Patent Application
20230122633
The disclosure relates to a printed circuit board, such as a transmission controller, a power electronics and/or for a controller of an actuator of an electric motor, with an electric module arranged on the printed circuit board and protected against aggressive media. An encapsulation of the electric module is led as far as a metallization layer arranged and/or formed on an upper face of the printed circuit board. In addition, the disclosure relates to a transmission controller having the printed circuit board. Furthermore, the disclosure relates to a method for producing a printed circuit board.
Printed circuit boards with electric modules, where the printed circuit board is at least partially encapsulated with a plastics material to protect the electric modules from aggressive media, are known in principle. A printed circuit board of this type is shown, for example, in U.S. Pat. No. 5,744,084A. For encapsulation of the electric module arranged on the printed circuit board, a circumferential dam structure is arranged at a distance from the electric module on the upper face of the printed circuit board. Accordingly, the dam structure is built up on the upper face of the printed circuit board and serves to ensure that a circumferential and protruding edge of an encapsulation or molding tool is seated on the dam structure in order to achieve a seal for the encapsulation process for encapsulation the electric module. Forming a dam structure built additionally onto the printed circuit board requires another process step and additional material, which can increase the cost of the printed circuit board. In addition, depending on the design, the protruding edge of the encapsulation tool may damage the printed circuit board when the encapsulation tool is driven onto the printed circuit board. Likewise, due to the protruding edge, there may be increased wear of the encapsulation or overmolding tool in the region of the edge, so that the encapsulation tool may exhibit increased wear and must be replaced at an early stage.
Proceeding from the known prior art, the present disclosure provides a printed circuit board that has increased protection against corrosive media and that can be produced cost-effectively. In addition, the disclosure provides a method for producing a printed circuit board, with which a printed circuit board can be produced cost-effectively and in a manner that is material-friendly.
One aspect of the disclosure provides a printed circuit board with a printed circuit board core which has an upper face, a metallization layer being formed on at least some sections of the upper face. The metallization layer includes at least one first region and a second region which differs from the first region. An electric module is arranged on the first region and is connected to same in an electrically conductive manner. The second region is arranged and/or formed at a distance to the first region, and the second region surrounds and/or borders the first region. The electric module is encapsulated with a sealing material, where the encapsulation is delimited by the second region.
In other words, it is an aspect of the disclosure to provide a printed circuit board. The printed circuit board may be used in a transmission controller, a power electronics for a fully or at least partially electrically driven motor vehicle and/or in a controller of an actuator for an electric machine, such as a brushless DC motor (BLDC). The printed circuit board has a printed circuit board core. The printed circuit board core may also be referred to as a so-called “prepreg”. The term “prepreg” refers to pre-impregnated fibers, such as a glass fabric, which are saturated with resin. In some examples, the substrate material of the printed circuit board core is an FR4 prepreg. The resin content in the printed circuit board core can be standard resin (SR), medium resin (MR), or high resin (HR), depending on the design and application.
In some implementations, the printed circuit board core has an upper face, where a metallization layer is formed on the upper face at least in some portions. The upper face may be arranged in a direction parallel to the plane of the printed circuit board core. The metallization layer is electrically conductive. In some examples, the metallization layer is formed of aluminum, copper and/or silver or includes at least partially aluminum, copper and/or silver.
In some examples, the metallization layer has at least a first region and a second region different from the first region. The first region and the second region are galvanically isolated from each other on the upper face of the printed circuit board. An electric module is arranged on the first region and is electrically conductively connected thereto. The electrical connection to the first region of the metallization layer and the electric module can be, for example, an integrally bonded connection, such as an adhesive connection, a bonded connection, a sintered connection and/or a soldered connection. The electric module may be a semiconductor, a chip, a MOSFET (metal oxide semiconductor field effect transistor), an IGBT (insulated gate bipolar transistor), an ASIC (application-specific integrated circuit) and/or a sensor, such as a sensor dome.
The second region is spaced apart from and/or formed around the first region, where the second region surrounds and/or borders the first region. It is further conceivable that the plurality of first regions is formed on the upper face of the printed circuit board core, and the plurality of first regions is bordered by the second region.
The electric module arranged on the first region is encapsulated and/or potted with a sealing material. This process is also referred to as “overmolding” or “transfer molding”. It is provided here that the encapsulation is limited by the second region of the metallization layer. In other words, the second metallization layer on the upper face of the printed circuit board core acts as a barrier or boundary for the overmolding process and provides a seal for the injection molding process or overmolding process with the injection molding or overmolding tool. Accordingly, the printed circuit board has a barrier formed on the upper face in the form of a metallization layer, which is generally arranged on the upper face of the printed circuit board core anyway. Accordingly, no additional structure in the form of a dam structure built onto the upper face of the printed circuit board is required to provide a seal for encapsulating the electric module. Thus, due to the second region of the metallization layer formed on the upper face of the printed circuit board core and surrounding the first region at a distance therefrom, a sealing structure for the overmolding process can be provided. The costs of the printed circuit board can be reduced, since only the metallization layer arranged on the upper face of the printed circuit board core is structured in such a way that it forms a sealing contour. By way of the encapsulation, a printed circuit board protected against external, corrosive media, such as oil and/or water, can be provided which can be produced inexpensively.
The material used to encapsulate the electric module, the sealing material, is usually a plastic. The sealing material may also be referred to as potting material. For example, the sealing material can be a thermoplastic. In other examples, the sealing material is a thermoset, such as an epoxy-based thermoset. Such thermosets exhibit increased temperature resistance and increased resistance to external effects or influences. This means that the electric module can be permanently protected from external media, such as oil and/or water.
In some implementations, a material thickness of the first region of the metallization layer in a direction perpendicular to the plane of the printed circuit board core corresponds to a material thickness of the second region of the metallization layer in the direction perpendicular to the plane of the printed circuit board core. In other words, the first region and the second region have an equal material thickness. The first region and the second region may be formed by the metallization layer formed on the upper face of the printed circuit board core by a material-removing process, for example, a chemical removal process such as an etching process. Thus, the first region and the second region can be produced in a simple, cost-effective manner and can have the same material thickness.
In some implementations, it can be provided that a solder resist coating is arranged on the upper face of the printed circuit board, where the solder resist coating is led as far as an outer border of the second region, the outer border is formed on a side of the second region facing away from the first region, and a material thickness of the solder resist coating in a direction perpendicular to the plane of the printed circuit board is greater than the material thickness of the second region. In other words, the thickness of the solder resist coating is greater than the thickness or material thickness of the second region. In this way, with respect to the cross-section of the printed circuit board, a step is formed in the region between the solder resist coating and the second region of the metallization layer. This step, when the encapsulation tool or overmolding tool is seated on and seals with the second region, can act as an additional barrier to prevent possible leakage of a potting material during the molding process.
The solder resist coating has electrically insulating properties. In some examples, the solder resist coating is formed from an epoxy resin. The solder resist coating may have at least partially yielding and/or elastic properties.
In some implementations, the solder resist coating is led as far as an inner border of the second region facing the first region, and the solder resist coating covers the second region. Thus, when the encapsulation tool moves onto and seals against the second region, a slight deformation of the solder resist coating may occur between the metallization layer and the encapsulation tool, such that an increased seal between the metallization layer and the encapsulation tool can be enabled. Thus, an increased seal can be achieved during the overmolding process.
In principle, no solder resist coating is arranged on the first regions of the metallization layer. They are therefore free of solder resist coating.
In some examples, only a second region is provided, which surrounds the first region and is formed at a distance from the first region. It is conceivable that the second region is spiral-shaped and/or helical.
In some implementations, the second region includes a plurality of spaced-apart second regions which are galvanically isolated from each other and are each formed circumferentially. The plurality of juxtaposed second regions can increase the deformability of the second metallization layer when the encapsulation tool is driven onto the printed circuit board, and can also increase a distance between the encapsulation tool and the printed circuit board in the seating region because they have a reduced cross-sectional area. The plurality of separate second regions can extend the path for escaping material, which can increase the sealing effect between the printed circuit board and the overmolding tool.
In some examples, only a first region and a second region are formed on the upper face of the printed circuit board, where the electric module arranged on the upper face is encapsulated or overmolded.
In some examples, the printed circuit board core has a lower face which is arranged at a distance from the upper face and, correspondingly to the upper face, has a metallization layer with a first region and a second region, where an electric module is arranged on the first region, and the electric module is encapsulated with a sealing material, where the encapsulation is bounded by the second region, which is arranged on the lower face. In this way, a printed circuit board is provided which is encapsulated and/or overmolded from both sides at least in some sections.
The printed circuit board core can basically be of single-layer design, where the metallization layer is formed on the upper face and/or the lower face.
In some implementations, the printed circuit board core is multi-layered. Accordingly, the multi-layer printed circuit board core has an upper face and a lower face spaced apart from the upper face, where conductor tracks and/or structured metallization layers spaced apart from one another are arranged in the multi-layer printed circuit board core. The conductor tracks and/or structured metallization layers arranged within the printed circuit board core can be electrically conductively connected to one another by means of vias and/or through-platings. Likewise, the first regions can be electrically conductively connected to the metallization layers arranged within the printed circuit board. The second regions, on the other hand, are not electrically conductively connected to the conductor tracks arranged within the printed circuit board.
Another aspect of the disclosure provides a transmission controller for a motor vehicle, where the transmission controller includes the printed circuit board according to the first aspect of the disclosure.
Yet another aspect of the disclosure provides a method for producing the printed circuit board according to the first aspect of the disclosure. The method including providing a printed circuit board core. The printed circuit board core has an upper face and a metallization layer is arranged on the upper face. The method also includes structuring the metallization layer so that a first region and a second region of the metallization layer, which is different from the first region and galvanically isolated therefrom, are formed on the upper face, and the first region surrounds and/or borders the second region. The method also includesarranging and electrically contacting an electric module on the first region, and arranging the printed circuit board core into an overmolding tool and closing the overmolding tool. The overmolding tool seals with the second region. The method also includes encapsulating and/or overmolding the electric module with a sealing material and opening the overmolding tool and removing the printed circuit board from the overmolding tool.
The overmolding tool may have a return and/or a recess or depression on a side facing the printed circuit board in order to form a cavity in the region of the electronic module arranged on the printed circuit board when the tool is driven onto the printed circuit board core, so that this cavity can be potted with the sealing material. In some examples, the injection molding tool is formed without protrusions circumferentially around the depression. Accordingly, the overmolding tool does not have a protrusion contour that cuts into and/or sits on the printed circuit board when the tool is driven onto the printed circuit board to achieve the seal with the printed circuit board. Such a protrusion has the disadvantage that it can damage the printed circuit board or, for example, the electrical conductor tracks arranged therein. Thus, a material-friendly and cost-effective method for producing the printed circuit board is provided.
The details of one or more implementations of the disclosure are set forth in the accompanying drawings and the description below. Other aspects, features, and advantages will be apparent from the description and drawings, and from the claims.
Like reference symbols in the various drawings indicate like elements.
On the upper face 14 and on the lower face 16, the printed circuit board core 12 has, at least in some sections, a metallization layer 18 which is electrically conductive. The metallization layer 18 may include and/or be formed from aluminum, copper and/or silver, at least in part. In this example, the metallization layer 18 is formed from copper.
The metallization layer 18 has a first region 20 and a second region 22 different from the first region 20. The first region 20 and the second region 22 of the upper face 14 and lower face 16 are galvanically isolated from each other. In other words, the first region 20 and the second region 22 are arranged electrically non-conductively with respect to each other on the respective upper face 14 or lower face 16. An electric module 24 is arranged on the first region 20 and is electrically conductively connected thereto. The electrical connection to the first region 20 of the metallization layer 18 and the electric module 24 can be, for example, an integrally bonded connection, such as an adhesive connection, a bonded connection, a sintered connection and/or a soldered connection. The electric module 24 may be a MOSFET, an IGBT, an ASIC and/or a sensor, such as a sensor dome.
The second region 22 is arranged and/or formed in a spaced manner relative to the first region 20, where the second region 22 surrounds and/or borders the first region 20. Presently, a plurality of first regions 20 are arranged on the upper face 14, which is surrounded by the second region 22.
Further, it is apparent that a material thickness of the first region 20 of the metallization layer 18 in a direction perpendicular to the plane of the printed circuit board core 12 corresponds to a material thickness of the second region 22 of the metallization layer 18 in the direction perpendicular to the plane of the printed circuit board core 12. In other words, the first region 20 and the second region 22 have an equal material thickness. The first region 20 and the second region 22 are preferably formed by the metallization layers 18 formed on the upper face 14 and the lower face 16 of the printed circuit board core 12 by a material-removing process, such as a chemical removal process such as an etching process. Thus, the first region 20 and the second region 22 can be cost-effectively fabricated in a simple manner and have the same material thickness.
The upper tool half 28 sits on the lower tool half 30 and on the upper face 14 of the printed circuit board core 12. In this regard, a first surface 34 surrounding the recess 32 of the upper tool half 28 seals with the second region 22 of the metallization layer 18. The cavity formed between the upper face 14 and the recess 32 of the upper tool half 28 is potted and/or overmolded with a sealing material 36, for example a plastic, such as an epoxy-based thermoset.
Correspondingly to the upper face 14, the lower tool half 30 sits on the upper tool half 28 and on the lower face 16 of the printed circuit board core 12, where a second surface 38 surrounding the recess 32 of the lower tool half 30 seals against the second region 22 of the lower face 16. The cavity formed between the lower face 16 and the recess 32 is potted or overmolded with the sealing material 36.
The first surface 34 of the upper tool half 28 surrounding the recess 32 and the second surface 38 of the lower tool half 30 are formed without protrusions. In other words, the upper tool half 28 and the lower tool half 30 do not have any protrusion on their side facing the printed circuit board 10 for sealing with the printed circuit board 10 for an encapsulation process and/or overmolding process. In this way, an encapsulation of the printed circuit board 10 that is material-friendly can be made possible. Likewise, damage to the printed circuit board 10 as a result of the encapsulation and/or overmolding process can be reduced.
A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the disclosure. Accordingly, other implementations are within the scope of the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2020 208 268.5 | Jul 2020 | DE | national |
This application claims the benefit of International Application PCT/EP2021/066843, filed Jun. 21, 2021, which claims priority to German Application 10 2020 208 268.5, filed Jul. 2, 2020. The disclosures of the above applications are incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/EP2021/066843 | Jun 2021 | US |
| Child | 18145237 | US |
