Patent Application
20160293300
1. Field of the Invention
The present invention relates to a preparation method for an electronic component and, more particularly, to a preparation method for an electronic component with an alloy electrode layer.
2. Description of the Related Art
Varistor is a delicate electronic ceramic component that is fabricated from a mixture of a base material, which includes electronic grade zinc oxide (ZnO) powder, and various small amount of additives, such as electronic grade bismuth oxide (Bi2O3), cobalt oxide (Co2O3), manganese dioxide (MnO2), antimony trioxide (Sb2O3), titanium dioxide (TiO2), chromium oxide (Cr2O3), nickel oxide (Ni2O3) and the like added thereto, through mixing, molding and sintering processes, making that the varistor is naturally sensitive to variation of externally applied voltage and it is thus applicable for the varistor to sense and limit all transient overvoltage occurring in circuit and absorb the resulting surge energy.
To lower the fabrication cost of varistor, China patent application number 201110140236.1, entitled “Copper-electrode zinc-oxide voltage sensitive resistor and preparation method thereof”, discloses a conventional technique of doping and sintering base metal using a chain-belt type tunnel furnace under an oxygen-free atmosphere environment. However, the copper electrode of the varistor fabricated by the conventional technique is prone to oxidation under high-temperature operation, which becomes a durability issue for electronic appliances at home or in industrial area. Additionally, as such conventional technique also needs to consume lots of inert gas, despite the cost down effect arising from the base metal, the varistor produced by the conventional technique is not so cost-effective because of the rising auxiliary production costs. Due to the tendency of oxygen absorption, acceptance rate of mass-produced varistors cannot be guaranteed.
An objective of the present invention is to provide a preparation method for an electronic component with an alloy electrode layer targeting at enhancing the reliability of base metal copper electrode under a high-temperature environment upon solving the cost issue of an electronic component with the electrode.
To achieve the foregoing objective, the preparation method for an electronic component with an alloy electrode layer includes steps of:
preparing a ceramic substrate having two opposite surfaces;
printing a metal layer on each of the two opposite surfaces of the ceramic substrate, wherein the material of the metal layer is aluminum;
spraying an alloy layer on an outer surface of each metal layer, wherein the alloy layer is a copper alloy layer, and each metal layer and a corresponding alloy layer stacked on the metal layer form an electrode layer;
connecting a pin to each alloy layer; and
enclosing the ceramic substrate, the electrode layers and a portion of each pin with an insulating layer.
According to the foregoing description of the preparation method, the metal layers and the alloy layers are integrated to form a multilayer structure, which is taken as an electrode layer of the electronic component. In contrast to conventional electrode structure with copper layer only, the present invention employs a copper alloy layer for the electrode layer to keep competitive advantages of being low in production cost and also enhancing reliability of the electronic component at the same time. Given a varistor as an example of the electronic component, the varistor fabricated by the preparation method has a lower varistor voltage variation after the varistor becomes aged and increases the capacity of resisting more combination waves before failure of the varistor.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
With reference to
The two metal layers 21 are respectively formed on two opposite surfaces of the ceramic substrate 1. Each alloy layer 22 is stacked on an outer surface of one of the two metal layers 21, and the multi-layer structure of the metal layers 21 and the alloy layers 22 are taken as an electrode layer of the electronic component. The two pins 3 are electrically connected to the respective alloy layers 22. The insulating layer 4 encloses the ceramic substrate 1, the metal layers 21, the alloy layers 22 and one end of each pin 3 connected to a corresponding alloy layer 22.
With reference to
To depict the fabrication process of a first embodiment of the electronic component in accordance with the present invention, varistor 14471 is chosen to elaborate the following embodiment of the electronic component whose diameter and thickness are 14 mm and 1.8 mm respectively.
Steps of producing the metal layers 21:
1. Clean surfaces of the ceramic substrate 1.
2. Blend glass powder and a binder with pure aluminum powder to acquire an aluminum slurry with a weight percent of aluminum in a range of 65˜75%. The glass powder includes silicon dioxide (SiO2), bismuth oxide (BiO2) and boron trioxide (B2O3) and has a weight percent in a range of 10%˜15%. The binder has a weight percent in a range of 10%˜25% and the contents of the binder include ethylcellulose and terpineol. The aluminum slurry can be coated on a first surface of the ceramic substrate 1 through silk-screen printing.
3. Place the ceramic substrate 1 printed with the aluminum slurry into an oven for baking for 60 minutes at 100° C., remove the ceramic substrate 1 done with the baking, coat the aluminum slurry on a second surface opposite to the first surface through the same silk-screen printing, and place the ceramic substrate 1 back into the oven and bake for 60 minutes at 100° C.
4. Place the ceramic substrate 1 with the first surface and the second surface done with the printing into a tunnel furnace in a temperature range 600° C.˜750° C. for sintering in completion of the fabrication of the metal layer 21.
Steps of producing the alloy layers 22:
Fasten the ceramic substrate 1 with the sintered metal layer 21 on a thermal spray fixture.
With reference to
The two pins 3 are respectively welded on the alloy layers 22 and then epoxy is used to wrap up the ceramic substrate 1, the metal layer 21, the alloy layer 22 and a portion of the pins 3 to form the insulating layer 4. Electrical characteristics of the finished electronic component are further tested.
As shown in the following table, the pair of electrically conductive wires from the second embodiment to the fifth embodiment on the basis of the first embodiment can be a pair of wires made from different alloys, namely, silicon bronze, phosphor bronze, tin bronze, tin phosphor bronze, with different percents of metal contents. Detailed spraying steps already introduced are not repeated here.
Given as an example, an aging test is performed to compare aging characteristics against high-temperature environment among all the embodiments. Test conditions for the high-temperature aging test are 125±2° C., 1000±24 hours and applied voltage VDC=385 V. Varistor voltages before and after the aging test, variation of the varistor voltage, and capacity (times) of combination wave (6 kV/3 kA) resistance are shown in the following table.
As can be seen from the foregoing table, the electronic components with the multi-layer electrode structure produced by printing with aluminum and spraying with copper alloys wires have lower voltage variation after the aging test than the electronic component with the conventional silver printed electrode, and the voltage variation of all the embodiments is lower than 4%. The capacity (times) of combination wave resistance of the electronic components relative to that of the electronic component with the conventional silver printed electrode is increased by 40%.
The shape of the multi-layer electrode in accordance with the present invention includes, but is not limited to, square-shaped, round, oval, tubular, cylindrical and conic. The types of the electronic components in accordance with the present invention may be voltage-sensitive components, gas-sensitive components, positive temperature coefficient (PTC) thermally sensitive components, negative temperature coefficient (NTC) thermally sensitive components, piezoelectric ceramic, ceramic capacitors and the like.
With reference to
Step S401: Prepare a ceramic substrate 1 having two opposite surfaces.
Step S402: Print a metal layer 21 on each of the two opposite surfaces of the ceramic substrate 1. The material of the metal layer 21 is aluminum.
Step S403: Spray an alloy layer 22 on an outer surface of each metal layer 21. The alloy layer 22 is a copper alloy layer. Each metal layer 21 and a corresponding alloy layer 22 stacked on the metal layer 21 form an electrode layer.
Step S404: Connect a pin 3 to each alloy layer 22.
Step S405: Enclose the ceramic substrate 1, the electrode layers and a portion of each pin 3 with an insulating layer 4.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201510158484.7 | Apr 2015 | CN | national |
