Patent Application
20110192026
The present invention relates to a press fitting method for heat pipe and heat sink, and particular to a press fitting method applied to computer, electronic or LED lamp device or related heat dissipating technology.
Heat pipe with heat sink are commonly used for the purpose of providing a better heat dissipation to a computer, electronic or LED lamp device. The heat sink is usually a heat conducting plate (base) or a fin module. The heat sink is attached to a heat source so that the heat will be quickly dissipated through the heat pipe connected to the heat sink.
Prior fitting of the heat pipe and the fins of the heat sink is through welding which is complicated method and also not friendly to environment. Each fin needs to be welded with heated intermediate. The flowing melting intermediate is hard to control a well uniformity and gaps are sometimes happened so that the fitting between the fins and the heat pipe is hard to achieve. Therefore, the method is not economic.
Some maker will use conducting glue between the heat pipe and the heat sink and as an adhesive. But the macromolecule glue will be solidified by time and result in gaps so that the heat dissipation will be effected.
Accordingly, the primary object of the present invention is to provide a fitting method for heat pipe and heat sink which is fast, effective, and economic so as to ensure the tight connection and well heat dissipation.
Through the method, the production of the assembly is fast, and the heat dissipation performance is also raised for the needs.
of the fourth embodiment of the present invention.
In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.
Referring to
a) At least a heat pipe 10 and a heat sink 20 conducting heat to the heat pipe 10 are provided. The heat pipe 10 is approximately oval-shaped. The heat sink 20 is one of a plate, base, or fin module capable of conducting heat. The heat sink 20 has a groove 21 for receiving the heat pipe 10 on a side thereof. The heat pipe 10 will be protruded from a surface of the heat sink 20 while being received by the groove 21.
b) The heat pipe 10 is placed into the groove 21. A conductivity medium 30 is smeared around the junction of the heat pipe 10 and the heat sink 20.
c) The end of the heat pipe 10 protruded from the groove 21 is pressed by a press mold 40 so as to be deformed and fit to the groove 21 as one. (shown in
Through the above steps, the heat pipe 10 is tightly fitting to the heat sink 20 so as to achieve a better heat dissipation.
Referring to
The difference between the two embodiments is that a heat pipe 10a of the second embodiment is below (or level with) the surface of the heat sink 20 while being received by the groove 21 of the heat sink 20. The heat pipe 10a is placed into the groove 21. The conductivity medium 30 is smeared to the junction of the heat pipe 10a and the heat sink 20. A press mold 40a has a protrusion for the heat pipe 10a inside the groove 21. An end of the heat pipe 10a pointing out the groove will be pressed by the protrusion of the press mold 40a so as to be deformed and fit to the groove 21.
Referring to
a) At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided. The heat pipe 50 is approximately oval-shaped. The heat sink 60 has a plurality of fin 61. The plurality of fin 61 has a through hole 62 for receiving the heat pipe 50.
b) The heat pipe 50 is placed into the through hole 62. A conductivity medium 70 is smeared to the junction of the heat pipe 50 and the through hole 62. A jig 80 passing through the fins is holding against one side of the heat pipe 50.
c) Another side of the heat pipe 50 against the jig 80 is pressed by a press mold 82. The heat pipe 50 being pressed is deformed towards the fins 61 so that the fins 61 and the heat pipe 50 will be tightly fit together (as shown in
Referring to
a) At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided. The heat pipe 50 is approximately oval-shaped. The heat sink 60 has a plurality of fin 61. The plurality of fin 61 has a through hole 62 for receiving the heat pipe 50.
b) The heat pipe 50 is placed into the through hole 62. A conductivity medium 70 is smeared to the junction of the heat pipe 50 and the through hole 62. A press mold 90 has an upper mold 91 and lower mold 92.
c) The upper mold 91 and the lower mold 92 is passing through the fins 61 and pressing two opposite sides of the heat pipe 50. The heat pipe 50 being pressed is deformed towards the fins 61 so that the heat pipe 50 and the fins 61 will be tightly fit together (as shown in
Referring to
a) At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided. The heat pipe 50 is approximately oval-shaped. The heat sink 60 has a plurality of fin 61. The plurality of fin 61 has a through hole 62 for receiving the heat pipe 50. However, each of the fins 61 has a vertical extension portion 63 capable of attaching to a surface of the heat pipe.
b) The heat pipe 50 is placed into the through hole 62 so that the extension portions 63 of the fins 61 are attached to the heat pipe 50. A conductivity medium 70 is smeared to the junction of the heat pipe 50 and the extension portions 63. At least one press mold 95 is provided.
c) The press mold 95 is pressing towards the extension portions 63. The heat pipe 50 is thus pressed and deformed towards the fins 61 so that the heat pipe 50 and the fins 61 will be tightly fit together.
In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.
