Polishing liquid for metals

Abstract

A liquid for polishing metals, which is used in the chemical and/or mechanical flattening of a semiconductor device, the polishing liquid being characterized in that it comprises at least one member selected from the group consisting of tetrazoles or triazoles represented by any one of the following general formulas (I) to (III):

Description

Claims

1. A liquid for polishing metals, which is used in the chemical and/or mechanical flattening of a semiconductor device, the polishing liquid being characterized in that it comprises at least one compound selected from the group consisting of tetrazoles or triazoles represented by any one of the following general formulas (I) to (III):

2. The liquid for polishing metals as set forth in claim 1, wherein it is principally used for polishing wiring made of copper, in the chemical/mechanical flattening of semiconductor devices.

3. The liquid for polishing metals as set forth in claim 1, comprising the compound selected from the group consisting of tetrazoles or triazoles represented by any one of the general formulas (I) to (III) in an amount ranging from 0.00001 to 1 mole/L.

4. The liquid for polishing metals as set forth in claim 1, comprising the compound selected from the group consisting of tetrazoles or triazoles represented by any one of the general formulas (I) to (III) in an amount ranging from 0.0001 to 0.5 mole/L.

5. The liquid for polishing metals as set forth in claim 1, comprising the compound selected from the group consisting of tetrazoles or triazoles represented by any one of the general formulas (I) to (III) in an amount ranging from 0.0001 to 0.1 mole/L.

6. The liquid for polishing metals as set forth in claim 1, further comprising an organic acid.

7. The liquid for polishing metals as set forth in claim 6, the amount of the organic acid ranges from 0.0005 to 0.5 mole/L.

8. The liquid for polishing metals as set forth in claim 6, the organic acid is at least one compound selected from the group consisting of amino acids and the compounds represented by the following general formulas (1) and (2) and ammonium salts or alkali metal salts thereof: