the conductive material being removed chemically or electrolytically

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CPC
H05K3/06

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/06the conductive material being removed chemically or electrolytically

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing printed circuit boards
- Patent number 12,289,837
- Issue date Apr 29, 2025
- Gebr. Schmid GmbH
- Christian Buchner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure for insertion loss reduction in signal trans...
- Patent number 12,283,488
- Issue date Apr 22, 2025
- Yuan Ze University
- Cheng En Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Closed-cavity printed circuit board
- Patent number 12,284,771
- Issue date Apr 22, 2025
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive substrate and carrier plate wiring structure with filter...
- Patent number 12,279,377
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 12,270,111
- Issue date Apr 8, 2025
- Kateeva, Inc.
- Nava Shpaisman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded electronic component and manufacturing...
- Patent number 12,245,358
- Issue date Mar 4, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fabricating 3D multielectrode arrays with 3...
- Patent number 12,245,369
- Issue date Mar 4, 2025
- University of Oregon
- Timothy Gardner
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Etching device and etching method using the same
- Patent number 12,217,978
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wonje Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making printed wiring board, printed wiring board, and a...
- Patent number 12,185,477
- Issue date Dec 31, 2024
- Ajinomoto Co., Inc.
- Habib Hichri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 12,171,067
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method for pcb with thermal conductor embedded therei...
- Patent number 12,171,057
- Issue date Dec 17, 2024
- SHENGYI ELECTRONICS CO., LTD.
- Lu Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fabrication of superconducting devices that control direct currents...
- Patent number 12,148,974
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Baleegh Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,101,891
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Chao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Superconducting flex circuit boards having metal structures for imp...
- Patent number 12,082,335
- Issue date Sep 3, 2024
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,058,818
- Issue date Aug 6, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
POLYMER-CONDUCTOR MATRIX ELECTRICAL INTERCONNECT
- Publication number 20250151204
- Publication date May 8, 2025
- Worcester Polytechnic Institute
- Pratap Rao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING TRANSMISSION SUBSTRATE
- Publication number 20250151203
- Publication date May 8, 2025
- Sumitomo Electric Industries, Ltd.
- Yuya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250120010
- Publication date Apr 10, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILM, RIGID FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20250113442
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- Byeongkeol KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250106992
- Publication date Mar 27, 2025
- InnoLux Corporation
- Chen-Kuan KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250107001
- Publication date Mar 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250071912
- Publication date Feb 27, 2025
- InnoLux Corporation
- Ming-Chih TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250071896
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
- Publication number 20250069900
- Publication date Feb 27, 2025
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRODE AND CABLE STRUCTURE
- Publication number 20250008643
- Publication date Jan 2, 2025
- Board of Regents, The University of Texas System
- Negar Geramifard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSING DEVICE AND PREPARATION METHOD THEREFOR
- Publication number 20240365474
- Publication date Oct 31, 2024
- Beijing BOE Technology Development Co., Ltd.
- Fanli MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD
- Publication number 20240365469
- Publication date Oct 31, 2024
- FUJIKURA PRINTED CIRCUITS LTD.
- Daisuke Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE AGENT FOR CIRCUIT BOARD RESIN FILM AND PRODUCTION METHOD FO...
- Publication number 20240294846
- Publication date Sep 5, 2024
- NOF Corporation
- Hiroki EZUKA
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240292529
- Publication date Aug 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Inhwan Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent Conductive Circuit
- Publication number 20240276638
- Publication date Aug 15, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BAC...
- Publication number 20240260185
- Publication date Aug 1, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiaxiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the conductive material being removed chemically or electrolytically

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with partially metallized hole using anti-plating...

Method of producing printed circuit boards

Interconnect structure for insertion loss reduction in signal trans...

Closed-cavity printed circuit board

Conductive substrate and carrier plate wiring structure with filter...

Methods for producing an etch resist pattern on a metallic surface

Electrical devices with electrodes on softening polymers and method...

Circuit board with embedded electronic component and manufacturing...

Methods and systems for fabricating 3D multielectrode arrays with 3...

Flexible pressure sensors and user interfaces

Etching device and etching method using the same

Beveled overburden for vias and method of making the same

Printed circuit board having embedded component

Method for making printed wiring board, printed wiring board, and a...

Flexible circuit board and manufacturing method thereof

Method of manufacturing printed wiring board

Manufacturing method for pcb with thermal conductor embedded therei...

Method for manufacturing a ceramic copper circuit board

Printed circuit board

Methods and systems of forming metal interconnect layers using engi...

Fabrication of superconducting devices that control direct currents...

Circuit board and preparation method thereof

Ceramic-copper composite, ceramic circuit board, power module, and...

Circuit board and manufacturing method therefor

Circuit board using thermocouple to dissipate generated heat and me...

Semi-automatic corrosion box of copper clad laminate

Superconducting flex circuit boards having metal structures for imp...

Circuit board and method for manufacturing the same

Methods of manufacturing circuit board and circuit board assembly

Method for manufacturing printed wiring board

Patents Applicationslast 30 patents

POLYMER-CONDUCTOR MATRIX ELECTRICAL INTERCONNECT

METHOD FOR PRODUCING TRANSMISSION SUBSTRATE

WIRING BOARD

COMPOSITE FILM, RIGID FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONI...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

COIL DEVICE AND PRINTED WIRING BOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

Methods And Systems Of Forming Metal Interconnect Layers Using Engi...

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

Metal-ceramic substrate and method for producing a metal ceramic su...

INTEGRATED ELECTRODE AND CABLE STRUCTURE

Circuit board

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

SENSING DEVICE AND PREPARATION METHOD THEREFOR

METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

RELEASE AGENT FOR CIRCUIT BOARD RESIN FILM AND PRODUCTION METHOD FO...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

Transparent Conductive Circuit

Electronic device and manufacturing method thereof

METHOD OF MAKING A BATTERY SENSOR

Interconnect Circuit Methods And Devices

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BAC...

WIRING BOARD