Polishing pad, manufacturing method of polishing pad and polishing method

Abstract

A polishing pad is provided. The polishing surface of the polishing pad corresponds to a two-dimensional orthogonal coordinate system having a first coordinate direction and a second coordinate direction, the rotating axis of the polishing pad corresponds to the original point of the two-dimensional orthogonal coordinate system, and the polishing pad includes a polishing layer and a surface pattern. The surface pattern is disposed in the polishing layer, and includes at least one first groove and at least one second groove respectively distributing along the first coordinate direction, wherein the at least one first groove has a first cutting trajectory direction, the first cutting trajectory direction is forward with the first coordinate direction, and the at least one second groove has a second cutting trajectory direction, the second cutting trajectory direction is reverse with the first coordinate direction.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan application serial no. 108110320, filed on Mar. 25, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

The present invention relates to a polishing pad, a manufacturing method of a polishing pad, and a polishing method, and more particularly to a polishing pad, a manufacturing method of a polishing pad, and a polishing method that contribute to render a polishing fluid having different flow field distribution.

Description of Related Art

In the manufacturing process of industrial components, the polishing procedure is a technique commonly used today to planarize the surface of an object being polished. Generally speaking, the polishing procedure is carried out by the chemical reaction of the polishing fluid supplied between the surface of the object and the polishing pad, and by the mechanical friction generated by the relative motion between the object and the polishing pad to achieve the planarization. The polishing pad retains and transports the polishing fluid through multiple grooves on the surface of the polishing layer. With the development of the industry, the flow field distributions of the polishing fluid required by various polishing procedure applications are different. Therefore, there is still a need to provide a polishing pad with different flow field distribution of polishing fluid for industrial choice.

SUMMARY

The present invention provides a polishing pad, a manufacturing method of the polishing pad, and a polishing method, which make the polishing fluid have different flow field distribution for industrial selection.

The polishing surface of the polishing pad of the present invention corresponds to a two-dimensional orthogonal coordinate system having a first coordinate direction and a second coordinate direction, the rotating axis corresponds to the original point of the two-dimensional orthogonal coordinate system, and includes a polishing layer and a surface pattern. The surface pattern is arranged in the polishing layer and includes at least one first groove and at least one second groove respectively distributing along the first coordinate direction, wherein at least one first groove has a first cutting trajectory direction, the first cutting trajectory direction is forward with the first coordinate direction, at least one second groove has a second cutting trajectory direction, and the second cutting trajectory direction is reverse with the first coordinate direction.

The polishing pad of the present invention includes a polishing layer and a surface pattern. The surface pattern is arranged in the polishing layer and includes at least one first groove and at least one second groove with the same shape distribution, wherein the at least one first groove has a first cutting trajectory direction, the at least one second groove has a second cutting trajectory direction, and the first cutting trajectory direction is opposite to the second cutting trajectory direction.

The polishing pad of the present invention is used for polishing an object, wherein the polishing pad has a motion direction during polishing procedure, and the polishing pad includes a polishing layer, at least one first groove, and at least one second groove. The at least one first groove is disposed in the polishing layer, wherein the at least one first groove has a first cutting trajectory direction, and the first cutting trajectory direction is forward with the motion direction. The at least one second groove is disposed in the polishing layer, wherein the at least one second groove has a second cutting trajectory direction, and the second cutting trajectory direction is reverse with the motion direction.

The manufacturing method of the polishing pad of the present invention includes the following steps. A polishing layer surface is provided. A cutting device is used to form at least one first groove on the polishing surface along a first cutting trajectory direction, and form at least one second groove on the polishing surface along a second cutting trajectory direction, wherein the at least one first groove is adjacent to the at least one second groove, and the first cutting trajectory direction is opposite to the second cutting trajectory direction.

The polishing method of the present invention includes the following steps. A polishing pad is provided, wherein the polishing pad is the polishing pad described above. A pressure is applied to an object to press the object on the polishing pad. A relative motion is applied to the object and the polishing pad to perform a polishing procedure.

Based on the above, in the polishing pad of the present invention, the at least one first groove has the first cutting trajectory direction, the at least one second groove has the second cutting trajectory direction, and the first cutting trajectory direction is opposite to the second cutting trajectory direction, thereby when using the polishing pad to perform the polishing procedure on the object, the polishing pad makes the polishing fluid have different flow field distribution to meet the requirement of different polishing process application.

In order to make the aforementioned features and advantages of the disclosure more comprehensible, embodiments accompanied with figures are described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic top view of a polishing pad according to an embodiment of the present invention.

FIG. 2 is a photograph showing a flow trace after water droplets are dropped into the first groove and the second groove.

FIG. 3 is a flowchart of a method for manufacturing a polishing pad according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of forming a first groove or a second groove using a cutting device in the process of manufacturing a polishing pad according to an embodiment of the present invention.

FIG. 5 is a schematic top view of a polishing pad according to another embodiment of the present invention.

FIG. 6 is a schematic top view of a polishing pad according to another embodiment of the present invention.

FIG. 7 is a schematic top view of a polishing pad according to another embodiment of the present invention.

FIG. 8 is a schematic top view of a polishing pad according to another embodiment of the present invention.

FIG. 9 is a schematic top view of a polishing pad according to another embodiment of the present invention.

FIG. 10 is a schematic top view of a polishing pad according to another embodiment of the present invention.

FIG. 11 is a flowchart of a polishing method according to an embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

As used herein, “about,” “approximately,” “essentially” or “substantially” is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by persons of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within, for example, ±30%, ±20%, ±15%, ±10%, ±5% of the stated value. Moreover, a relatively acceptable range of deviation or standard deviation may be chosen for the term “about,” “approximately,” “essentially” or “substantially” as used herein based on measurement properties, cutting properties or other properties, instead of applying one standard deviation across all the properties.

In the accompanying drawings, thicknesses of layers, films, panels, regions and so on are exaggerated for clarity. It should be understood that when a groove is referred to as being “adjacent” to another groove, there is no groove between the groove and the other groove.

FIG. 1 is a schematic top view of a polishing pad according to an embodiment of the present invention.

Referring to FIG. 1, a polishing pad 100 includes a polishing layer 102 and a surface pattern 104 disposed in the polishing layer 102. In the present embodiment, the polishing layer 102 has a polishing surface PS. When the polishing procedure is performed on the object using the polishing pad 100, the object contacts the polishing surface PS of the polishing layer 102. In the present embodiment, the polishing surface PS corresponds to a two-dimensional orthogonal coordinate system 10 having a first coordinate direction 10a and a second coordinate direction 10b. As shown in FIG. 1, the two-dimensional orthogonal coordinate system 10 is a polar coordinate system, the first coordinate direction 10a is an angular coordinate direction, and the second coordinate direction 10b is a radial coordinate direction. Those skilled in the art should understand, the radial coordinate represents the distance from the original point of the two-dimensional orthogonal coordinate system 10 to the pole P, and the angular coordinate represents the angular arc of the connection line between the pole P and the original point of the two-dimensional orthogonal coordinate system 10 with respect to the polar axis L in a counterclockwise direction, and the polar axis L is the X-axis in the rectangular coordinate system. In view of this, those skilled in the art should understand that the first coordinate direction 10a is also the circumferential direction, and the second coordinate direction 10b is also the radial direction. In addition, because the angular coordinate represents the angular arc of the connection line between the pole P with the original point of the two-dimensional orthogonal coordinate system 10 in a counterclockwise direction with respect to the polar axis L, the first coordinate direction 10a (i.e., the angular coordinate direction) is a counterclockwise direction.

In the present embodiment, the polishing pad 100 has a rotating axis C, and the rotating axis C corresponds to the original point of the two-dimensional orthogonal coordinate system 10. In addition, as shown in FIG. 1, the rotating axis C is located at the center of the polishing pad 100. Taking the polishing pad 100 shown in FIG. 1 as a circle, the center of the polishing pad 100 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 100. When using the polishing pad 100 to perform the polishing procedure on the object, the polishing pad 100 is fixed on a polishing platen (not shown) of the polishing equipment, and the polishing pad 100 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 1, with respect to the rotating axis C of the polishing pad 100 (i.e., the center of the polishing pad 100), the motion direction R is a counterclockwise direction, that is, the polishing pad 100 rotates in a counterclockwise direction. However, the invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the polishing layer 102 may be composed of a polymer base material. For example, the polymer base material may be polyester, polyether, polyurethane, polycarbonate, polyacrylate, polybutadiene, other polymer base materials synthesized by suitable thermosetting resins or thermoplastic resins, or a combination thereof. In addition, although not shown in FIG. 1, those skilled in the art should understand that the polishing pad 100 may be provided with a base layer, a waterproof layer, an adhesive layer or a combination thereof under the polishing layer 102.

In the present embodiment, the surface pattern 104 may include at least one first groove 104a and at least one second groove 104b. As shown in FIG. 1, the at least one first groove 104a is exemplified by two first grooves 104a, and the at least one second groove 104b is exemplified by two second grooves 104b. However, the present invention is not limited thereto. The number of the first grooves 104a and the number of the second grooves 104b can be designed to be one or three or more according to actual needs.

In the present embodiment, the first grooves 104a and the second grooves 104b are respectively distributed along the first coordinate direction 10a. That is, in the present embodiment, the first grooves 104a and the second grooves 104b are distributed along the circumferential direction or the angular coordinate direction, respectively. In this way, in the present embodiment, the shapes of the first groove 104a and the second groove 104b are respectively circular. That is, in the present embodiment, the surface pattern 104 includes the first grooves 104a and the second grooves 104b having the same shape distribution. In addition, as shown in FIG. 1, the distribution profile of the surface pattern 104 is a concentric ring. That is, in the present embodiment, the center of the circle of the first groove 104a overlaps the center of the polishing pad 100, and the center of the circle of the second groove 104b overlaps the center of the polishing pad 100.

In the present embodiment, the first groove 104a has a first cutting trajectory direction 1Da, and the second groove 104b has a second cutting trajectory direction 1Db. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is circular, when the polishing pad is moved counterclockwise to make the cutting device form a groove on the polishing surface, the cutting trajectory direction of the groove is a clockwise direction, and vice versa. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is circular, when the cutting device moves clockwise to make the cutting device form a groove on the polishing surface, cutting trajectory direction of the groove is a clockwise direction, and vice versa.

As shown in FIG. 1, the first cutting trajectory direction 1Da is forward with the first coordinate direction 10a, and the second cutting trajectory direction 1Db is reverse with the first coordinate direction 10a. That is, in the present embodiment, the first cutting trajectory direction 1Da is opposite to the second cutting trajectory direction 1Db. In addition, as shown in FIG. 1, the first cutting trajectory direction 1Da is forward with the motion direction R, and the second cutting trajectory direction 1Db is reverse with the motion direction R. In detail, in the present embodiment, the motion direction R is a counterclockwise direction, the first cutting trajectory direction 1Da is a counterclockwise direction, and the second cutting trajectory direction 1Db is a clockwise direction. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 1Da is opposite to the second cutting trajectory direction 1Db, it falls within the scope of the present invention. In other embodiments, when the motion direction R is a clockwise direction, the first cutting trajectory direction 1Da is a clockwise direction, and the second cutting trajectory direction 1Db is a counterclockwise direction.

In the present embodiment, the first grooves 104a and the second grooves 104b may be arranged alternately along the second coordinate direction 10b. As shown in FIG. 1, along the second coordinate direction 10b (i.e., the radial direction or the radial coordinate direction), the distribution arrangement of the surface pattern 104 is in order of the first groove 104a, the second groove 104b, the first groove 104a, and the second groove 104b. However, the present invention is not limited thereto, as long as the first grooves 104a and the second grooves 104b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner) arranged alternately, they fall within the scope of the present invention. For example, in one embodiment, along the second coordinate direction 10b (i.e., the radial direction or the radial coordinate direction), the distribution arrangement of the surface pattern 104 may be in order of the first groove 104a, the first groove 104a, the second groove 104b, the first groove 104a, the first groove 104a, and the second groove 104b.

In addition, as shown in FIG. 1, each first groove 104a is disposed adjacent to the second groove 104b, and each second groove 104b is disposed adjacent to the first groove 104a. Specifically, the two first grooves 104a are spaced apart by the second groove 104b, and the two second grooves 104b are spaced apart by the first groove 104a. However, the present invention is not limited thereto, as long as there is one first groove 104a and one second groove 104b adjacent to each other in the surface pattern 104, it falls within the scope of the present invention. For example, as described above, along the second coordinate direction 10b (i.e., the radial direction or the radial coordinate direction), the distribution arrangement of the surface pattern 104 may be in order of the first groove 104a, the first groove 104a, the second groove 104b, the first groove 104a, the first groove 104a, and the second groove 104b, that is, the two first grooves 104a may also be selected to be adjacent to each other.

It is worth noting that, in the present embodiment, the polishing pad 100 satisfies the following conditions that: the first groove 104a has the first cutting trajectory direction 1Da, the second groove 104b has the second cutting trajectory direction 1Db, and the first cutting trajectory direction 1Da is opposite to the second cutting trajectory direction 1Db. In this way, when using the polishing pad 100 to perform the polishing procedure on the object, the polishing pad 100 can make the polishing fluid have different flow field distribution for the following reason.

When a cutting device is used to form a groove on the polishing surface of the polishing pad, the scraping effect between the cutting device and the polishing pad causes the sidewall of the groove to form many fine burrs that are tapered and tipped forward with the cutting trajectory direction. Therefore, a number of fine gaps are formed between these burrs, the width of each of the fine gaps changes from wide to narrow along a direction opposite to the cutting trajectory direction. In general, for the polishing procedure, the main components of various polishing fluid used in the industry include water, so during the polishing procedure of the object using the polishing pad, the polishing fluid enters the grooves along the fine gaps to induce the directional capillary phenomenon. As mentioned above, the width of the fine gap changes from wide to narrow in the opposite direction of the cutting trajectory direction, so the polishing fluid entering the grooves flows in the opposite direction of the cutting trajectory direction due to the action of the capillary phenomenon. In this way, during the polishing procedure of the object using the polishing pad 100, the polishing fluid entering the first groove 104a flows in the opposite direction of the first cutting trajectory direction 1Da, and the polishing fluid entering the second groove 104b flows in the opposite direction of the second cutting trajectory direction 1Db (i.e., the polishing fluid entering the first groove 104a flows oppositely to the polishing fluid entering the second groove 104b). However, the present invention is not limited thereto. For some polishing processes, the polishing fluid may have an overall flow direction on the polishing pad because of the configuration of the polishing equipment or the setting of the polishing parameters, but in any case, the polishing fluid that enters the grooves still be affected by the capillary phenomenon to induce a driving force in the opposite direction of the cutting trajectory direction (i.e., a resistance is induced along the cutting trajectory direction of the grooves), so that the polishing fluid has microscopically different flow field distribution. Therefore, the polishing pad 100 has grooves with different cutting trajectory directions, so that the polishing fluid has different flow field distribution.

In addition, in the present embodiment, the first groove 104a having the first cutting trajectory direction 1Da and the second groove 104b having the second cutting trajectory direction 1Db opposite to the first cutting trajectory direction 1Da are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 100, the polishing pad 100 enables the polishing fluid to have different flow field distribution.

In the following, a drip experiment disclosed in FIG. 2 is used to illustrate that the first groove 104a has the first cutting trajectory direction 1Da, the second groove 104b has the second cutting trajectory direction 1Db, and the first cutting trajectory direction 1Da is opposite to the second cutting trajectory directions 1CDb, such that the polishing pad 100 makes the polishing fluid have different flow field distribution. FIG. 2 is a photograph showing a flow trace after water droplets are dripped into the first groove 104a and the second groove 104b. In the polishing pad 100 of FIG. 2, the first cutting trajectory direction 1Da of the first groove 104a is counterclockwise, and the second cutting trajectory direction 1Db of the second groove 104b is clockwise. It can be seen from FIG. 2 that after the water droplets are dripped into the first groove 104a, the water flows clockwise, that is, water flows in the opposite direction of the first cutting trajectory direction 1Da; and after the water droplets are dripped into the second groove 104b, the water flows counterclockwise, that is, water flows in the opposite direction of the second cutting trajectory direction 1Db. This result confirms that water entering the first groove 104a having the first cutting trajectory direction 1Da flows oppositely to water entering the second groove 104b having the second cutting trajectory direction 1Db opposite to the first cutting trajectory direction 1Da, so the polishing pad 100 makes the polishing fluid have different flow field distribution.

As described above, by forming the first groove 104a and the second groove 104b with opposite cutting trajectory directions, the polishing pad 100 makes the polishing fluid have different flow field distribution. In the following, in order to describe the polishing pad 100 and its effects more clearly, the manufacturing method of the polishing pad 100 will be described with reference to FIG. 3 and FIG. 4. FIG. 3 is a flowchart of a method of manufacturing a polishing pad according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of forming a first groove or a second groove using a cutting device in the process of manufacturing a polishing pad according to an embodiment of the present invention. It should be noted that FIG. 4 is a schematic cross-sectional view shown along the first cutting trajectory direction 1Da or the second cutting trajectory direction 1Db, and FIG. 4 reveals a part of the polishing layer 102 corresponding to one of the first groove 104a and the second groove 104b. In addition, the related content of the polishing pad 100 has been described in detail in the foregoing embodiment, so it is not repeated here, and the description of the omitted part can refer to the foregoing embodiment.

First, referring to both FIG. 1 and FIG. 3, in step S10, a polishing layer 102 having a polishing surface PS is provided. The related description of the polishing layer 102 has been described in detail in the foregoing embodiment, so it is not repeated here.

Then, referring to FIG. 1, FIG. 3 and FIG. 4, in step S12, a cutting device 1000 is used to form at least one first groove 104a on the polishing surface PS along a first cutting trajectory direction 1Da, and form at least one second groove 104b on the polishing surface PS along a second cutting trajectory directions 1Db. As mentioned above, in one embodiment, when a cutting device is used to form groove on the polishing surface PS, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. Based on this, in the present embodiment, during the first step of using the cutting device 1000 to form the at least one first groove 104a along the first cutting trajectory direction 1Da, the position of the cutting device 1000 is fixed, and the polishing pad 100 is moved in the opposite direction of the first cutting trajectory direction 1Da (i.e., a clockwise direction), and during the second step of using the cutting device 1000 to form the at least one second groove 104b along the second cutting trajectory direction 1Db, the position of the cutting device 1000 is fixed, and the polishing pad 100 is moved in the opposite direction of the second cutting trajectory direction 1Db (i.e., a counterclockwise direction). The first and second steps may be completed in different cutting equipment, where the first cutting equipment has a cutting platform rotating clockwise and the second cutting equipment has a cutting platform rotating counterclockwise. In addition, the first step and the second step may be completed in the same cutting equipment. In such case, during the first step, the cutting platform of the cutting equipment rotates clockwise, and during the second step, the cutting platform of the cutting equipment rotates counterclockwise, and before the second step is performed, the step of turning the cutting device (e.g., the cutting device 1000) 180 degree is included. However, the present invention is not limited thereto. In another embodiment, when a cutting device is used to form a groove on the polishing surface, the position of the polishing pad is fixed, and the cutting device is moved relative to the polishing pad to form the groove on the polished surface. The related descriptions of the at least one first groove 104a and the at least one second groove 104b have been described in detail in the foregoing embodiment, so they will not be repeated here.

In the present embodiment, the cutting device 1000 may include a cutter, such as a blade or a saw blade. In the present embodiment, the number of the cutter in the cutting device 1000 is not particularly limited, and can be adjusted according to the number of the first grooves 104a and the second grooves 104b to be formed and/or the cutting process requirements. For example, in one embodiment, the cutting device 1000 may include a single cutter, and each of the first grooves 104a and each of the second grooves 104b are formed in different cutting steps. For another example, in one embodiment, the cutting device 1000 may include two cutters adjacent to each other, and a distance between the two cutters is substantially two times of a distance between the first groove 104a and the second groove 104b adjacent to each other. In such case, two first grooves 104a are formed in the same cutting step, and two second grooves 104b are formed in the other cutting step. It is worth mentioning that when the cutting device 1000 includes two cutters, and a distance between the two cutters is substantially two times of a distance between the first groove 104a and the second groove 104b adjacent to each other, two first grooves 104a can be formed in the same cutting process and two second grooves 104b can be formed in the same cutting process. Therefore, compared with the embodiment in which the cutting device 1000 includes a single cutter, the embodiment in which the cutting device 1000 includes two cutters has the advantage of reduced process time. In addition, when the cutting device 1000 processes a groove on the polishing surface PS of the polishing pad 100, the linear velocity of the cutting processing point generated by the relative movement between the cutter and the polishing pad 100 ranges, for example, from 50 m/min to 500 m/min, which is easier to produce grooves with different cutting trajectory directions, so that the polishing fluid has different flow field distribution. The surface condition of the polishing surface after cutting by the cutting device has a corresponding relationship with the linear velocity of the cutting processing point. If the linear velocity of the cutting processing point is too fast, the fine burrs that are tapered and tipped forward with the cutting trajectory direction as described above will not easily be formed at the sidewall of the groove of the polishing pad, which makes the polishing pad difficult to reach grooves with different cutting trajectory directions to make the polishing fluid have different flow field distribution. On the other hand, if the linear velocity of the cutting processing point is too slow, the cutter may be damaged due to high resistance or the grooves formed may have poor dimensional uniformity.

In addition, as described above, the number of the first grooves 104a and the number of the second grooves 104b are not limited to two, and the number of the first grooves 104a and the number of the second grooves 104b may be respectively designed into three or more based on actual conditions as needed. Based on this, in other embodiments, the cutting device 1000 may include three or more than three cutters. In addition, as described above, the manner of the distribution arrangement of the surface pattern 104 is not limited to the first groove 104a, the second groove 104b, the first groove 104a, and the second groove 104b in order along the second coordinate direction 10b, as long as the first grooves 104a and the second grooves 104b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner). Based on this, in other embodiments, a distance between two adjacent cutters in the cutting device 1000 may be substantially three times or more of a distance between the first groove 104a and the second groove 104b adjacent to each other. For example, in the embodiment that along the second coordinate direction 10b, the distribution arrangement of the surface pattern 104 is in order of the first groove 104a, the first groove 104a, the second groove 104b, the first groove 104a, the first groove 104a and the second groove 104b, four first grooves 104a may be formed in two cutting steps by the cutting device 1000, and two second grooves 104b may be formed in the same one cutting step by the cutting device 1000, the cutting device 1000 includes two cutters adjacent to each other, and a distance between the two cutters is substantially three times of a distance between the first groove 104a and the second groove 104b adjacent to each other. However, the present invention is not limited thereto. In other embodiments, the arrangement manner of the first grooves 104a and the second grooves 104b may be designed according to actual needs.

In the embodiment of FIG. 1, the shapes of the first groove 104a and the second groove 104b respectively are circular, but the present invention is not limited thereto. In other embodiments, the shapes of the first groove 104a and the second groove 104b may respectively be linear, irregular linear, elliptical ring, wavy ring, irregular ring, arc, elliptical arc, wavy arc, irregular arc, spiral, or a combination thereof. On the other hand, in the embodiment of FIG. 1, the distribution shape of the surface pattern 104 is concentric ring, but the present invention is not limited thereto. In other embodiments, the distribution shape of the surface pattern 104 may be parallel linear, non-parallel linear, XY grid, cross linear, eccentric ring, concentric elliptical ring, eccentric elliptical ring, wavy ring, irregular ring, radial linear, radial arc, concentric arc, eccentric arc, concentric elliptical arc, eccentric elliptical arc, wavy arc, irregular arc, spiral, or a combination thereof. Other variations of the polishing pad will be described in detail below with reference to FIG. 5 to FIG. 10.

FIG. 5 is a schematic top view of a polishing pad according to another embodiment of the present invention. Please refer to both FIG. 5 and FIG. 1, the polishing pad 200 in FIG. 5 is similar to the polishing pad 100 in FIG. 1, so the same or similar components are represented by the same or similar numerals, and the related descriptions are not repeated. It is worth mentioning that the polishing layer 202 and the surface pattern 204 are the same as or similar to the corresponding ones in the embodiment of FIG. 1 (that is, the polishing layer 102 and the surface pattern 104), so the related descriptions are not repeated here. The differences between the polishing pad 200 and the polishing pad 100 will be described below.

In the present embodiment, the polishing surface PS of the polishing layer 202 corresponds to a two-dimensional orthogonal coordinate system 20 having a first coordinate direction 20a and a second coordinate direction 20b. As shown in FIG. 5, the two-dimensional orthogonal coordinate system 20 is a rectangular coordinate system. Those skilled in the art should understand that the rectangular coordinate system is defined by the Y-axis and the X-axis, and the Y-axis and the X-axis are two vertical and horizontal number lines perpendicular to each other at 90 degrees, and the intersection point of the Y-axis and the X-axis is the original point of the rectangular coordinate system. In view of this, those skilled in the art should understand that the first coordinate direction 20a is a vertical direction, and the second coordinate direction 20b is a horizontal direction. In addition, those skilled in the art should understand that the upward direction of the Y-axis is a positive direction, and the rightward direction of the X-axis is a positive direction. Therefore, as shown in FIG. 5, the first coordinate direction 20a is also +Y-axis direction, and the second coordinate direction 20b is also +X-axis direction.

In the present embodiment, the rotating axis C of the polishing pad 200 corresponds to the original point of the two-dimensional orthogonal coordinate system 20, that is, the rotating axis C of the polishing pad 200 corresponds to the intersection point of the first coordinate direction 20a and the second coordinate direction 20b. In addition, as shown in FIG. 5, the rotating axis C is located at the center of the polishing pad 200. Taking the polishing pad 200 shown in FIG. 5 as a circle, the center of the polishing pad 200 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 200. When the polishing procedure is performed on the object using the polishing pad 200, the polishing pad 200 is fixed on a polishing platen (not shown) of the polishing equipment, and the polishing pad 200 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 5, with respect to the rotating axis C of the polishing pad 200 (i.e., the center of the polishing pad 200), the motion direction R is a counterclockwise direction, that is, the polishing pad 200 rotates in a counterclockwise direction, but the present invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the surface pattern 204 may include at least one first groove 204a and at least one second groove 204b. As shown in FIG. 5, the at least one first groove 204a is exemplified by four first grooves 204a, and the at least one second groove 204b is exemplified by four second grooves 204b. However, the present invention is not limited thereto. The number of the first grooves 204a and the number of the second grooves 204b can be respectively designed to be one, two, three, or more than five according to actual needs.

In the present embodiment, the first grooves 204a and the second grooves 204b are respectively distributed along the first coordinate direction 20a. That is, in the present embodiment, the first grooves 204a and the second grooves 204b are respectively distributed along the vertical direction or the Y-axis direction, and the first grooves 204a and the second grooves 204b are respectively parallel to the first coordinate direction 20a (i.e., the vertical direction or the Y-axis direction). In this way, in the present embodiment, the shapes of the first groove 204a and the second groove 204b are linear. That is, in the present embodiment, the surface pattern 204 includes the first grooves 204a and the second grooves 204b having the same shape distribution. In addition, as shown in FIG. 5, the distribution profile of the surface pattern 204 is parallel linear. That is, in the present embodiment, the first groove 204a and the second groove 204b are disposed parallel to each other.

In the present embodiment, the first groove 204a has a first cutting trajectory direction 2Da, and the second groove 204b has a second cutting trajectory direction 2Db. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is linear, when the polishing pad is moved toward the +Y-axis direction to make the cutting device form a groove on the polishing surface, the cutting trajectory direction of the groove is −Y-axis direction, and vice versa. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can also be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is linear, when the cutting device is moved toward the +Y-axis direction so that the cutting device forms a groove on the polishing surface, the cutting trajectory direction of the groove is +Y-axis direction, and vice versa.

As shown in FIG. 5, the first cutting trajectory direction 2Da is forward with the first coordinate direction 20a, and the second cutting trajectory direction 2Db is reverse with the first coordinate direction 20a. That is, in the present embodiment, the first cutting trajectory direction 2Da is opposite to the second cutting trajectory direction 2Db. As mentioned above, the first coordinate direction 20a is the +Y-axis direction, so the first cutting trajectory direction 2Da is forward with the +Y-axis direction, and the second cutting trajectory direction 2Db is reverse with the +Y-axis direction. From another point of view, the first cutting trajectory direction 2Da is the +Y-axis direction, and the second cutting trajectory direction 2Db is the −Y-axis direction. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 2Da is opposite to the second cutting trajectory direction 2Db, it falls within the scope of the present invention. In other embodiments, the first cutting trajectory direction 2Da may be the −Y-axis direction, and the second cutting trajectory direction 2Db may be the +Y-axis direction.

In the present embodiment, the first grooves 204a and the second grooves 204b may be arranged alternately along the second coordinate direction 20b. As shown in FIG. 5, along the second coordinate direction 20b (i.e., the horizontal direction or the X-axis direction), the distribution arrangement of the surface pattern 204 is in order of the first groove 204a, the second groove 204b, the first groove 204a, the second groove 204b, the first groove 204a, the second groove 204b, the first groove 204a, and the second groove 204b. However, the present invention is not limited thereto, as long as the first grooves 204a and the second grooves 204b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 204 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 204 along the second coordinate direction 20b (i.e., the horizontal direction or the X-axis direction) may be in order of the first groove 204a, the first groove 204a, and the second groove 204b, the first groove 204a, the first groove 204a, and the second groove 204b. However, the present invention is not limited thereto. In other embodiments, the arrangement of the first grooves 204a and the second grooves 204b can be designed according to actual needs.

In addition, as shown in FIG. 5, each first groove 204a is disposed adjacent to the second groove 204b, and each second groove 204b is disposed adjacent to the first groove 204a. Specifically, two of the first grooves 204a are spaced apart by the corresponding second groove 204b, and two of the second grooves 204b are spaced apart by the corresponding first groove 204a. However, the present invention is not limited thereto, as long as there is one first groove 204a and one second groove 204b adjacent to each other in the surface pattern 204, it falls within the scope of the present invention. For example, as described above, along the second coordinate direction 20b (i.e., the horizontal direction or the X-axis direction), the distribution arrangement of the surface pattern 204 may be in order of the first groove 204a, the first groove 204a, the second groove 204b, the first groove 204a, the first groove 204a, and the second groove 204b, that is, two first grooves 204a may be selected to be adjacent to each other.

Based on the foregoing descriptions of FIG. 1 and FIG. 2, it can be known that in the present embodiment, the polishing pad 200 satisfies the following conditions that: the first groove 204a has the first cutting trajectory direction 2Da, the second groove 204b has the second cutting trajectory direction 2Db, and the first cutting trajectory direction 2Da is opposite to the second cutting trajectory direction 2Db, so that when the object is subjected to a polishing procedure using the polishing pad 200, the polishing pad 200 makes the polishing fluid have different flow field distribution.

In addition, in the present embodiment, the first grooves 204a having the first cutting trajectory direction 2Da and the second grooves 204b having the second cutting trajectory direction 2Db opposite to the first cutting trajectory direction 2Da are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 200, the polishing pad 200 enables the polishing fluid to have different flow field distribution.

FIG. 6 is a schematic top view of a polishing pad according to another embodiment of the present invention. Please refer to both FIG. 6 and FIG. 1, the polishing pad 300 in FIG. 6 is similar to the polishing pad 100 in FIG. 1, so the same or similar components are represented by the same or similar numerals, and the related descriptions are not repeated. It is worth mentioning that the polishing layer 302 and the surface pattern 304 are the same as or similar to the corresponding ones in the embodiment of FIG. 1 (that is, the polishing layer 102 and the surface pattern 104), so the related descriptions are not repeated again. The differences between the polishing pad 300 and the polishing pad 100 will be described below.

In the present embodiment, the polishing surface PS of the polishing layer 302 corresponds to a two-dimensional orthogonal coordinate system 30 having a first coordinate direction 30a and a second coordinate direction 30b. As shown in FIG. 6, the two-dimensional orthogonal coordinate system 30 is a rectangular coordinate system. Those skilled in the art should understand that the rectangular coordinate system is defined by the Y-axis and the X-axis, and the Y-axis and the X-axis are two vertical and horizontal number lines perpendicular to each other at 90 degrees, and the intersection point of the Y-axis and the X-axis is the original point of the rectangular coordinate system. In view of this, those skilled in the art should understand that the first coordinate direction 30a is a horizontal direction, and the second coordinate direction 30b is a vertical direction. In addition, those skilled in the art should understand that the upward direction of the Y-axis is a positive direction, and the rightward direction of the X-axis is a positive direction. Therefore, as shown in FIG. 6, the first coordinate direction 30a is also +X-axis direction, and the second coordinate direction 30b is also +Y-axis direction.

In the present embodiment, the rotating axis C of the polishing pad 300 corresponds to the original point of the two-dimensional orthogonal coordinate system 30, that is, the rotating axis C of the polishing pad 300 corresponds to the intersection point of the first coordinate direction 30a and the second coordinate direction 30b. In addition, as shown in FIG. 6, the rotating axis C is located at the center of the polishing pad 300. Taking the polishing pad 300 shown in FIG. 6 as a circle, the center of the polishing pad 300 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 300. When the polishing procedure is performed on the object using the polishing pad 300, the polishing pad 300 is fixed on a polishing platen (not shown) of the polishing equipment, and the polishing pad 300 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 6, with respect to the rotating axis C of the polishing pad 300 (i.e., the center of the polishing pad 300), the motion direction R is a counterclockwise direction, that is, the polishing pad 300 rotates in a counterclockwise direction but the present invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the surface pattern 304 may include at least one first groove 304a and at least one second groove 304b. As shown in FIG. 6, the at least one first groove 304a is exemplified by four first grooves 304a, and the at least one second groove 304b is exemplified by four second grooves 304b. However, the present invention is not limited thereto. The number of the first grooves 304a and the number of the second grooves 304b can be respectively designed to be one, two, three, or more than five according to actual needs.

In the present embodiment, the first grooves 304a and the second grooves 304b are respectively distributed along the first coordinate direction 30a. That is, in the present embodiment, the first grooves 304a and the second grooves 304b are respectively distributed along the horizontal direction or the X-axis direction, and the first grooves 304a and the second grooves 304b are parallel to the first coordinate direction 30a (i.e., the horizontal direction or the X-axis direction), respectively. In this way, in the present embodiment, the shapes of the first groove 304a and the second groove 304b are linear. That is, in the present embodiment, the surface pattern 304 includes the first grooves 304a and the second grooves 304b having the same shape distribution. In addition, as shown in FIG. 6, the distribution profile of the surface pattern 304 is parallel linear. That is, in the present embodiment, the first groove 304a and the second groove 304b are disposed in parallel with each other.

In the present embodiment, the first groove 304a has a first cutting trajectory direction 3Da, and the second groove 304b has a second cutting trajectory direction 3Db. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is linear, when the polishing pad is moved toward the +X-axis direction so that the cutting device forms a groove on the polishing surface, the cutting trajectory direction of the groove is −X-axis direction, and vice versa. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can also be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is linear, when the cutting device is moved toward the +X-axis direction so that the cutting device forms a groove on the polishing surface, the cutting trajectory direction of the groove is +X-axis direction, and vice versa.

As shown in FIG. 6, the first cutting trajectory direction 3Da is forward with the first coordinate direction 30a, and the second cutting trajectory direction 3Db is reverse with the first coordinate direction 30a. That is, in the present embodiment, the first cutting trajectory direction 3Da is opposite to the second cutting trajectory direction 3Db. As mentioned above, the first coordinate direction 30a is the +X-axis direction, so the first cutting trajectory direction 3Da is forward with the +X-axis direction, and the second cutting trajectory direction 3Db is reverse with the +X-axis direction. From another perspective, the first cutting trajectory direction 3Da is the +X-axis direction, and the second cutting trajectory direction 3Db is the −X-axis direction. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 3Da is opposite to the second cutting trajectory direction 3Db, it falls within the scope of the present invention. In other embodiments, the first cutting trajectory direction 3Da may be the −X-axis direction, and the second cutting trajectory direction 3Db may be the +X-axis direction.

In the present embodiment, the first grooves 304a and the second grooves 304b may be arranged alternately along the second coordinate direction 30b. As shown in FIG. 6, along the second coordinate direction 30b (i.e., the vertical direction or the Y-axis direction), the distribution arrangement of the surface pattern 304 is in order of the second groove 304b, the first groove 304a, the second groove 304b, the first groove 304a, the second groove 304b, the first groove 304a, the second groove 304b, and the first groove 304a. However, the present invention is not limited thereto, as long as the first grooves 304a and the second grooves 304b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 304 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 304 along the second coordinate direction 30b (i.e., the vertical direction or the Y-axis direction) may be in order of the first groove 304a, the first groove 304a, the second groove 304b, the first groove 304a, the first groove 304a, and the second groove 304b. However, the present invention is not limited thereto. In other embodiments, the arrangement of the first grooves 304a and the second grooves 304b can be designed according to actual needs.

In addition, as shown in FIG. 6, each first groove 304a is disposed adjacent to the second groove 304b, and each second groove 304b is disposed adjacent to the first groove 304a. Specifically, two of the first grooves 304a are spaced by the corresponding second groove 304b, and two of the second grooves 304b are spaced by the corresponding first groove 304a. However, the present invention is not limited thereto, as long as there is one first groove 304a and one second groove 304b adjacent to each other in the surface pattern 304, it falls within the scope of the present invention. For example, as described above, along the second coordinate direction 30b (i.e., the vertical direction or the Y-axis direction), the distribution arrangement of the surface pattern 304 may be in order of the first groove 304a, the first groove 304a, the second groove 304b, the first groove 304a, the first groove 304a, and the second groove 304b, that is, two first grooves 304a may be selected to be adjacent to each other.

Based on the foregoing descriptions of FIG. 1 and FIG. 2, it can be known that in the present embodiment, the polishing pad 300 satisfies the following conditions that: the first groove 304a has the first cutting trajectory direction 3Da, the second groove 304b has the second cutting trajectory direction 3Db, and the first cutting trajectory direction 3Da is opposite to the second cutting trajectory direction 3Db, so that when the polishing procedure is performed on the object using the polishing pad 300, the polishing pad 300 makes the polishing fluid have different flow field distribution.

In addition, in the present embodiment, the first grooves 304a having the first cutting trajectory direction 3Da and the second grooves 304b having the second cutting trajectory direction 3Db opposite to the first cutting trajectory direction 3Da are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 300, the polishing pad 300 enables the polishing fluid to have different flow field distribution.

In particular, the polishing pad in another embodiment of the present invention may have the above-mentioned surface pattern 204 in FIG. 5 and the above-mentioned surface pattern 304 in FIG. 6, so the distribution profile of the surface pattern of the said polishing pad is XY grid. The related descriptions and features have been shown in FIG. 5 and FIG. 6, which are not repeated here. It is also mentioned that during the polishing procedure of the object using a polishing pad having an XY grid surface pattern, through two sets of grooves crossing each other, the transmission efficiency of the polishing fluid on the polishing pad can be improved.

FIG. 7 is a schematic top view of a polishing pad according to another embodiment of the present invention. Please refer to both FIG. 7 and FIG. 1, the polishing pad 400 in FIG. 7 is similar to the polishing pad 100 in FIG. 1, so the same or similar components are represented by the same or similar numerals, and the related descriptions are not repeated. It is worth mentioning that the polishing layer 402 and the surface pattern 404 are the same as or similar to the corresponding ones in the embodiment of FIG. 1 (i.e., the polishing layer 102 and the surface pattern 104), so the related descriptions are not repeated here. The differences between the polishing pad 400 and the polishing pad 100 will be described below.

In the present embodiment, the polishing surface PS of the polishing layer 402 corresponds to a two-dimensional orthogonal coordinate system 40 having a first coordinate direction 40a and a second coordinate direction 40b. As shown in FIG. 7, the two-dimensional orthogonal coordinate system 40 is a rectangular coordinate system. Those skilled in the art should understand that the rectangular coordinate system is defined by the Y-axis and the X-axis, and the Y-axis and the X-axis are two vertical and horizontal number lines perpendicular to each other at 90 degrees, and the intersection point of the Y-axis and the X-axis is the original point of the rectangular coordinate system. In view of this, those skilled in the art should understand that the first coordinate direction 40a is a horizontal direction, and the second coordinate direction 40b is a vertical direction. In addition, those skilled in the art should understand that the upward direction of the Y-axis is a positive direction, and the rightward direction of the X-axis is a positive direction. Therefore, as shown in FIG. 7, the first coordinate direction 40a is also +X-axis direction, and the second coordinate direction 40b is also +Y-axis direction.

In the present embodiment, the rotating axis C of the polishing pad 400 corresponds to the original point of the two-dimensional orthogonal coordinate system 40, that is, the rotating axis C of the polishing pad 400 corresponds to the intersection point of the first coordinate direction 40a and the second coordinate direction 40b. In addition, as shown in FIG. 7, the rotating axis C is located at the center of the polishing pad 400. Taking the polishing pad 400 shown in FIG. 7 as a circle, the center of the polishing pad 400 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 400. When the polishing pad 400 is used to perform the polishing procedure on the object, the polishing pad 400 is fixed on a polishing platen (not shown) of the polishing equipment, and the polishing pad 400 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 7, with respect to the rotating axis C of the polishing pad 400 (i.e., the center of the polishing pad 400), the motion direction R is a counterclockwise direction, that is, the polishing pad 400 rotates in a counterclockwise direction, but the present invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the surface pattern 404 may include at least one first groove 404a, at least one second groove 404b, at least one third groove 404c, and at least one fourth groove 404d. As shown in FIG. 7, the at least one first groove 404a is exemplified by four first grooves 404a, the at least one second groove 404b is exemplified by four second grooves 404b, the at least one third groove 404c is exemplified by four third grooves 404c, and the at least one fourth groove 404d is exemplified by four fourth grooves 404d. However, the present invention is not limited thereto. The number of the first grooves 404a, the number of the second grooves 404b, the number of the third grooves 404c, and the number of the fourth grooves 404d can be respectively designed to be one, two, three, or more than five according to actual needs.

In the present embodiment, the shapes of the first groove 404a and the second groove 404b are linear. That is, in the present embodiment, the surface pattern 404 includes the first grooves 404a and the second grooves 404b having the same shape distribution. In addition, as shown in FIG. 7, the first groove 404a and the second groove 404b are disposed parallel to each other.

In the present embodiment, the shapes of the third groove 404c and the fourth groove 404d are linear. That is, in the present embodiment, the surface pattern 404 includes the third grooves 404c and the fourth grooves 404d having the same shape distribution. In addition, as shown in FIG. 7, the third groove 404c and the fourth groove 404d are disposed in parallel with each other.

As shown in FIG. 7, the distribution profile of the surface pattern 404 is cross linear. That is, in the present embodiment, the first groove 404a and the second groove 404b are intersected with the third groove 404c and the fourth groove 404d, respectively.

In the present embodiment, the first groove 404a has a first cutting trajectory direction 4Da, the second groove 404b has a second cutting trajectory direction 4Db, the third groove 404c has a third cutting trajectory direction 4Dc, and the fourth groove 404d has a fourth cutting trajectory direction 4Dd. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can also be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad.

As shown in FIG. 7, the first cutting trajectory direction 4Da of the first groove 404a is forward with the first coordinate direction 40a, and the second cutting trajectory direction 4Db of the second groove 404b is reverse with the first coordinate direction 40a. That is, in the present embodiment, the first cutting trajectory direction 4Da is opposite to the second cutting trajectory direction 4Db. As mentioned above, the first coordinate direction 40a is the +X-axis direction, so the first cutting trajectory direction 4Da is forward with the +X-axis direction and the second cutting trajectory direction 4Db is reverse with the +X-axis direction. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 4Da is opposite to the second cutting trajectory direction 4Db, it falls within the scope of the present invention. In other embodiments, the first cutting trajectory direction 4Da may be reverse with the +X-axis direction, and the second cutting trajectory direction 4Db may be forward with the +X-axis direction.

In addition, as shown in FIG. 7, the third cutting trajectory direction 4Dc of the third groove 404c is forward with the second coordinate direction 40b, and the fourth cutting trajectory direction 4Dd of the fourth groove 404d is reverse with the second coordinate direction 40b. That is, in the present embodiment, the third cutting trajectory direction 4Dc is opposite to the fourth cutting trajectory direction 4Dd. As mentioned above, the second coordinate direction 40b is the +Y-axis direction, so the third cutting trajectory direction 4Dc is forward with the +Y-axis direction, and the fourth cutting trajectory direction 4Dd is reverse with the +Y-axis direction. However, the present invention is not limited thereto, as long as the third cutting trajectory direction 4Dc is opposite to the fourth cutting trajectory direction 4Dd, it falls within the scope of the present invention. In other embodiments, the third cutting trajectory direction 4Dc may be reverse with the +Y-axis direction, and the fourth cutting trajectory direction 4Dd may be forward with the +Y-axis direction.

In addition, as shown in FIG. 7, a first included angle θ1 is between the first cutting trajectory direction 4Da of the first groove 404a and the first coordinate direction 40a, and a second included angle θ2 is between the second cutting trajectory direction 4Db of the second groove 404b and the first coordinate direction 40a. In the present embodiment, the first included angle θ1 is less than about 45 degrees and greater than or equal to about 0 degrees, and the second included angle θ2 is greater than about 135 degrees and less than or equal to about 180 degrees. A third included angle θ3 is between the third cutting trajectory direction 4Dc of the third groove 404c and the second coordinate direction 40b, and a fourth included angle θ4 is between the fourth cutting trajectory direction 4Dd of the fourth groove 404d and the second coordinate direction 40b. In the present embodiment, the third included angle θ3 is less than about 45 degrees and greater than or equal to about 0 degrees, and the fourth included angle θ4 is greater than about 135 degrees and less than or equal to about 180 degrees.

It is worth mentioning that, in one embodiment, when the first included angle θ1 plus the second included angle θ2 is equal to 180 degrees, the third included angle θ3 plus the fourth included angle θ4 is equal to 180 degrees, and the first included angle θ1 is equal to the third included angle θ3 (for example, the first included angle θ1 is equal to 0 degrees, the second included angle θ2 is equal to 180 degrees, the third included angle θ3 is equal to 0 degrees, and the fourth included angle θ4 is equal to 180 degrees), the distribution profile of the surface pattern 404 of the polishing pad 400 is cross linear with square shape (i.e., an XY grid shape). In other embodiments, the distribution profile of the surface pattern 404 of the polishing pad 400 may be cross linear with rhombus shape or other shapes.

In the present embodiment, the first grooves 404a and the second grooves 404b may be arranged alternately along the second coordinate direction 40b. As shown in FIG. 7, along the second coordinate direction 40b (i.e., the vertical direction or the Y-axis direction), the distribution arrangement of the surface pattern 404 is in order of the second groove 404b, the first groove 404a, the second groove 404b, the first groove 404a, the second groove 404b, the first groove 404a, the second groove 404b, and the first groove 404a. However, the present invention is not limited thereto, as long as the first grooves 404a and the second grooves 404b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 404 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 404 along the second coordinate direction 40b (i.e., the vertical direction or the Y-axis direction) may be in order of the first groove 404a, the first groove 404a, the second groove 404b, the first groove 404a, the first groove 404a, and the second groove 404b. However, the present invention is not limited thereto. In other embodiments, the arrangement of the first grooves 404a and the second grooves 404b can be designed according to actual needs.

In addition, in the present embodiment, the third grooves 404c and the fourth grooves 404d may be arranged alternately along the first coordinate direction 40a. As shown in FIG. 7, along the first coordinate direction 40a (i.e., the horizontal direction or the X-axis direction), the distribution arrangement of the surface pattern 404 is in order of the third groove 404c, the fourth groove 404d, the third groove 404c, the fourth groove 404d, the third groove 404c, the fourth groove 404d, the third groove 404c, and the fourth groove 404d. However, the present invention is not limited thereto, as long as the third grooves 404c and the fourth grooves 404d are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 404 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 404 along the first coordinate direction 40a (i.e., the horizontal direction or the X-axis direction) may be in order of the third groove 404c, the third groove 404c, the fourth groove 404d, the third groove 404c, the third groove 404c, and the fourth groove 404d. However, the present invention is not limited thereto. In other embodiments, the arrangement of the third grooves 404c and the fourth grooves 404d can be designed according to actual needs.

As shown in FIG. 7, each first groove 404a is disposed adjacent to the second groove 404b, and each second groove 404b is disposed adjacent to the first groove 404a. Specifically, two of the first grooves 404a are spaced by the corresponding second groove 404b, and two of the second grooves 404b are spaced by the corresponding first groove 404a. However, the present invention is not limited thereto, as long as there is one first groove 404a and one second groove 404b adjacent to each other in the surface pattern 404, it falls within the scope of the present invention. For example, as described above, along the second coordinate direction 40b (i.e., the vertical direction or the Y-axis direction), the distribution arrangement of the surface pattern 404 may be in order of the first groove 404a, the first groove 404a, the second groove 404b, the first groove 404a, the first groove 404a, and the second groove 404b, that is, two first grooves 404a may be selected to be adjacent to each other.

As shown in FIG. 7, each third groove 404c is disposed adjacent to the fourth groove 404d, and each fourth groove 404d is disposed adjacent to the third groove 404c. Specifically, two of the third grooves 404c are spaced apart by the corresponding fourth groove 404d, and two of the fourth grooves 404d are spaced apart by the corresponding third groove 404c. However, the present invention is not limited thereto, as long as one third groove 404c and one fourth groove 404d are disposed adjacent to each other in the surface pattern 404, it falls within the scope of the present invention. For example, as described above, along the first coordinate direction 40a (i.e., the horizontal direction or the X-axis direction), the distribution arrangement of the surface pattern 404 may be in order of the third groove 404c, the third groove 404c, the fourth groove 404d, the third groove 404c, the third groove 404c, and the fourth groove 404d, that is, two third grooves 404c may be selected to be adjacent to each other.

Based on the foregoing descriptions of FIG. 1 and FIG. 2, it can be known that in the present embodiment, the polishing pad 400 satisfies the following conditions that: the first groove 404a has the first cutting trajectory direction 4Da, the second groove 404b has the second cutting trajectory direction 4Db, and the first cutting trajectory direction 4Da is opposite to the second cutting trajectory direction 4Db; and the third groove 404c has the third cutting trajectory direction 4Dc, the fourth groove 404d has the fourth cutting trajectory direction 4Dd, and the third cutting trajectory direction 4Dc is opposite to the fourth cutting trajectory direction 4Dd, so that when the object is subjected to a polishing procedure using the polishing pad 400, the polishing pad 400 enables the polishing fluid to have different flow field distribution.

In addition, in the present embodiment, the first grooves 404a having the first cutting trajectory direction 4Da and the second grooves 404b having the second cutting trajectory direction 4Db opposite to the first cutting trajectory direction 4Da are arranged alternately; and the third groove 404c having the third cutting trajectory direction 4Dc and the fourth groove 404d having the fourth cutting trajectory direction 4Dd opposite to the third cutting trajectory direction 4Dc are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 400, the polishing pad 400 enables the polishing fluid to have different flow field distribution.

In addition, in the present embodiment, the distribution profile of the surface pattern 404 is formed to be cross linear by crossing the first grooves 404a and the second grooves 404b that are parallel to each other and the third grooves 404c and the fourth grooves 404d that are parallel to each other, thereby during the polishing procedure of the object using the polishing pad 400, the transmission efficiency of the polishing fluid on the polishing pad 400 can be improved. That is to say, in the present embodiment, the polishing pad 400 includes two sets of grooves that cross with each other (that is, the first grooves 404a and the second grooves 404b along with the third grooves 404c and the fourth grooves 404d), thereby the transmission efficiency of the polishing fluid on the polishing pad 400 can be improved.

FIG. 8 is a schematic top view of a polishing pad according to another embodiment of the present invention. Please refer to both FIG. 8 and FIG. 1, the polishing pad 500 in FIG. 8 is similar to the polishing pad 100 in FIG. 1, so the same or similar components are represented by the same or similar numerals, and the related descriptions are not repeated. It is worth mentioning that the polishing layer 502 and the surface pattern 504 are the same as or similar to the corresponding ones in the embodiment of FIG. 1 (that is, the polishing layer 102 and the surface pattern 104), so the related descriptions are not repeated here. The differences between the polishing pad 500 and the polishing pad 100 will be described below.

In the present embodiment, the polishing surface PS of the polishing layer 502 corresponds to a two-dimensional orthogonal coordinate system 50 having a first coordinate direction 50a and a second coordinate direction 50b. As shown in FIG. 8, the two-dimensional orthogonal coordinate system 50 is a polar coordinate system, the first coordinate direction 50a is a radial coordinate direction, and the second coordinate direction 50b is an angular coordinate direction. Those skilled in the art should understand that the radial coordinate represents the distance from the original point of the two-dimensional orthogonal coordinate system 50 to the pole P, and the angular coordinate represents the angular arc of the connection line between the pole P and the original point of the two-dimensional orthogonal coordinate system 50 with respect to the polar axis L in a counterclockwise direction, and the polar axis L is the X-axis in the rectangular coordinate system. In view of this, those skilled in the art should understand that the first coordinate direction 50a is also the radial direction, and the second coordinate direction 50b is also the circumferential direction. In addition, since the angular coordinate represents the angular arc of the connection line between the pole P and the original point of the two-dimensional orthogonal coordinate system 50 in a counterclockwise direction with respect to the polar axis L, the first coordinate direction 50a (i.e., the angular coordinate direction) is a counterclockwise direction.

In the present embodiment, the rotating axis C of the polishing pad 500 corresponds to the original point of the two-dimensional orthogonal coordinate system 50. In addition, as shown in FIG. 8, the rotating axis C is located at the center of the polishing pad 500. Taking the polishing pad 500 shown in FIG. 8 as a circle, the center of the polishing pad 500 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 500. When the polishing procedure is performed on the object using the polishing pad 500, the polishing pad 500 is fixed on a polishing platen (not shown) of the polishing equipment, and the polishing pad 500 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 8, with respect to the rotating axis C of the polishing pad 500 (i.e., the center of the polishing pad 500), the motion direction R is a counterclockwise direction, that is, the polishing pad 500 rotates in a counterclockwise direction, but the present invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the surface pattern 504 may include at least one first groove 504a and at least one second groove 504b. As shown in FIG. 8, the at least one first groove 504a is exemplified by four first grooves 504a, and the at least one second groove 504b is exemplified by four second grooves 504b. However, the present invention is not limited thereto. The number of the first grooves 504a and the number of the second grooves 504b can be respectively designed to be one, two, three, or more than five according to actual needs.

In the present embodiment, the first grooves 504a and the second grooves 504b are respectively distributed along the first coordinate direction 50a. That is, in the present embodiment, the first grooves 504a and the second grooves 504b are respectively distributed along the radial direction or the radial coordinate direction. In this way, in the present embodiment, the shapes of the first grooves 504a and the second grooves 504b are linear. That is, in the present embodiment, the surface pattern 504 includes first grooves 504a and second grooves 504b having the same shape distribution. In addition, as shown in FIG. 8, the distribution profile of the surface pattern 504 is radial linear. That is, in the present embodiment, the first groove 504a and the second groove 504b are radially extending grooves, respectively, and the first groove 504a and the second groove 504b are radially distributed outward with respect to the center of the polishing pad 500.

In the present embodiment, the first groove 504a has a first cutting trajectory direction 5Da, and the second groove 504b has a second cutting trajectory direction 5Db. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case of forming a radially extending groove, when the polishing pad is moved along the direction from the rotating axis to the circumference so that the cutting device forms a groove on the polishing surface, the cutting trajectory direction of the groove is the direction from the circumference toward the rotating axis, and vice versa. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can also be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case of forming a radially extending groove, when the cutting device is moved along the direction from the rotating axis to the circumference so that the cutting device forms a groove on the polishing surface, the cutting trajectory direction of the groove is the direction from the rotating axis toward the circumference, and vice versa.

As shown in FIG. 8, the first cutting trajectory direction 5Da is forward with the first coordinate direction 50a, and the second cutting trajectory direction 5Db is reverse with the first coordinate direction 50a. That is, in the present embodiment, the first cutting trajectory direction 5Da is opposite to the second cutting trajectory direction 5Db. As mentioned above, the radial coordinate represents the distance from the original point of the two-dimensional orthogonal coordinate system 50 to the pole P, so that the first coordinate direction 50a (i.e., the radial direction or the radial coordinate direction) is the direction from the rotating axis C of the polishing pad 500 toward the circumference E of the polishing pad 500. Based on this, in the present embodiment, the first cutting trajectory direction 5Da that is forward with the first coordinate direction 50a is the direction from the rotating axis C of the polishing pad 500 toward the circumference E of the polishing pad 500, and the second cutting trajectory direction 5Db that is reverse with the first cutting trajectory direction 5Da is the direction from the circumference E of the polishing pad 500 toward the rotating axis C of the polishing pad 500. In addition, as mentioned above, the rotating axis C is located at the center of the polishing pad 500, so the first cutting trajectory direction 5Da is the direction outward away from the center of the polishing pad 500, and the second cutting trajectory direction 5Db is the direction inward toward the center of the polishing pad 500. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 5Da is opposite to the second cutting trajectory direction 5Db, it falls within the scope of the invention. In other embodiments, the first cutting trajectory direction 5Da may be the direction inward toward the center of the polishing pad 500, and the second cutting trajectory direction 5Db may be the direction outward away from the center of the polishing pad 500.

In the present embodiment, the first grooves 504a and the second grooves 504b may be arranged alternately along the second coordinate direction 50b. As shown in FIG. 8, along the second coordinate direction 50b (i.e., the circumferential direction or the angular coordinate direction), the distribution arrangement of the surface pattern 504 is in order of the second groove 504b, the first groove 504a, the second groove 504b, the first groove 504a, the second groove 504b, the first groove 504a, the second groove 504b, and the first groove 504a. However, the present invention is not limited thereto, as long as the first grooves 504a and the second grooves 504b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 504 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 504 along the second coordinate direction 50b (i.e., the circumferential direction or the angular coordinate direction) may be in order of the first groove 504a, the first groove 504a, the second groove 504b, the first groove 504a, the first groove 504a, and second groove 504b. However, the present invention is not limited thereto. In other embodiments, the arrangement of the first grooves 504a and the second grooves 504b may be designed according to actual needs.

In addition, as shown in FIG. 8, each first groove 504a is disposed adjacent to the second groove 504b, and each second groove 504b is disposed adjacent to the first groove 504a. Specifically, two of the first grooves 504a are spaced by the corresponding second groove 504b, and two of the second grooves 504b are spaced by the corresponding first groove 504a. However, the present invention is not limited thereto, as long as there is one first groove 504a and one second groove 504b adjacent to each other in the surface pattern 504, it falls within the scope of the present invention. For example, as described above, along the second coordinate direction 50b (i.e., the circumferential direction or the angular coordinate direction), the distribution arrangement of the surface pattern 504 may be in order of the first groove 504a, the first groove 504a, the second groove 504b, the first groove 504a, the first groove 504a, and the second groove 504b, that is, two first grooves 504a may be selected to be adjacent to each other.

Based on the foregoing descriptions of FIG. 1 and FIG. 2, it can be known that in the present embodiment, the polishing pad 500 satisfies the following conditions that: the first groove 504a has the first cutting trajectory direction 5Da, the second groove 504b has the second cutting trajectory direction 5Db, and the first cutting trajectory direction 5Da is opposite to the second cutting trajectory direction 5Db, so that when the polishing procedure is performed on the object using the polishing pad 500, the polishing pad 500 makes the polishing fluid have different flow field distribution.

In addition, in the present embodiment, the first grooves 504a having the first cutting trajectory direction 5Da and the second grooves 504b having the second cutting trajectory direction 5Db opposite to the first cutting trajectory direction 5Da are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 500, the polishing pad 500 enables the polishing fluid to have different flow field distribution.

In addition, in other embodiments, the first groove 504a and the second groove 504b may be modified into radially extending grooves of other shapes. For example, the first groove 504a and the second groove 504b may be inclined linear grooves having a non-zero degrees included angle or a non-180 degrees included angle with the first coordinate direction 50a (i.e., the distribution of the surface pattern is inclined radial linear), or arc grooves having a non-fixed included angle with the first coordinate direction 50a (i.e., the distribution of the surface pattern is spiral radial arc). Further, there is a first included angle between the tangent direction of each point on the first cutting trajectory direction 5Da of the first groove 504a and the first coordinate direction 50a, and the first included angle is less than about 45 degrees and greater than or equal to about 0 degrees. In addition, there is a second included angle between the tangent direction of each point on the second cutting trajectory direction 5Db of the second groove 504b and the first coordinate direction 50a, and the second included angle is greater than about 135 degrees and less than or equal to about 180 degrees. Other related descriptions and features have been shown in FIG. 8, so that is not repeated again. In particular, in the embodiment of FIG. 8, the foregoing first included angle is equal to an angle of 0 degrees, and the foregoing second included angle is equal to an angle of 180 degrees.

FIG. 9 is a schematic top view of a polishing pad according to another embodiment of the present invention. Please refer to both FIG. 9 and FIG. 1, the polishing pad 600 of FIG. 9 is similar to the polishing pad 100 of FIG. 1, so the same or similar components are represented by the same or similar numerals, and the related descriptions are not repeated. It is worth mentioning that the polishing layer 602 and the surface pattern 604 are the same as or similar to the corresponding ones in the embodiment of FIG. 1 (that is, the polishing layer 102 and the surface pattern 104), so the related descriptions are not repeated here. The differences between the polishing pad 600 and the polishing pad 100 will be described below.

In the present embodiment, the rotating axis C of the polishing pad 600 is located at the center of the polishing pad 600. Taking the polishing pad 600 shown in FIG. 9 as a circle, the center of the polishing pad 600 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 600. When the polishing procedure is performed on the object using the polishing pad 600, the polishing pad 600 is fixed on a polishing platen (not shown) of the polishing equipment, and the polishing pad 600 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 9, with respect to the rotating axis C of the polishing pad 600 (i.e., the center of the polishing pad 600), the motion direction R is a counterclockwise direction, that is, the polishing pad 600 rotates in a counterclockwise direction, but the present invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the surface pattern 604 may include at least one first groove 604a and at least one second groove 604b. As shown in FIG. 9, the at least one first groove 604a is exemplified by two first grooves 604a, and the at least one second groove 604b is exemplified by two second grooves 604b. However, the present invention is not limited thereto. The number of the first grooves 604a and the number of the second grooves 604b can be respectively designed to be one or more than two according to actual needs.

In the present embodiment, the shapes of the first grooves 604a and the second grooves 604b are circular. In detail, the first grooves 604a and the second grooves 604b (i.e., the circular grooves) have the same size, and the adjacent two of the first grooves 604a and the second grooves 604b (i.e., two adjacent circular grooves) have the same spacing. In addition, the centers of the first grooves 604a and the second grooves 604b (i.e., circular grooves) do not overlap with the rotating axis C of the polishing pad 600 and are located at the positions corresponding to the same radius of the polishing pad 600. That is, in the present embodiment, the surface pattern 604 includes the first grooves 604a and the second grooves 604b having the same shape distribution.

In the present embodiment, the first groove 604a has a first cutting trajectory direction 6Da, and the second groove 604b has a second cutting trajectory direction 6Db. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is circular, when the polishing pad is moved counterclockwise to make the cutting device form a groove on the polishing surface, the cutting trajectory direction of the groove is a clockwise direction, and vice versa. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can also be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is circular, when the cutting device moves clockwise to make the cutting device form a groove on the polishing surface, the cutting trajectory direction of the groove is a clockwise direction, and vice versa.

As shown in FIG. 9, the first cutting trajectory direction 6Da is forward with the motion direction R, and the second cutting trajectory direction 6Db is reverse with the motion direction R. In detail, the motion direction R is a counterclockwise direction, so the first cutting trajectory direction 6Da is a counterclockwise direction, and the second cutting trajectory direction 6Db is a clockwise direction. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 6Da is opposite to the second cutting trajectory direction 6Db, it falls within the scope of the present invention. In other embodiments, when the motion direction R is a clockwise direction, the first cutting trajectory direction 6Da is a clockwise direction, and the second cutting trajectory direction 6Db is a counterclockwise direction.

In the present embodiment, the first grooves 604a and the second grooves 604b may be arranged alternately along the motion direction R. As shown in FIG. 9, along the motion direction R, the distribution arrangement of the surface pattern 604 is in order of the first groove 604a, the second groove 604b, the first groove 604a, and the second groove 604b. However, the present invention is not limited thereto, as long as the first grooves 604a and the second grooves 604b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 604 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 604 along the motion direction R may be in order of the first groove 604a, the first groove 604a, the second groove 604b, the first groove 604a, the first groove 604a and the second groove 604b. However, the present invention is not limited thereto. In other embodiments, the arrangement manner of the first grooves 604a and the second grooves 604b may be designed according to actual needs.

In addition, as shown in FIG. 9, each first groove 604a is disposed adjacent to the second groove 604b, and each second groove 604b is disposed adjacent to the first groove 604a. Specifically, two of the first grooves 604a are spaced by the corresponding second groove 604b, and two of the second grooves 604b are spaced by the corresponding first groove 604a. However, the present invention is not limited thereto, as long as there is one first groove 604a and one second groove 604b adjacent to each other in the surface pattern 604, it falls within the scope of the present invention. For example, as described above, along the motion direction R, the distribution arrangement of the surface pattern 604 may be in order of the first groove 604a, the first groove 604a, the second groove 604b, the first groove 604a, the first groove 604a and the second groove 604b, that is, two first grooves 604a may be selected to be adjacent to each other.

In particular, unlike the aforementioned embodiments of FIG. 1, FIG. 5, FIG. 6, FIG. 7, FIG. 8, and subsequent embodiment of FIG. 10, the groove configuration of the polishing pad 600 in the embodiment shown in FIG. 9 does not need to be distributed along a certain coordinate direction in the two-dimensional orthogonal coordinate system, and in addition to the motion direction R, the grooves of the polishing pad 600 in the embodiment shown in FIG. 9 can be also arranged along the row direction or the column direction of the matrix, but the present invention is not limited thereto.

Based on the foregoing descriptions of FIG. 1 and FIG. 2, it can be known that in the present embodiment, the polishing pad 600 satisfies the following conditions that: the first groove 604a has the first cutting trajectory direction of 6 Da, and the second groove 604b has the second cutting trajectory direction 6Db, and the first cutting trajectory direction 6Da is opposite to the second cutting trajectory direction 6Db, so that when the polishing procedure is performed on the object using the polishing pad 600, the polishing pad 600 makes the polishing fluid have different flow field distribution.

In addition, in the present embodiment, the first grooves 604a having the first cutting trajectory direction 6Da and the second grooves 604b having the second cutting trajectory direction 6Db opposite to the first cutting trajectory direction 6Da are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 600, the polishing pad 600 enables the polishing fluid to have different flow field distribution.

FIG. 10 is a schematic top view of a polishing pad according to another embodiment of the present invention. Please refer to both FIG. 10 and FIG. 1, the polishing pad 700 in FIG. 10 is similar to the polishing pad 100 in FIG. 1, so the same or similar components are represented by the same or similar numerals, and the related descriptions are not repeated. It is worth mentioning that the polishing layer 702 and the surface pattern 704 are the same as or similar to ones in the embodiment of FIG. 1 (that is, the polishing layer 102 and the surface pattern 104), so the related descriptions are not repeated here. The differences between the polishing pad 700 and the polishing pad 100 will be described below.

In the present embodiment, the polishing surface PS of the polishing layer 702 corresponds to a two-dimensional orthogonal coordinate system 70 having a first coordinate direction 70a and a second coordinate direction 70b. As shown in FIG. 10, the two-dimensional orthogonal coordinate system 70 is a polar coordinate system, the first coordinate direction 70a is an angular coordinate direction, and the second coordinate direction 70b is a radial coordinate direction. Those skilled in the art should understand that the radial coordinate represents the distance from the original point of the two-dimensional orthogonal coordinate system 70 to the pole P, and the angular coordinate represents the angular arc of the connection line between the pole P and the original point of the two-dimensional orthogonal coordinate system 70 with respect to the polar axis L in a counterclockwise direction, and the polar axis L is the X-axis in the rectangular coordinate system. In view of this, those skilled in the art should understand that the first coordinate direction 70a is also the circumferential direction, and the second coordinate direction 70b is also the radial direction. In addition, since the angular coordinate represents the angular arc of the connection line between the pole P and the original point of the two-dimensional orthogonal coordinate system 70 in a counterclockwise direction with respect to the polar axis L, the first coordinate direction 70a (i.e., the angular coordinate direction) is a counterclockwise direction.

In the present embodiment, the rotating axis C of the polishing pad 700 corresponds to the original point of the two-dimensional orthogonal coordinate system 70. In addition, as shown in FIG. 10, the rotating axis C is located at the center of the polishing pad 700. Taking the polishing pad 700 shown in FIG. 10 as a circle, the center of the polishing pad 700 is the center of the circle, that is, the rotating axis C is located at the center of the circle of the polishing pad 700. When the polishing procedure is performed on the object using the polishing pad 700, the polishing pad 700 is fixed on the polishing platen (not shown) of the polishing equipment, and the polishing pad 700 is driven by the polishing platen to rotate along the rotating axis C in the motion direction R. As shown in FIG. 10, with respect to the rotating axis C of the polishing pad 700 (i.e., the center of the polishing pad 700), the motion direction R is a counterclockwise direction, that is, the polishing pad 700 rotates in a counterclockwise direction, but the present invention is not limited thereto. In other embodiments, the motion direction R may also be a clockwise direction.

In the present embodiment, the surface pattern 704 may include at least one first groove 704a and at least one second groove 704b. As shown in FIG. 10, the at least one first groove 704a is exemplified by two first grooves 704a, and the at least one second groove 704b is exemplified by two second grooves 704b. However, the present invention is not limited thereto. The number of the first grooves 704a and the number of the second grooves 704b can be respectively designed to be one or more than two according to actual needs.

In the present embodiment, the shapes of the first groove 704a and the second groove 704b are elliptical ring. That is, in the present embodiment, the surface pattern 704 includes first grooves 704a and second grooves 704b having the same shape distribution. In addition, as shown in FIG. 10, the distribution profile of the surface pattern 704 is concentric elliptical ring. That is, in the present embodiment, the center of the first groove 704a overlaps the center of the polishing pad 700, and the center of the second groove 704b overlaps the center of the polishing pad 700.

In the present embodiment, the first groove 704a has a first cutting trajectory direction 7Da, and the second groove 704b has a second cutting trajectory direction 7Db. In one embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the cutting device is fixed, and the polishing pad is moved relative to the cutting device. At this time, the “cutting trajectory direction” can be defined as the direction opposite to the motion direction of the polishing pad when a cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is an elliptical ring, when the polishing pad is moved counterclockwise to make the cutting device form a groove on the polishing surface, the cutting trajectory direction of the groove is a clockwise direction, and vice versa. In another embodiment, when a cutting device is used to form a groove on the polishing surface of the polishing pad, the position of the polishing pad is fixed, and the cutting device moves relative to the polishing pad. At this time, the “cutting trajectory direction” can also be defined as the same direction as the motion direction of the cutting device when the cutting device is used to form a groove on the polishing surface of the polishing pad. For example, in the case that the shape of the groove to be formed is an elliptical ring, when the cutting device is moved clockwise to make the cutting device form a groove on the polishing surface, the cutting trajectory direction of the groove is a clockwise direction, and vice versa.

As shown in FIG. 10, the first cutting trajectory direction 7Da is forward with the first coordinate direction 70a, and the second cutting trajectory direction 7Db is reverse with the first coordinate direction 70a. That is, in the present embodiment, the first cutting trajectory direction 7Da is opposite to the second cutting trajectory direction 7Db. As mentioned above, in the present embodiment, the first coordinate direction 70a and the motion direction R are both counterclockwise, so the first cutting trajectory direction 7Da is also forward with the motion direction R, and the second cutting trajectory direction 7Db is also reverse with the motion direction R. However, the present invention is not limited thereto, as long as the first cutting trajectory direction 7Da and the second cutting trajectory direction 7Db are opposite to each other, it falls within the scope of the present invention. In other embodiments, the first cutting trajectory direction 7Da may be reverse with the motion direction R, and the second cutting trajectory direction 7Db may be forward with the motion direction R.

In addition, as shown in FIG. 10, an included angle θ5 is between the tangential direction T of the first cutting trajectory direction 7Da at the pole P of the first groove 704a and the tangential direction TR of the motion direction R at the pole P of the first groove 704a, and an included angle θ6 is between the tangential direction T1 of the second cutting trajectory direction 7Db at the pole P1 of the second groove 704b and the tangential direction TR1 of the motion direction R at the pole P1 of the second groove 704b. In the present embodiment, the included angle θ5 is less than about 45 degrees and greater than or equal to about 0 degrees, and the included angle θ6 is greater than about 135 degrees and less than or equal to 180 degrees. In other words, in the present embodiment, the distribution of the first grooves 704a and the second grooves 704b does not overlap with the first coordinate direction 70a. It is worth mentioning that although FIG. 10 only reveals the relationship between the tangential direction T of the first cutting trajectory direction 7Da and the tangential direction TR of the motion direction R at one pole P of the first groove 704a, and the relationship between the tangential direction T1 of the second cutting trajectory direction 7Db and the tangential direction TR1 of the motion direction R at one pole P1 of the second groove 704b, those skilled in the art should understand that the included angle θ5 is between the tangential direction of the first cutting trajectory direction 7Da at each point of the first groove 704a and the tangential direction of the motion direction R at each point of the first groove 704a, and the included angle θ6 is between the tangential direction of the second cutting trajectory direction 7Db at each point of the second groove 704b and the tangential direction of the motion direction R at each point of the second groove 704b.

In the present embodiment, the first grooves 704a and the second grooves 704b may be arranged alternately along the second coordinate direction 70b. As shown in FIG. 10, along the second coordinate direction 70b (i.e., the radial direction or the radial coordinate direction), the distribution arrangement of the surface pattern 704 is in order of the first groove 704a, the second groove 704b, the first groove 704a, and the second groove 704b. However, the present invention is not limited thereto, as long as the first grooves 704a and the second grooves 704b are arranged alternately (such as arranged alternately in a periodical manner or in a non-periodical manner), they fall within the scope of the present invention. In other words, the number and the order of the grooves included in the surface pattern 704 can be adjusted according to actual needs. For example, in one embodiment, the distribution arrangement of the surface pattern 704 along the second coordinate direction 70b (i.e., the radial direction or the radial coordinate direction) may be in order of the first groove 704a, the first groove 704a, the second groove 704b, the first groove 704a, the first groove 704a, and the second groove 704b. However, the present invention is not limited thereto. In other embodiments, the arrangement manner of the first grooves 704a and the second grooves 704b may be designed according to actual needs.

In addition, as shown in FIG. 10, each first groove 704a is disposed adjacent to the second groove 704b, and each second groove 704b is disposed adjacent to the first groove 704a. Specifically, two of the first grooves 704a are spaced by the corresponding second groove 704b, and two of the second grooves 704b are spaced by the corresponding first groove 704a. However, the present invention is not limited thereto, as long as there is one first groove 704a and one second groove 704b adjacent to each other in the surface pattern 704, it falls within the scope of the present invention. For example, as described above, along the second coordinate direction 70b (i.e., the radial direction or the radial coordinate direction), the distribution arrangement of the surface pattern 704 may be in order of the first groove 704a, the first groove 704a, the second groove 704b, the first groove 704a, the first groove 704a, and the second groove 704b, that is, two first grooves 704a may be selected to be adjacent to each other.

Based on the foregoing descriptions of FIG. 1 and FIG. 2, it can be known that in the present embodiment, the polishing pad 700 satisfies the following conditions that: the first groove 704a has the first cutting trajectory direction 7Da, the second groove 704b has the second cutting trajectory direction 7Db, and the first cutting trajectory direction 7Da is opposite to the second cutting trajectory direction 7Db, so that when the object is subjected to a polishing procedure using the polishing pad 700, the polishing pad 700 makes the polishing fluid have different flow field distribution.

In addition, in the present embodiment, the first grooves 704a having the first cutting trajectory direction 7Da and the second grooves 704b having the second cutting trajectory direction 7Db opposite to the first cutting trajectory direction 7Da are arranged alternately, thereby during the polishing procedure of the object using the polishing pad 700, the polishing pad 700 enables the polishing fluid to have different flow field distribution.

In addition, according to the above-mentioned descriptions about FIG. 1, FIG. 3, and FIG. 4, those skilled in the art should understand that the manufacturing method of each of the polishing pad 200 shown in FIG. 5, the polishing pad 300 shown in FIG. 6, the polishing pad 400 shown in FIG. 7, the polishing pad 500 shown in FIG. 8, the polishing pad 600 shown in FIG. 9, and the polishing pad 700 shown in FIG. 10, which will not be repeated here. Further, the groove surface pattern of the polishing pad can also be combined with the surface patterns of the foregoing embodiments. In addition, the adjacent grooves in the polishing pads of the previous figures are all shown with the same spacing, but the present invention is not limited thereto. In other embodiments, the adjacent grooves may with different spacings.

FIG. 11 is a flowchart of a polishing method according to an embodiment of the present invention. This polishing method is suitable for polishing objects. In detail, this polishing method may be applied to a polishing process for manufacturing an industrial component, such as a component used in the electronics industries including semiconductor devices, integrated circuits, micro-electromechanical devices, energy conversion devices, communication devices, optical devices, disks for storage, and displays etc., and objects used for manufacturing the components may include semiconductor wafers, Group III-V wafers, carriers of storage devices, ceramic substrates, polymer substrates, and glass substrates, etc. However, the invention is not limited hereto.

Please refer to FIG. 11. First, in step S20, a polishing pad is provided. In detail, in the present embodiment, the polishing pad may be any of the polishing pads as described in the foregoing embodiments, e.g., the polishing pad 100, 200, 300, 400, 500, 600, or 700. The related descriptions of the polishing pads 100, 200, 300, 400, 500, 600, 700 have been described in detail in the foregoing. Thus, details in this regard are not repeated here.

Next, in step S22, a pressure is applied to an object. In this way, the object is pressed onto the polishing pad and in contact with the polishing pad. In detail, as mentioned above, the object is in contact with the polishing surface PS of the polishing layer 102, 202, 302, 402, 502, 602, or 702. In addition, the method of applying pressure to the object is performed by, for example, using a carrier capable of holding the object.

After that, in step S24, relative motion is provided to the object and the polishing pad, so as to use the polishing pad to perform a polishing procedure on the object to achieve the purpose of planarization. In detail, the method for providing relative motion to the object and the polishing pad is performed by, for example, rotating the polishing platen to drive the polishing pad fixed on the polishing platen to rotate in the rotation direction R.

Although the invention is disclosed as the embodiments above, the embodiments are not meant to limit the invention. Those skilled in the art may make slight modifications and variations without departing from the spirit and scope of the invention. Therefore, the protection scope of the invention shall be defined by the claims attached below.

Claims

1. A polishing pad, wherein a polishing surface of the polishing pad corresponds to a two-dimensional orthogonal coordinate system having a first coordinate direction and a second coordinate direction, a rotating axis of the polishing pad corresponds to an original point of the two-dimensional orthogonal coordinate system, and the polishing pad comprises: a polishing layer; anda surface pattern disposed in the polishing layer, the surface pattern including a plurality of first grooves and a plurality of second grooves respectively distributing along the first coordinate direction,wherein each of the plurality of first grooves has a first cutting trajectory direction, the first cutting trajectory direction is forward with the first coordinate direction, and each of the plurality of second grooves has a second cutting trajectory direction, and the second cutting trajectory direction is reverse with the first coordinate direction, and wherein a sidewall of each of the plurality of first grooves has a plurality of first fine burrs that are tipped forward with the first cutting trajectory direction, and a sidewall of each of the plurality of second grooves has a plurality of second fine burrs that are tipped forward with the second cutting trajectory direction.

2. The polishing pad of claim 1, wherein a first included angle is between the first cutting trajectory direction of the plurality of first grooves and the first coordinate direction, and the first included angle is less than 45 degrees and greater than or equal to 0 degrees, and a second included angle is between the second cutting trajectory direction of the plurality of second grooves and the first coordinate direction, and the second included angle is greater than 135 degrees and less than or equal to 180 degrees.

3. The polishing pad of claim 1, wherein the two-dimensional orthogonal coordinate system is a rectangular coordinate system, the first coordinate direction is a +Y-axis direction, and the plurality of first grooves and the plurality of second grooves are respectively distributed along a vertical direction.

4. The polishing pad of claim 1, wherein the two-dimensional orthogonal coordinate system is a rectangular coordinate system, the first coordinate direction is a +X-axis direction, and the plurality of first grooves and the plurality of second grooves are respectively distributed along a horizontal direction.

5. The polishing pad of claim 1, wherein the two-dimensional orthogonal coordinate system is a polar coordinate system, the first coordinate direction is an angular coordinate direction, the a plurality of first grooves and the a plurality of second grooves are respectively distributed along a circumferential direction.

6. The polishing pad of claim 1, wherein the two-dimensional orthogonal coordinate system is a polar coordinate system, the first coordinate direction is a radial coordinate direction, the plurality of first grooves and the plurality of second grooves are respectively distributed along a radial direction.

7. The polishing pad of claim 1, wherein the plurality of first grooves and the plurality of second grooves are arranged alternately along the second coordinate direction.

8. A polishing pad comprising: a polishing layer; anda surface pattern disposed in the polishing layer, the surface pattern including a plurality of first grooves and a plurality of second grooves having the same shape distribution,wherein each of the plurality of first grooves has a first cutting trajectory direction, each of the plurality of second grooves has a second cutting trajectory direction, and the first cutting trajectory direction is opposite to the second cutting trajectory direction, and wherein a sidewall of each of the plurality of first grooves has a plurality of first fine burrs that are tipped forward with the first cutting trajectory direction, and a sidewall of each of the plurality of second grooves has a plurality of second fine burrs that are tipped forward with the second cutting trajectory direction.

9. The polishing pad of claim 8, wherein the first cutting trajectory direction is a +Y-axis direction, and the second cutting trajectory direction is a —Y-axis direction.

10. The polishing pad of claim 8, wherein the first cutting trajectory direction is a +X-axis direction, and the second cutting trajectory direction is a —X-axis direction.

11. The polishing pad of claim 8, wherein the first cutting trajectory direction is a counterclockwise direction, and the second cutting trajectory direction is a clockwise direction.

12. The polishing pad of claim 8, wherein the first cutting trajectory direction is a direction from the rotating axis of the polishing pad to a circumference of the polishing pad, and the second cutting trajectory direction is a direction from the circumference of the polishing pad to the rotating axis of the polishing pad.

13. The polishing pad of claim 8, wherein the plurality of first grooves and the plurality of second grooves are arranged alternately.

14. A polishing pad for polishing an object, the polishing pad having a motion direction during polishing, the polishing pad comprising: a polishing layer;a plurality of first grooves disposed in the polishing layer, wherein each of the plurality of first grooves has a first cutting trajectory direction, and the first cutting trajectory direction is forward with the motion direction; anda plurality of second grooves disposed in the polishing layer, wherein each of the plurality of second grooves has a second cutting trajectory direction, and the second cutting trajectory direction is reverse with the motion direction, and wherein a sidewall of each of the plurality of first grooves has a plurality of first fine burrs that are tipped forward with the first cutting trajectory direction, and a sidewall of each of the plurality of second grooves has a plurality of second fine burrs that are tipped forward with the second cutting trajectory direction.

15. The polishing pad of claim 14, wherein a first included angle is between a tangential direction of the first cutting trajectory direction at each point of each of the plurality of first grooves and a tangential direction of the motion direction at each point of each of the plurality of first grooves, the first included angle is less than 45 degrees and greater than or equal to 0 degrees, and a second included angle is between a tangential direction of the second cutting trajectory direction at each point of each of the plurality of second grooves and a tangential direction of the motion direction at each point of each of the plurality of second grooves, the second included angle is greater than 135 degrees and less than or equal to 180 degrees.

16. The polishing pad of claim 14, wherein the plurality of first grooves and the plurality of second grooves are arranged alternately.

17. A method for manufacturing a polishing pad, comprising: providing a polishing layer having a polishing surface; andusing a cutting device to form a plurality of first grooves on the polishing surface along a first cutting trajectory direction, and form a plurality of second grooves on the polishing surface along a second cutting trajectory direction, wherein each of the plurality of first grooves is adjacent to the each of the plurality of second grooves, and the first cutting trajectory direction is opposite to the second cutting trajectory direction, and wherein a sidewall of each of the plurality of first grooves has a plurality of first fine burrs that are tipped forward with the first cutting trajectory direction, and a sidewall of each of the plurality of second grooves has a plurality of second fine burrs that are tipped forward with the second cutting trajectory direction.

18. The method of claim 17, wherein the cutting device includes a single cutter.

19. The method of claim 17, wherein the cutting device includes a plurality of cutters, wherein a distance between two adjacent cutters is substantially two times of a distance between the first groove and the second groove adjacent to each other.

20. The method of claim 17, wherein the plurality of first grooves and the plurality of second grooves are circular grooves, and a center of the circle of each of the plurality of first grooves overlaps a center of the polishing pad, and a center of the circle of each of the plurality of second grooves overlaps the center of the polishing pad.

21. The method of claim 20, wherein the first cutting trajectory direction is a clockwise direction and the second cutting trajectory direction is a counterclockwise direction with respect to the center of the polishing pad.

22. The method of claim 17, wherein the plurality of first grooves and the plurality of second grooves are linear grooves, and the plurality of first grooves and the plurality of second grooves are parallel to a Y-axis direction.

23. The method of claim 22, wherein the first cutting trajectory direction is a +Y-axis direction, and the second cutting trajectory direction is a —Y-axis direction.

24. The method of claim 17, wherein the plurality of first grooves and the plurality of second grooves are linear grooves, and the plurality of first grooves and the plurality of second grooves are parallel to a X-axis direction.

25. The method of claim 24, wherein the first cutting trajectory direction is a +X-axis direction, and the second cutting trajectory direction is a —X-axis direction.

26. The method of claim 17, wherein the plurality of first grooves and the plurality of second grooves are radially extending grooves, and with respect to a center of the polishing pad, the plurality of first grooves and the plurality of second grooves are distributed radially outward.

27. The method of claim 26, wherein the first cutting trajectory direction is a direction outward away from the center of the polishing pad, and the second cutting trajectory direction is a direction inward toward the center of the polishing pad.

28. A polishing method, comprising: providing a polishing pad, wherein the polishing pad is the polishing pad of claim 1;applying a pressure to an object to press the object on the polishing pad; andproviding a relative motion to the object and the polishing pad to perform a polishing procedure.

29. A polishing method, comprising: providing a polishing pad, wherein the polishing pad is the polishing pad of claim 8;applying a pressure to an object to press the object on the polishing pad; andproviding a relative motion to the object and the polishing pad to perform a polishing procedure.

30. A polishing method, comprising: providing a polishing pad, wherein the polishing pad is the polishing pad of claim 14;applying a pressure to the object to press the object on the polishing pad; andproviding a relative motion to the object and the polishing pad to perform a polishing procedure.