization of the wafers, the wafer should be maintained generally parallel with the polishing pad.
A known problem can occur when the wafer is not uniformly pressed against the polishing pad or otherwise fails to be maintained generally parallel therewith. The combination of the rotational force and the down force may cause the wafer to tilt downward into the polishing surface. In addition, application of the predetermined force may cause deformation in the wafer carrier head that causes the wafer to be pressed against the polishing surface unevenly. When these conditions occur, nonuniform planarization and/or polishing may occur.
Prior art methods and systems of preventing nonuniform planarization and/or polishing typically involve modifications to the wafer carrier head that are complicated, add considerable weight and require components that involve specialized machining. Accordingly, there is a need for systems and methods of maintaining the wafer carrier head in a plane generally parallel with the polishing pad when the wafer is pressed against the polishing pad that are simple, lightweight and allow relatively simple modification to reflect process conditions.
BRIEF SUMMARY
To alleviate the disadvantages of the prior art, a polishing head assembly is disclosed that includes a head retainer assembly movably coupled to a wafer carrier head. The wafer carrier head is operable to retain a wafer on a bottom surface. The head retainer assembly includes a gimbal post and a load suspension plate that are operable to control the wafer carrier head. Control of the wafer carrier head maintains the wafer carrier head in a plane generally parallel with the polishing pad when a loading force is applied. The loading force is applied to the head retainer assembly to press the wafer into the polishing pad. The head retainer assembly is operable to transfer the loading force to the wafer carrier head using the gimbal post and the load suspension plate.
In addition to transferring the loading force, the head retainer assembly is also operable to optimize the tilt and the deformation of the wafer carrier head. Optimization of the tilt of the wafer carrier head involves using a ball and socket arrangement to allow the wafer carrier head to gimbal with respect to the head retainer assembly. The determination of the optimal location of a gimbal center that effectively cancels a moment force associated with the moving polishing pad optimizes the tilt of the wafer carrier head. When the wafer on the wafer carrier head is brought into contact with the polishing pad, the moment force can cause the wafer carrier head to tilt and unevenly contact the polishing pad. By adjusting the location of the gimbal center based on testing under process conditions, the tilt of the wafer carrier head can be controlled.
The load suspension plate distributes the loading force that is transferred to the wafer carrier head. Control of the distribution of the loading force controls the deformation of the wafer carrier head. Optimization of the flatness of the wafer may be obtained by controlling the deformation of the wafer carrier head. Adjusting the diameter of the load suspension plate controls the deformation of the wafer carrier head and the wafer thereon. The load suspension plate includes a flat circular plate that contacts a region of the wafer carrier head. By adjusting the diameter of the load suspension plate, the region of contact on the wafer carrier head is correspondingly adjusted. Accordingly, the application of the loading force to the wafer carrier head can be controlled to optimize the uniformity of the contact between the wafer and the polishing pad.
Optimization of the tilt and the deformation of the wafer carrier head results in the maintenance of the wafer in a plane that is parallel to the polishing pad when the loading force is applied to the head retainer assembly. Maintenance of the wafer in the parallel plane provides uniform polishing and planarization of the wafer. Accordingly, closer tolerances in the flatness of the wafer can be achieved and consistency of achieving the tolerances can be maintained. The presently preferred wafer polishing assembly is operable to maintain the parallelism of the wafer using the head retainer assembly thereby avoiding complicated modification of the wafer carrier head.
Other features and advantages of the invention will be apparent from the drawings and the more detailed description of the invention that follows. The foregoing discussion of the presently preferred embodiments has been provided only by way of introduction. Nothing in this section should be taken as a limitation on the following claims, which define the scope of the invention.
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
FIG. 1
is a front view of a portion of a polishing apparatus.
FIG. 2
is a cross section of a presently preferred embodiment of the polishing head assembly illustrated in FIG.
1
.
FIG. 3
is a cross section of a presently preferred load suspension plate that forms part of the polishing head assembly illustrated in FIG.
2
.
FIG. 4
is a cross section of a presently preferred wafer carrier head that forms part of the polishing head assembly illustrated in FIG.
2
.
FIG. 5
is a cross section of another presently preferred embodiment of the polishing head assembly illustrated in FIG.
1
.
FIG. 6
is a cross section of another presently preferred embodiment of the polishing head assembly illustrated in FIG.
1
.
FIG. 7
is a cross section of another presently preferred embodiment of the polishing head assembly illustrated in FIG.
1
.
FIG. 8
is a cross section of another presently preferred embodiment of the polishing head assembly illustrated in FIG.
5
.
FIG. 9
is a cross section of another presently preferred embodiment of the polishing head assembly illustrated in FIG.
6
.
DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS
A presently preferred embodiment of a portion of a wafer polishing apparatus
10
is generally illustrated in FIG.
1
. One example of a wafer polishing apparatus
10
is part of the TERES™ Chemical Mechanical Polishing (CMP) system available from Lam Research Corporation located in Fremont, Calif.
FIG. 1
is a front view of the portion of the wafer polishing apparatus
10
that includes a spindle
12
, a head exchanger assembly
14
, a wafer polishing assembly
16
and a polishing pad
18
.
The wafer polishing apparatus
10
is operable to polish and planarize objects that, in the presently preferred embodiment, are a semiconductor wafer
20
. Other objects such as, for example, quartz crystals, ceramic elements, lenses, glass plates and other wafer like work pieces may also be planarized and polished by the wafer polishing apparatus
10
. The semiconductor wafers
20
, hereinafter referred to as wafers
20
, are circular shaped discs that are separable into individual chips containing integrated circuits. The wafers
20
include a leading edge
22
and a trailing edge
24
and are retained on a bottom face of the polishing head assembly
16
in the presently preferred embodiment. In alternative embodiments, the wafer
20
could be retained on a side or a top face of the polishing head assembly
16
.
The presently preferred wafer polishing apparatus
10
is used in a CMP system to achieve a high accuracy, finished surface on the wafers
20
during processing. Typically, the CMP system receives and processes the wafers
20
through a number of wafer polishing apparatus
10
that provide varying degrees of polishing and planarization. The wafers
20
are retained on the polishing head assembly
16
and transported among one or more of the wafer polishing apparatus
10
.
During the polishing operation, the spindle
12
with the head exchanger
14
fixedly coupled thereto are operable to detachably engage the polishing head assembly
16
. The elongated spindle
12
comprises part of a spindle drive assembly (not shown) that can be, for example, a robot arm, a screw drive mechanism, a pneumatic mechanism or any other device capable of operatively positioning and rotating the spindle
12
. The head exchanger
14
can be any device capable of detachably engaging the polishing head assembly
16
, such as, for example, a tool changer or other similar coupling device. The coupling of the spindle
12
and the head exchanger
14
can be by, for example, bolts, rivets, welding or other similar coupling mechanism capable of forming a rigid connection. Detachable connection of the head exchanger
14
and the polishing assembly
16
can be accomplished by, for example, threaded connection, frictional contact, snap fit or any other coupling mechanism that is capable of forming a rigid, secure, detachable connection.
Following coupling of the head exchanger
14
to the polishing head assembly
16
, the spindle
12
moves the wafer
20
that is retained on the polishing head assembly
16
into contact with the polishing pad
18
. In the presently preferred embodiment, the spindle
12
lowers the wafer
20
to contact a surface of the polishing pad
18
. In alternative embodiments, the spindle
12
may raise or laterally move the polishing head assembly
16
to achieve contact between the wafer
20
and the polishing pad
18
. In addition, the polishing pad
18
may also be operable to move into contact with the wafer
20
. In the presently preferred embodiment, an air bearing (not shown) supports the polishing pad
18
opposite the surface that contacts the wafer
20
. The air bearing fixedly maintains the horizontal position of the polishing pad
18
.
The presently preferred polishing pad
18
represents an endless polishing surface that is operable to move horizontally in the direction indicated by arrow
26
. The polishing pad
18
can be part of, for example, a linear or rotary belt-polishing module (BPM). Movement of the polishing pad
18
provides frictional removal of material from the surface of the wafer
20
using a polishing fluid, such as, for example, a chemical agent or a slurry containing micro abrasives. In addition to the movement of the polishing pad
18
, the spindle
12
also rotates in the direction of arrow
27
to facilitate more uniform material removal from the wafer
20
. Rotation of the spindle
12
causes rotation of the head exchanger assembly
14
, the wafer polishing assembly
16
and the wafer
20
. The spindle
12
also applies a loading force illustrated by arrow
28
that presses the wafer
20
into the polishing pad
18
.
The wafer polishing assembly
16
is operable to transfer the loading force to the wafer
20
. The loading force is controlled to control the rate of material removal from the wafer
20
. The presently preferred wafer polishing assembly
16
is operable to transfer the loading force while maintaining the flatness of the wafer
20
in a plane that is parallel to the rotating polishing pad
18
. The wafer
20
is maintained in the plane parallel to the polishing pad
18
by counteracting the forces created by the contact of the wafer
20
with the rotating polishing pad
18
. The flatness of the wafer
20
is maintained by distributing the loading force applied to the wafer
20
. Maintenance of the flatness of the wafer
20
in the plane parallel to the polishing pad
18
optimizes the uniformity of the contact between the surface of the wafer
20
and the surface of the polishing pad
18
. Uniformity of the contact results in a more consistent rate of material removal from the surface of the wafer
20
that advantageously improves the consistency and flatness of the surface of the wafer
20
.
FIG. 2
illustrates a cross-sectional view of the presently preferred wafer polishing assembly
16
illustrated in FIG.
1
. The wafer polishing assembly
16
includes a head retainer assembly
30
, a wafer carrier head
32
, a plurality of retaining bolts
34
, a plurality of shear pins
36
, a coupler
38
, a slurry barrier ring
40
, a load cell
42
, a gimbal post
44
and a load suspension plate
46
. The wafer carrier head
32
includes a carrier film
48
, a plurality of vacuum and air ports
50
and a wafer retainer ring
52
. During operation, the head retainer assembly
30
works cooperatively with the wafer carrier head
32
to maintain the flatness and parallelism of the wafer
20
(illustrated in
FIG. 1
) as previously discussed.
The head retainer assembly
30
is movably coupled to the wafer carrier head
32
by the retaining bolts
34
. In the preferred embodiment, the retaining bolts
34
are steel shoulder bolts that longitudinally extend through a plurality of bores
54
in the head retainer assembly
30
. The bores
54
are formed to allow slidable movement of the retaining bolts
34
in an axial direction. The three uniformly spaced retaining bolts
34
of the presently preferred embodiment are coupled with the wafer carrier head
32
by threaded connection.
A gap
56
is created between the head of the retaining bolts
34
and the head retainer assembly
30
when the wafer carrier head
32
is pressed against the head retainer assembly
30
as illustrated in FIG.
2
. Conversely, the gap appears between the wafer carrier head
32
and the head retainer assembly
30
when the wafer carrier head
32
is moved away from the head retainer assembly
30
. The gap
56
represents the degree of independent movement of the wafer carrier head
32
with respect to the head retainer assembly
30
. In the presently preferred embodiment, the gap
56
is in the range of approximately 0.06 to 0.09 inches.
The shear pins
36
are fixedly coupled to the head retainer assembly
30
and extend there through. A plurality of apertures
58
in the wafer carrier head
32
are formed and positioned to accept the portion of the shear pins
36
that extend from the head retainer assembly
30
. In the presently preferred embodiment, there are
3
shear pins
36
formed of steel or similar rigid material. The shear pins
36
are operable to stop the independent rotation of the head retainer assembly
30
with respect to the wafer carrier head
32
when a rotational force is applied to the head retainer assembly
32
by the spindle
12
. In other words, the shear pins
36
keep the wafer carrier head
32
aligned and rotating with the head retainer assembly
30
when rotational force is applied to the head retainer assembly
30
. In alternative embodiments, the retaining bolts
34
and the shear pins
36
may be any coupling mechanism capable of movably coupling the head retainer assembly
30
to the wafer carrier head
32
as previously described.
A top surface
60
of the head retainer assembly
30
is generally circular with an annular wall
62
that extends from the top surface
60
towards the wafer carrier head
32
. Located on the top surface
60
is the coupler
38
. The coupler
38
is formed to accept the coupling mechanism
14
. The coupling mechanism
14
is operable to fixedly couple the head retainer assembly
30
as previously discussed. The presently preferred coupler
38
illustrated in
FIG. 2
is a female portion of a snap fit connection. An interior side surface
63
and a bottom surface
64
of the head retainer assembly
30
forms a cavity
66
within the head retainer assembly
30
that is open to the wafer carrier head
32
.
The slurry barrier ring
40
is operable to maintain a seal between the head retainer assembly
30
and the wafer carrier head
32
. The slurry barrier ring
40
can be, for example, silicone, rubber or other similar flexible material capable of forming a seal. The seal prevents the entry of foreign material into the cavity
66
during operation of the wafer polishing assembly
16
.
The load cell
42
is positioned within the cavity
66
adjacent to the coupler
38
and concentric with a central axis
68
of the wafer polishing assembly
16
. The load cell
42
operates to measure the loading force applied by the spindle
12
to the wafer carrier head
32
. The load cell
42
is fixedly coupled to the head retainer assembly
30
by a plurality of bolts
70
. In the presently preferred embodiment, the load cell
42
may be supplied by Transducer Techniques or Interface Inc. and is operable to measure the loading force in the range between 500 to 1000 pounds. The load cell
42
is fixedly coupled to gimbal post
44
.
The gimbal post
44
includes a proximal end
76
that is fixedly coupled to the load cell
42
by, for example, welding, threaded connection, adhesive connection or other similar rigid connection mechanism. In the presently preferred embodiment, the load cell
42
is coupled to the gimbal post
44
by threaded connection. The coupling between the load cell
42
and the proximal end
76
of the gimbal post
44
allows the transfer of the loading force that is applied to the head retainer assembly
30
to the gimbal post
44
. Accordingly, the load cell
42
may measure the loading force applied to the gimbal post
44
.
The gimbal post
44
of the presently preferred embodiment comprises a first section
78
and a second section
80
. The first section
78
includes the proximal end
76
and the second section
80
includes a distal end
82
. The first section
78
also includes a concave area
84
that is spherically shaped. The concave area
84
is positioned adjacent the second section
80
. The concave area
84
of the first section
78
operably cooperates with a convex area
86
of the second section
80
that is also spherically shaped. The convex area
86
is positioned adjacent the first section
78
to engage the concave area
84
and create a gap
87
. In the presently preferred embodiment, the gap
87
is in the range of approximately 0.03 to 0.06 inches.
Operable cooperation of the first and second sections
78
,
80
forms a ball and socket configuration that allows the second section
80
to gimbal or tilt with respect to the first section
78
. The gimballing action provides the ability of a portion of the wafer polishing assembly
16
to tilt as will be later described. The convex area
86
corresponds to a gimbal center
88
. The gimbal center
88
represents a point at the center of an imaginary sphere created by completing the partial sphere formed by the convex area
86
as illustrated in FIG.
2
. The
5
adjustment of the location of the gimbal center
88
effectively adjusts the behavior of the tilt as will be hereinafter described. The sections
78
,
80
, of the presently preferred embodiment, could be formed of polyethylene terephthalate (PET) or stainless steel with a PET covering. In alternative embodiments, the gimbal post
44
could be formed of other materials such as, for example, aluminum, carbon fiber or other similar rigid material capable of receiving and transferring the loading force. The gimbal post
44
is operable to transfer the loading force to the load suspension plate
46
.
The load suspension plate
46
is operable to receive and transfer the loading force to the wafer carrier head
32
.
FIG. 3
illustrates the load suspension plate
46
illustrated in
FIG. 2
removed from the head retainer assembly
30
. The presently preferred load suspension plate
46
comprises a load control ring
90
that circumferentially surrounds a gimbal area
92
. The load control ring
90
is a generally circular rigid flat plate that includes a first surface
94
and a second surface
96
. An annular raised channel
98
is formed on the second surface
96
at a predetermined distance from the central axis of the load control ring
90
. The load control ring
90
radially extends from the gimbal area
92
that is positioned on the central axis
68
of the wafer polishing assembly
16
.
The presently preferred gimbal area
92
is defined by an aperture
100
, an annular wall
102
and an end plate
104
. The annular wall
102
circumferentially surrounds the aperture
100
and longitudinally extends a predetermined distance from the second surface
96
of the load control ring
90
to the end plate
104
. The annular wall
102
and the end plate
104
are integrally formed to create a cavity
106
. In the presently preferred embodiment, the load suspension plate
46
may be formed of stainless steel or other similar rigid material capable of transferring the loading force.
Referring now to
FIGS. 2 and 3
, the aperture
100
is formed to allow insertion of the gimbal post
44
into the cavity
106
. During operation, prior to application of the loading force to the wafer polishing assembly
16
, the second section
80
is positioned to engage the load suspension plate
46
. The second section
80
is in contact with the interior surface of the end plate
104
and a raised area
108
of the annular wall
102
to prohibit lateral movement of the second section
80
. The first section
78
is positioned in the cavity
106
away from the second section
80
. When the loading force is applied, the first section
78
moves further into the cavity
106
such that the concave area
84
engages the convex area
86
of the second section
80
. The first section
78
of the gimbal post
44
remains separated from the annular wall
102
by a gap
110
to facilitate gimballing. In the presently preferred embodiment, the gap
110
is in the range of approximately 0.06 to 0.09 inches.
During operation, the loading force applied to the gimbal post
44
is transferred to the load suspension plate
46
through the distal end
82
of the second section
80
. The load suspension plate
46
is operable to distribute the loading force that is concentrated in the gimbal area
92
by the gimbal post
44
. The loading force is distributed and transferred to the wafer carrier head
32
by the load control ring
90
.
FIG. 4
illustrates the presently preferred wafer carrier head
32
illustrated in
FIG. 2
removed from the wafer polishing assembly
16
. The wafer carrier head
32
can be any mechanism capable of detachably retaining the wafer
20
(illustrated in
FIG. 1
) and engaging the load suspension plate
46
. The wafer carrier head
32
is a generally circular structure of a predetermined thickness that may be formed of metal or other similarly rigid and non-flexible material. In the presently preferred embodiment the wafer carrier head
32
is formed of stainless steel and is approximately 0.65 inches thick.
The wafer carrier head
32
includes an annular wall
112
that is concentric with the central axis
68
and longitudinally extends to a top surface
114
. The annular wall
112
circumferentially surrounds the load suspension plate
46
(illustrated in
FIGS. 2 and 3
) and is adjacent to the head retainer assembly
30
(illustrated in FIG.
2
). The top surface
114
is positioned adjacent the load suspension plate
46
and closes the open end of the cavity
106
. A first aperture
116
is formed in the top surface
114
concentric with the central axis
68
of the wafer polishing assembly
16
. Extending longitudinally away from the top surface
114
and circumferentially surround the first aperture
116
is a first annular wall
118
. The first annular wall
118
extends to a first floor
120
. The first annular wall
118
and the first floor
120
define a first cavity
122
. A second aperture
124
is formed in the first floor
120
concentric with the first aperture
116
. The second aperture
124
similarly has a longitudinally extending second annular wall
126
that extends to a second floor
128
that defines a second cavity
130
. The first and second apertures
116
,
124
are formed to operably receive the load suspension plate
46
.
Referring now to
FIGS. 2 and 4
, the bottom surface
96
and the annular raised channel
98
of the load suspension plate
46
engage the top surface
114
and the first annular wall
118
, respectively, of the wafer carrier head
32
. In addition, the exterior surface of the end plate
104
is suspended above the second floor
128
. During operation, the loading force is transferred to the wafer carrier head
32
in a region defined by the engagement of the bottom surface
96
and the annular raised channel
98
with the top surface
114
and the first annular wall
118
, respectively. Since the wafer carrier head
32
is formed of non-flexible material, the end plate
104
does not contact the second floor
128
when the loading force is applied.
Referring again to
FIGS. 1 and 2
, the wafer
20
is positioned on a bottom surface
132
of the wafer carrier head
32
in parallel with the bottom surface
132
. The carrier film
48
is located between the bottom surface
132
and the wafer
20
. The carrier film
48
may be any porous, supple material capable of retaining liquid and providing adhesion of the wafer
20
to the wafer carrier head
32
. In the presently preferred embodiment, the carrier film
48
is a felt material that is glued to the bottom surface
132
using an adhesive material. The wafer
20
is also maintained on the bottom surface
132
by the vacuum and air ports
50
and the wafer retainer ring
52
. During operation, when the wafer polishing assembly
16
is not in contact with the polishing pad
18
(illustrated in FIG.
1
), the vacuum and air ports
50
are activated to create a vacuum that operates to adhere the wafer
20
to the bottom surface
132
. In addition, the vacuum and air ports
50
are operable to provide positive pressure during removal of the wafer
20
from the bottom surface
132
. During the polishing operation, the wafer retainer ring
52
retains the wafer
20
on the bottom surface
132
of the wafer carrier head
32
.
Referring now to
FIGS. 1
,
2
,
3
and
4
, a discussion of the overall operation of the presently preferred wafer polishing assembly
16
will now be provided. When the wafer
20
, which is positioned on the wafer carrier head
32
, is brought into contact with the polishing pad
18
by the spindle
12
, the loading force (illustrated as arrow
28
in
FIG. 1
) is applied. The wafer retainer ring
52
maintains the wafer
20
on the bottom surface
132
despite the rotation of the polishing pad
18
(illustrated by arrow
26
in
FIG. 1
) and the rotation of wafer
20
(illustrated by arrow
27
in FIG.
1
). In addition, the wafer
20
is retained in a plane parallel to the polishing pad
18
by controlling the tilt of the wafer carrier head
32
with the gimbal post
44
and distributing the loading force on the wafer carrier head
32
with the load suspension plate
46
.
Selecting the height of the gimbal center
88
with respect to the plane the wafer
20
occupies, or similarly the bottom surface
132
, controls the tilt of the wafer carrier head
32
. Those skilled in the art would understand that the frictional contact of the wafer
20
and the rotating polishing pad
18
creates a moment force that causes the leading edge
22
of the wafer
20
to move downward into the polishing pad
18
. The moment force (i.e. the downward movement of the wafer
20
) can be cancelled by adjusting the gimbal center
88
, as known in the art.
As the gimbal center
88
is adjusted to be more above the plane the wafer
20
occupies, the leading edge
22
of the wafer
20
tilts more downward and the trailing edge
24
tilts more upward. As the gimbal center
88
is adjusted more below the plane that the wafer
20
is in, the leading edge
22
tilts more upward and the trailing edge
24
tilts more downward. Accordingly, by testing with different positions of the gimbal center
88
with respect to wafer
20
, the tilt of the wafer
20
can be optimized. In the presently preferred embodiment, the gimbal center
88
may be adjusted by changing the vertical position of the concave area
84
and convex area
86
. Alternatively, the size of the concave and convex areas
84
,
86
may be adjusted thereby adjusting the diameter of the imaginary sphere as previously discussed. The tilt of the presently preferred wafer carrier head
32
with respect to the central axis
68
of the wafer polishing assembly
16
is in the range of about 1 to 2 degrees.
Distribution of the loading force by the load suspension plate
46
controls the deformation of the wafer carrier head
32
. When the loading force is applied, deformation of the wafer carrier head
32
occurs. The degree and nature of the deformation of the wafer carrier head
32
is dependent on the structural configuration and material the wafer carrier head
32
is formed of. In the presently preferred embodiment, the distribution of the loading force controls the deformation of the wafer carrier head
32
to optimize the flatness of the wafer
20
with respect to the polishing pad
18
. As previously discussed, optimization of the flatness of the wafer
20
more closely maintains the wafer
20
in a plane that is parallel to the polishing pad
18
. Adjustment of the distribution of the loading force may be achieved by adjusting the diameter of the load control ring
90
. Adjusting the diameter of the load control ring
90
correspondingly changes the location of the region on the wafer carrier head
32
where the loading force is applied.
The adjustment of the diameter of the load control ring
90
is dependent on the optimization of the deformation of the wafer carrier head
32
by the loading force during operation. The diameter of the load control ring
90
may be adjusted between the diameter of the gimbal post
44
and the diameter of the bottom surface
132
of the wafer carrier head
32
to optimize the flatness of the wafer
20
. In the presently preferred embodiment, the diameter of the load control ring
90
may be adjusted between about 40% and 60% of the diameter of the bottom surface
132
of the wafer carrier head
32
.
Determination of the optimal position of the gimbal center
88
and the optimal diameter of the load control ring
90
is accomplished through testing. The testing is performed under process conditions to determine the effect on the position of the wafer
20
with respect to the polishing pad
18
as the gimbal center
88
and the diameter of the load control ring
90
are varied. The optimal location of the gimbal center
88
and the optimal diameter of the load control ring
90
will position the wafer
20
in a plane that is parallel to the polishing pad
18
and maintain the optimal flatness of the wafer
20
. Other embodiments may be considered based on the affect of the process parameters on the tilt and the loading distribution on the wafer carrier head
32
. The process parameters effecting the tilt and loading distribution may include, for example, the pressure of the loading force, the rotational speed of the wafer polishing assembly
16
, the rotational speed of the polishing pad
18
, the polishing fluid, the roughness of the polishing pad
18
, etc.
FIG. 5
is a cross section of another preferred embodiment of the polishing head assembly
16
illustrated in FIG.
1
. In this embodiment, the ahead retainer assembly
30
and the wafer carrier head
32
are movably coupled using the retaining bolts
34
and the shear pins
36
and operate in a similar fashion to the polishing head assembly
16
illustrated in FIG.
2
. In addition, the position and operation of the coupler
38
, the slurry barrier ring
40
and the load cell
42
are also similar. Further, the gimbal post
44
and the load suspension plate
46
are similarly operable to transfer the loading force to the wafer carrier head
32
. However, the design and operable cooperation of the gimbal post
44
and the load suspension plate
46
is different. For purposes of brevity, the following discussion will focus on the differences of this embodiment with the previously discussed embodiments.
The gimbal post
44
of this embodiment comprises a single structure with the proximal and distal ends
80
,
82
. The proximal end
80
of the gimbal post
44
is fixedly coupled to the load cell
42
as in the embodiment illustrated in FIG.
2
. The distal end
82
of the gimbal post
44
of this embodiment includes a convex area
136
. The convex area
136
is formed to operably engage a concave area
138
that is formed in the interior surface of the end plate
104
of the load suspension plate
46
. The convex area
136
and the concave area
138
operably cooperate as a ball and socket to allow the load suspension plate
46
and the wafer carrier head
32
to gimbal with respect to the head retainer assembly
30
during operation. In an alternative embodiment, the convex area
136
may be formed in the load suspension plate
46
and the concave area
138
may be formed at the distal end
82
of the gimbal post
44
.
When the loading force is applied to the head retainer assembly
30
, the gimbal post
44
engages the load suspension plate
46
. The resulting gimballing action is operable to maintain the bottom surface
132
of the wafer carrier head
32
in a plane that that is parallel to the polishing pad
18
(illustrated in FIG.
1
). Similar to the embodiment illustrated in
FIG. 2
, the gimbal center
88
of the convex area
136
is adjustable. In the embodiment illustrated in
FIG. 5
, the gimbal center
88
may be positioned above the plane occupied by the bottom surface
132
.
As in the embodiment illustrated in
FIG. 2
, the load suspension plate .
46
is operable to distribute the loading force acting on the wafer carrier head
32
. In addition, the diameter of the load control ring
90
of the load suspension plate
46
may be adjusted to control the deformation of the wafer carrier head
32
. The diameter of the load control ring
90
may be in a range between the diameter of the gimbal post
44
and the diameter of the bottom surface
132
to control the deformation of the wafer carrier head
32
. In the presently preferred embodiment, the diameter of the load control ring
90
may be adjusted between about 40% and 60% of the diameter of the bottom surface
132
of the wafer carrier head
32
to optimize the flatness of the wafer
20
(FIG.
1
).
FIG. 6
illustrates a cross-sectional view of another presently preferred embodiment of the wafer polishing assembly
16
illustrated in FIG.
1
. This embodiment similarly includes the head retainer assembly
30
and the wafer carrier head
32
that cooperatively operate similarly to the previously set forth embodiments. In addition, the load cell
42
is fixedly coupled to the gimbal post
44
as in the embodiment illustrated in FIG.
2
. Further, the gimbal post
44
and the load suspension plate
46
of this embodiment form a ball and socket that allows the load suspension plate
46
and the wafer carrier head
32
to gimbal with respect to the head retainer assembly
30
. However, in this embodiment, a concave area
140
may be formed at the distal end
82
of the gimbal post
44
and a convex area
142
may be formed in the load suspension plate
46
. In an alternative embodiment, the concave area
140
may be formed in the load suspension plate
46
and the convex area
142
may be formed at the distal end
82
of the gimbal post
44
.
In the illustrated embodiment, the location of the gimbal center
88
may be positioned in or near the plane that the bottom surface
132
of the wafer carrier head
32
occupies. The position of the gimbal center
88
is achieved by increasing the size of the convex area
142
and eliminating the second cavity
130
of the embodiment illustrated in FIG.
2
. Elimination of the second cavity
130
suspends the gimbal area
92
(best illustrated in
FIG. 3
) of the load suspension plate
46
above the first floor
120
within the first cavity
122
. In the presently preferred embodiment the wafer carrier head
32
is formed of stainless steel and is approximately 0.65 inches thick.
Similar to the previously discussed embodiments, the diameter of the load control ring
90
may be adjusted between the diameter of the gimbal post
44
and the diameter of the bottom surface
132
of the wafer carrier head
32
to optimize the flatness of the wafer
20
. In the presently preferred embodiment, the diameter of the load control ring
90
may be adjusted between about 40% and 60% of the diameter of the bottom surface
132
of the wafer carrier head
32
to optimize the flatness of the wafer
20
(FIG.
1
). The position of the region of contact on the wafer carrier head
32
is similar to the embodiment illustrated in FIG.
2
and is determined by the diameter of the load control ring
90
.
FIG. 7
is a cross sectional view of another preferred embodiment of the polishing head assembly
16
illustrated in FIG.
1
. In this embodiment, the polishing head assembly
16
includes the head retainer assembly
30
movably connected to the wafer carrier head
32
as in the previous embodiments. In addition, the load cell
42
measures the loading force applied to the gimbal post
44
. The gimbal post
44
is fixedly coupled to the load cell
42
as in the embodiment illustrated in FIG.
2
. The distal end
82
of the gimbal post
44
includes a concave area
156
that cooperatively operates with a convex area
158
on the load suspension plate
46
in a ball and socket fashion. The convex area
158
provides the gimbal center
88
that is illustratively positioned in the preferred embodiment of
FIG. 7
below the bottom surface
132
of the wafer carrier head
32
. As previously discussed, the gimbal center
88
may be adjusted by changing the position of the convex area
158
or the diameter of the portion of the sphere created thereby. In this embodiment, the distance of the gimbal center
88
below the bottom surface
132
of the wafer carrier head
32
may be in a range of about 0 to 0.5 inches.
The load suspension plate
46
includes the load control ring
90
and the gimbal area
92
(best illustrated in
FIG. 4
) as in the previously discussed embodiments. However, the gimbal area
92
of this embodiment has been adjusted to change the position of the convex area
158
. Adjustment of the gimbal area
92
may be accomplished by reducing the area that defines the cavity
106
as illustrated. During operation, the load suspension plate
46
only transfers the loading force to the wafer carrier head
32
using the load control ring
90
as in the previously discussed embodiments. Accordingly, the gimbal area
92
does not contact the wafer carrier head
32
. In the presently preferred embodiment the wafer carrier head
32
is formed of stainless steel and is approximately 0.65 inches thick.
Similarly to the previous embodiments, the diameter of the load control ring
90
may be in a range between the diameter of the gimbal post
44
and the diameter of the bottom surface
132
to control the deformation of the wafer carrier head
32
. In the presently preferred embodiment, the diameter of the load control ring
90
may be adjusted between about 40% and 60% of the diameter of the bottom surface
132
of the wafer carrier head
32
to optimize the flatness of the wafer
20
(FIG.
1
).
FIGS. 8 and 9
are additional presently preferred embodiments of the wafer polishing assembly
16
illustrated in
FIGS. 5 and 6
, respectively. These embodiments include the head retainer assembly
30
movably coupled to the wafer carrier head
32
as in the previously discussed embodiments. In addition, the load cell
42
and the gimbal post
44
are fixedly coupled. Further, the gimbal post
44
and the load suspension plate
46
operably cooperated to form a ball and socket. However, in these embodiments, the wafer carrier head
32
is formed with a thickness (T)
162
that is less than the thickness of the previously disclosed embodiments. Accordingly, the deformation of the wafer carrier head
32
when the loading force is applied to the wafer polishing assembly
16
is different. The presently preferred wafer carrier head
32
of these embodiments is formed of stainless steel with a thickness of approximately 0.50 inches.
The load suspension plate
46
contacts the region of the wafer carrier head
32
with the load control ring
90
as in the previously discussed embodiments to transfer the loading force. As in the previous embodiments, adjustment of the diameter of the load control ring
90
controls the deformation of the wafer carrier head
32
. Optimization of the flatness of the wafer
20
(illustrated in
FIG. 1
) is accomplished by adjusting the diameter of the load control ring
90
. In the embodiments illustrated in
FIGS. 8 and 9
, the diameter of the load control ring
90
is adjusted in the range of between approximately 80% to 95% of the diameter of the bottom surface
132
of the wafer carrier head
32
. The range of the diameter of the load control ring
90
of these presently preferred embodiments optimizes the flatness of the wafer
20
(illustrated in FIG.
1
).
Referring again to
FIG. 1
the presently preferred wafer polishing assembly
16
is operable to control the tilt and the flatness of the wafer
20
during a polishing operation. Control of the tilt and the flatness results in maintenance of the wafer
20
in a plane that is parallel to the polishing pad
18
. Control of the tilt and the flatness is accomplished using the gimbal post
44
and the load suspension plate
46
. The gimbal post
44
is operable to allow the wafer carrier head
32
with the wafer
20
thereon to gimbal thereby optimizing the parallel position of the wafer
20
with respect to the polishing pad
18
. The load suspension plate
46
is operable to distribute the loading force to control the deformation of the wafer carrier head
32
. Control of the deformation of the wafer carrier head
32
optimizes the flatness of the wafer
20
thereby further optimizing the parallel position of the wafer
20
with respect to the polishing pad
18
. Optimization of the parallel position of the wafer
20
provides for more uniform planarization and polishing of the wafer
20
.
The embodiments of the invention disclosed herein are presently considered to be preferred, various changes and modifications can be made without departing from the spirit and scope of the invention. The scope of the invention is indicated in the appended claims, and all changes that come within the meaning and range of equivalents are intended to be embraced therein.
Claims
- 1. A polishing head assembly for retaining and manipulating an object having a surface that is subject to polishing, the polishing head assembly comprising:a head retainer assembly; a load suspension plate, the load suspension plate includes a gimbal area and a load control ring; a gimbal post operably coupled to the head retainer assembly, the gimbal post operable to transfer a loading force to the gimbal area for distribution to the load control ring; and a wafer carrier head movably coupled to the head retainer assembly, the wafer carrier head operably engaged with the load control ring and deformable with the loading force to optimize flatness of an object retained on the carrier head.
- 2. A polishing head assembly for retaining and manipulating an object having a surface that is subject to polishing, the polishing head assembly comprising:a head retainer assembly, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle; a gimbal post coupled to the head retainer assembly; a load suspension plate having a first surface and a second surface, wherein the gimbal post is operably engagable with the load suspension plate and the head retainer assembly is separated from the load suspension plate by die gimbal post: and a wafer carrier head movably coupled to the head retainer assembly having a top surface and a bottom surface, wherein the top surface of the wafer carrier head is operably engaged with the second surface of the load suspension plate and the bottom surface of the wafer carrier head is operable to retain the object.
- 3. A polishing head assembly for retaining and manipulating an object, having a surface that is subject to polishing, the polishing head assembly comprising:a head retainer assembly, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle; a gimbal post coupled to the head retainer assembly; a load suspension plate having a first surface and a second surface, wherein the gimbal post is operably engagable with the load suspension plate; and a wafer carrier head movably coupled to the head retainer assembly having a top surface and a bottom surface, wherein the top surface of the wafer carrier head is operably engaged with the second surface of the load suspension plate and the bottom surface of the wafer carrier head is operable to retain the object; wherein the gimbal post comprises a first section positioned adjacent to a second section, wherein the first section operably cooperates with the second section to allow the second section, the load suspension plate and the wafer carrier head to gimbal with respect to the first section.
- 4. The polishing head assembly of claim 3 wherein the object is a semiconductor wafer.
- 5. The polishing head assembly of claim 3 wherein the gimbal post operably cooperates with the load suspension plate to allow the load suspension plate and the wafer carrier head to gimbal with respect to the head retainer assembly.
- 6. The polishing head assembly of claim 5 wherein a distal end of the gimbal post includes a convex area and the load suspension plate includes a concave area that operably cooperates with the convex area to allow the load suspension plate and the wafer carrier head to gimbal with respect to the head retainer assembly.
- 7. The polishing head assembly of claim 5 wherein a distal end of the gimbal post includes a concave area and the load suspension plate includes a convex area that operably cooperates with the concave area to allow the load suspension plate and the wafer carrier head to gimbal with respect to the head retainer assembly.
- 8. The polishing head assembly of claim 3 wherein a loading force applied to the head retainer assembly is transferable to the wafer carrier head by the gimbal post and the load suspension plate.
- 9. The polishing head assembly of claim 3 wherein the diameter of the suspension plate is selectable to control deformation of the wafer carrier head.
- 10. The polishing head assembly of claim 3 wherein loading applied to the gimbal post is transferable to the load suspension plate, the load suspension plate operable to uniformly apply loading to deform the wafer carrier head to optimize flatness of the object.
- 11. The polishing head assembly of claim 3, wherein the load suspension plate is operable to deform the wafer carrier head to optimize flatness of the object.
- 12. A polishing head assembly for retaining and manipulating an object having a surface that is subject to polishing, the polishing head assembly comprising:a head retainer assembly, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle; a gimbal post coupled to the head retainer assembly; a load suspension plate having a first surface and a second surface, wherein the gimbal post is operably engagable with the load suspension plate; and a wafer carrier head movably coupled to the head retainer assembly having a top surface and a bottom surface, wherein the top surface of the wafer carrier head is operably engaged with the second surface of the load suspension plate and the bottom surface of the wafer carrier head is operable to retain the object; wherein the load suspension plate operably engages the wafer carrier head with a load control ring.
- 13. The polishing head assembly of claim 12 wherein the diameter of the load control ring is between about 40% and 60% of the diameter of the bottom surface of the wafer carrier head.
- 14. The polishing head assembly of claim 12 wherein the diameter of the load control ring is between about 80% and 95% of the diameter of the bottom surface of the wafer carrier head.
- 15. The polishing head assembly of claim 12, wherein the load control ring is a flat plate.
- 16. A polishing head assembly for retaining and applying a loading force to an object having a surface that is subject to polishing by a polishing pad, the polishing head assembly comprising:a wafer carrier bead detachably coupled to the object, wherein the wafer carrier head is operable to retain the object and maintain the object in contact with the polishing pad; a head retainer assembly movably coupled to the wafer carrier head, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle; a load suspension plate operably engaged with the wafer carrier head wherein the load suspension plate is operable to control deformation of the wafer carrier head; and a gimbal post operably coupled to the head retainer assembly and operably engagable with the load suspension plate, wherein lie loading force applied to the head retainer assembly is transferable to the wafer carrier head by the gimbal post and the load suspension plate; wherein the load suspension plate comprises a gimbal area and a load control ring.
- 17. The polishing head assembly of claim 16 wherein the load control ring operably contacts a region of the wafer carrier head.
- 18. The polishing head assembly of claim 17 wherein the region is in a range between about 40% and 60% of the diameter of a surface of the wafer carrier head detachably coupled to the object.
- 19. The polishing head assembly of claim 17 wherein the region is in a range between about 80% and 95% of the diameter of a surface of the wafer carrier head detachably coupled to the object.
- 20. The polishing head assembly of claim 16 wherein the object is a semiconductor wafer.
- 21. A polishing head assembly for retaining and applying a loading force to an object having a surface that is subject to polishing by a polishing pad, the polishing head assembly comprising:a wafer carrier head detachably coupled to the object, wherein the wafer carrier head is operable to retain the object and maintain the object in contact with the polishing pad; a head retainer assembly movably coupled to the wafer carrier head, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle; a loud suspension plate operably engaged with the wafer carrier head, wherein the load suspension plate is operable to control deformation of the wafer carrier head; and a gimbal post operably coupled to the head retainer assembly and operably engagable with the load suspension plate, wherein the loading force applied to the head retainer assembly is transferable to the wafer carrier head by the gimbal post and the load suspension plate; wherein the gimbal post includes a convex area that forms a ball and the load suspension plate includes a concave area that forms a socket, wherein the ball and socket are operably engagable to allow the load suspension plate and the wafer carrier head to gimbal with respect to the head retainer assembly.
- 22. A polishing head assembly for retaining and applying a loading force to an object having a surface that is subject to polishing by a polishing pad, the polishing head assembly comprising:a wafer carrier head detachably coupled to the object, wherein the wafer carrier head is operable to retain he object and maintain the object in contact. with the polishing pad; a head retainer assembly movably coupled to the wafer carrier head, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle; a load suspension plate operably engaged with the wafer carrier head, wherein the load suspension plate is operable to control deformation of the wafer carrier head; and a gimbal post operably coupled to the head retainer assembly and operably engagable with the toad suspension plate, wherein the loading force applied to the head retainer assembly is transferable to the wafer carrier head by the gimbal post and the load suspension plate; wherein the gimbal post includes a concave area that forms a socket and the load suspension plate includes a convex area that forms a ball, wherein the ball and socket are operably engagable to allow the loud suspension plate and the wafer carrier head to gimbal with respect to the head retainer assembly.
- 23. A polishing head assembly for retaining and applying a loading force to an object having a surface that is subject, to polishing by a polishing pad, the polishing head assembly comprising:a water carrier head detachably coupled to the object, wherein the wafer carrier head is operable to retain the object and maintain the object in contact with the polishing pad; a head retainer assembly movably coupled to the wafer carrier head, wherein the head retainer assembly is configured to rigidly engage a rotatable spindle: a load suspension plate operably engaged with the wafer carrier head, wherein the load suspension plate is operable to control deformation of the wafer carrier head; and a gimbal post operably coupled to the bead retainer assembly and operably engagable with the load suspension plate, wherein the loading force applied to the head retainer assembly is transferable to the wafer carrier head by the gimbal post and the load suspension plate; wherein the gimbal post comprises a first section and a second section, wherein the second section is operable engaged with the load suspension plate and the first section includes a convex area that is operably engagable with a concave area of the second section, wherein the first section operably cooperates with the second section to allow the second section, the load suspension plate and the wafer carrier head to gimbal with respect to the first section.
US Referenced Citations (17)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0 284 343 |
Sep 1988 |
EP |
0 362 811 |
Apr 1990 |
EP |
0 589 433 |
Mar 1994 |
EP |