Surface contacts

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H05K3/4007

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4007Surface contacts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spectral module and method for manufacturing spectral module
- Patent number 12,181,339
- Issue date Dec 31, 2024
- Hamamatsu Photonics K.K.
- Takafumi Yokino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connections to embedded electronic components
- Patent number 12,156,343
- Issue date Nov 26, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,052,819
- Issue date Jul 30, 2024
- Ibiden Co., Ltd.
- Tomohiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 12,022,622
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board with a conductive bump mounted on an adhesive layer
- Patent number 12,016,133
- Issue date Jun 18, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 12,010,794
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,997,799
- Issue date May 28, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,963,298
- Issue date Apr 16, 2024
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature selection through solder-ball population
- Patent number 11,948,807
- Issue date Apr 2, 2024
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing components to substrate posts
- Patent number 11,950,375
- Issue date Apr 2, 2024
- X Display Company Technology Limited
- David Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid socket warp indicator
- Patent number 11,906,574
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 11,869,834
- Issue date Jan 9, 2024
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit formation method
- Patent number 11,849,545
- Issue date Dec 19, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux dotting tool
- Patent number 11,818,850
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Seungjin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating contact pads for electronic substrates
- Patent number 11,765,826
- Issue date Sep 19, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device
- Patent number 11,765,832
- Issue date Sep 19, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,729,911
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Akinori Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier, package, and method for manufacturing a package
- Patent number 11,723,155
- Issue date Aug 8, 2023
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...
- Publication number 20250106987
- Publication date Mar 27, 2025
- CYNTEC CO., LTD.
- Chia-Fu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD AND ELECTRONIC DEVICE
- Publication number 20250098076
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME
- Publication number 20250048550
- Publication date Feb 6, 2025
- The Charles Stark Draper Laboratory, Inc.
- William A. ROY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES
- Publication number 20240397618
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Martin G. Pineda
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME
- Publication number 20240332234
- Publication date Oct 3, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- KEIKO IKUTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240298409
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Seok Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276642
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Keesu Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240268023
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Yoshiki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER STRUCTURE, METHOD FOR PRODUCING A CARRIER STRUCTURE AND DEV...
- Publication number 20240244760
- Publication date Jul 18, 2024
- ams-OSRAM International GmbH
- Thomas Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237231
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVE MANUFACTURING OF PARTS COMPRISING ELECTROPHORETIC AND ELEC...
- Publication number 20240218545
- Publication date Jul 4, 2024
- FABRIC8LABS, INC.
- Michael Matthews
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240196535
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Heasung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240196532
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyehwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164026
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138076
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240107683
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240074050
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jun Ki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...
- Publication number 20240074047
- Publication date Feb 29, 2024
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Surface contacts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical devices with electrodes on softening polymers and method...

Interconnect structure having conductor extending along dielectric...

Electronic component with metallic cap

Wiring substrate and method for manufacturing wiring substrate

Spectral module and method for manufacturing spectral module

High frequency and high power thin film component

Electrical connections to embedded electronic components

Printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Stackable via package and method

Ceramic electronic component

Circuit board with a conductive bump mounted on an adhesive layer

Printed wiring board and method for manufacturing the same

Method for manufacturing printed circuit board

Electrical devices with electrodes on softening polymers and method...

Printed wiring board and method for manufacturing printed wiring board

Efficient wave guide transition between package and PCB using solde...

Feature selection through solder-ball population

Printing components to substrate posts

Hybrid socket warp indicator

Electroconductive substrate, electronic device and display device

Circuit formation method

Solder composition for use in solder joints of printed circuit boards

Flux dotting tool

Method of fabricating contact pads for electronic substrates

Printed circuit board and electronic device

Interconnect structure having conductor extending along dielectric...

Printed wiring board and method for manufacturing the same

Circuit carrier, package, and method for manufacturing a package

Stackable via package and method

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...

BOARD AND ELECTRONIC DEVICE

TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME

PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

PRINTING COMPONENTS TO SUBSTRATE POSTS

BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CARRIER STRUCTURE, METHOD FOR PRODUCING A CARRIER STRUCTURE AND DEV...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING WIRING SUBSTRATE

ADDITIVE MANUFACTURING OF PARTS COMPRISING ELECTROPHORETIC AND ELEC...

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRING CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...