Claims
- 1. A positive resist composition comprising in admixture a quinone diazide compound prepared by a condensation reaction of naphthoquinone diazide sulfonyl chloride or benzoquinone diazidesulfonyl chloride with a compound having a hydroxyl group in the presence of a weak alkali, and an alkali-soluble novolak resin which is obtainable by a condensation reaction of an aldehyde and a compound of the formula: ##STR17## wherein E.sub.1 to E.sub.9 are the same or different and independently a hydrogen atom, an alkyl group, a halogen atom or a hydroxyl group, provided that at least one of E.sub.1 to E.sub.9 is a hydroxyl group and that at least two of E.sub.1 to E.sub.9 at the ortho- and para-positions to said at least one hydroxyl group are hydrogen atoms.
- 2. The positive resist composition according to claim 1, wherein the compound of formula (VII) is ##STR18##
- 3. The positive resist composition according to claim 1, wherein the compound of formula (VII) is ##STR19##
- 4. The positive resist composition according to claim 1, wherein the compound of formula (VII) is ##STR20##
- 5. The positive resist composition according to claim 1, wherein the compound of formula (VII) is ##STR21##
- 6. The positive resist composition according to claim 1, wherein a phenol compound selected from the group consisting of phenol, m-cresol, p-cresol, o-cresol, p-tert-butylphenol, 2,5-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, 5-methyl-2-tertbutylphenol, m-methoxyphenol, isoamylphenol and bisphenol A, is reacted in the condensation reaction of an aldehyde and a compound of formula (VII).
- 7. The positive resist composition according to claim 6, wherein the molar ratio of the compound of formula (VII) to the phenol compound is from 100:0 to 20:80.
- 8. The positive resist composition according to claim 1, wherein the aldehyde is selected from the group consisting of formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde, benzaldehyde, phenylacetaldehyde, .alpha.-phenylpropylaldehyde, .beta.-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, glutaraldehyde, glyoxal, o-methylbenzaldehyde, and p-methylbenzaldehyde.
- 9. The positive resist composition according to claim 1, wherein the aldehyde is used in an amount of 0.2 to 3 moles per mole of the compound of formula (VII).
- 10. The positive resist composition according to claim 1, wherein the aldehyde is used in an amount of 0.5 to 3 moles per mole of the compound of formula (VII).
Priority Claims (2)
Number |
Date |
Country |
Kind |
2-147737 |
Jun 1990 |
JPX |
|
3-249071 |
Sep 1991 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 07/879,270, filed May 7, 1992, now abandoned, which is a continuation-in-part application of Ser. No. 07/696,193, filed on May 6, 1991, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
711626 |
Oct 1951 |
GBX |
Non-Patent Literature Citations (2)
Entry |
W. S. DeForest, "Photoresist Materials & Processes", McGraw-Hill Book Co., pp. 54-62 (1975). |
Journal of Japan Printing Society, vol. 28, No. 5. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
879270 |
May 1992 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
696193 |
May 1991 |
|