1. Technical Field
The present disclosure relates to a printed circuit board (PCB).
2. Description of Related Art
In notebook computers, memory chips are soldered on motherboards to reduce the thickness of the notebook computers. However, for these notebooks with soldered memory chips the memory capacity cannot be changed. In other notebook computers, the memory chips are not soldered onto the motherboard but are inserted into sockets that align the memory chips almost flat with the motherboard. However, the memory chips or slots still increases the height the motherboard will occupy. Therefore there is room for improvement in the art.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The motherboard 10 defines a gap 15 through the top layer 10 and the other layers. A length of the gap 15 is equal to a length of a memory chip 16. A plurality of golden fingers 18 are set on the motherboard 10 near the gap 15. The golden fingers 18 are electrically connected to the memory controller 12 through traces on the motherboard 10.
Also referring to
The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above everything. The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others of ordinary skill in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those of ordinary skills in the art to which the present disclosure pertains without departing from its spirit and scope. Accordingly, the scope of the present disclosure is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.
Number | Date | Country | Kind |
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99143866 | Dec 2010 | TW | national |