Patent Application
20090324885
This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2008-168499, filed on Jun. 27, 2008, the entire contents of which are incorporated herein by reference.
The embodiments discussed herein are related to a printed substrate that is provided with a plural pads and an electronic device with the printed substrate.
Conventionally, there has been known an electronic device with a printed substrate installed therein. In such a printed substrate, there has been known techniques for ensuring an electronic connection of an electronic component with the printed substrate via solder bumps (see Japanese Laid-open Patent Publication No. 11-40901).
However, when a stress is applied to the printed substrate from any cause, the solder bump may be peeled off from the printed substrate, resulting in an electrical connection failure may occur.
According to an aspect of the embodiments, a printed substrate includes: a plurality of pads provided in a mounting area, and having a polygonal shape, in which an electronic component is mounted; and a hole facing and extending along at least two adjacent sides of the polygonal shape.
Therefore, in a case where the electronic component is mounted on the printed substrate via the solder bump, the concentration of the load on the solder bump, which is arranged at a corner portion defined by two adjacent sides of the polygonal shape, is prevented. Therefore, the peeling of the solder bump and the printed substrate is prevented, and the electronic connection failure of the electronic component and the printed substrate can be prevented.
The object and advantage of the embodiment will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the embodiment, as claimed.
A description will be given of an embodiment below.
The notebook computer 1 includes a display portion 10 and a main portion 20. The display portion 10 is coupled to the main portion 20 by hinge (not illustrated) so as to be openable and closable.
The CPU 45 controls the entire operation of the notebook computer 1. The hard disk 70 stores various programs, data, and the like. The memory slot 80 is provided for mounting a memory module such as a RAM (Random Access Memory) on the printed substrate 30.
The holes 38 are provided for fixing the printed substrate 30 within the housing of the main portion 20 by screws. Thus, the printed substrate 30 is secured in the main portion 20. The package 50 has a square shape, and may have a rectangular shape. The square shape and the rectangular shape correspond to the polygonal shape.
Next, a description will be given of the package 50 in more detail.
A semiconductor chip 51 is built in the package 50. Additionally, plural pads 52 are provided on a bottom surface of the package 50 in a grid pattern. Solder bump (hereinafter referred to as a bump) 53 is bonded to the pad 52. Plural pads 32 bonded to the bumps 53 are provided on the printed substrate 30. The semiconductor chip 51 is electrically connected with the pad 52 via wires (not illustrates). A wiring pattern electrically connecting with the pads 32 are provided on the printed substrate 30. As mentioned above, the electrical connection of the package 50 and the printed substrate 30 is ensured.
As illustrated in
The four holes 35 are provided to be each extending along two adjacent sides of the mounting area 30R. In other words, the four holes 35 includes a first hole extending along a first side and a second side of the polygonal shape of the mounting area 30R; and a second hole extending along a third side and a forth side of the polygonal shape of the mounting area 30R. Further, the four holes 35 includes a third hole extending along the first side and the forth side of the polygonal shape; and a forth hole extending along the second side and the third side of the polygonal shape. Herein, the first side and the third side of the polygonal shape oppose to each other, and the second side and the forth side of the polygonal shape oppose to each other. Furthermore, these four holes 35 are apart from one another.
In this manner, when a deformation such as a bending is caused in the printed substrate 30, the hole 35 formed to faces the corner portion 55 will absorb the deformation. This reduces the load applied to the corner portion 55 of the package 50, namely, to the bump 53a.
A description will be given of the reason why the hole 35 is arranged to face the corner portion 55. For example, if the notebook computer 1 is dropped, the printed substrate 30 is deformed by the impact. The bump 53 may be peeled off from the printed substrate 30 by the deformation of the printed substrate 30. Specifically, the bump 53a, which is one of the bumps 53 and which is arranged closest to a corner, will be peeled off with ease. The reason will be described below. Regarding the bumps 53 other than the bump 53a arranged closest to a corner, the joint of the package 50 and the printed substrate 30 is maintained by the adjacent bumps 53. However, regarding the bump 53a arranged closest to a corner, since the numbers of the bumps 53 adjacent to the bump 53a is smaller, the bump 53a is considered to be peeled off with ease.
Therefore, the hole 35 is provided to face the corner portion 55, thereby reducing the load applied to the bump 53a. This prevents the bump 53a from being peeled off from the printed substrate 30. Therefore, an electrical connection of the printed substrate 30 and the package 50 is ensured, and the failure of the notebook computer 1 is prevented.
Additionally, since an electrical component generating heat is mounted on the printed substrate 30, the heat may be transmitted to the printed substrate 30, so that the printed substrate 30 may be thermally expanded in some cases. Specifically, the CPU 45 and the hard disk 70 generate heat and the circumference thereof becomes high temperatures, so that the heat distribution of the printed substrate 30 becomes uneven. Additionally, the CPU 45 is mounted on the front surface of the printed substrate 30, so that a temperature difference occurs between the front and rear surfaces of the printed substrate 30. The printed substrate 30 may be deformed such as bended by such uneven heat distribution. The load which is applied to the bump 53a and which is caused by the thermal influence may be reduced.
Additionally, in a case where lead-free solders used for the bumps 53 in light of environmental issues, the joint force may be reduced to peel the bump 53a. However, be employing the printed substrate according to the present embodiment, even when the lead-free solder is used, the bump 53a is peeled off.
As illustrated in
For example, the length of the hole 35 may be formed to reach the middle in the each side of the package 50. However, the hole 35 is made too long, the wiring pattern ensuring the electrical connection of the bumps 53 will be interrupted. In addition, the mounting area of the other electrical component will be smaller. Therefore, the length and the size of the hole 35 are preferably set to face the corner portion 55 in light of the wiring pattern, the mounting area, and the prevention of the peel off of the bumps 53.
Additionally, to prevent the bump 53a from being peeled off, an adhesion bond is applied around the bump 53a to strengthen the joint bonding. However, the application of the adhesion bond causes the weight of the printed substrate 30 to be increased by the adhesion bond. Additionally, since the application of the adhesion bond is performed after the package 50 is mounted on the printed substrate 30, the work becomes complicated. In the present embodiment, however, the holes 35 are provided in the printed substrate 30, thereby reducing the printed substrate 30 in weight. The outer shape of the printed substrate 30 and the hole 35 are integrally formed by the routing, thereby improving the efficiency in the workability. The improved efficiency in the workability can reduce the manufacturing cost.
Additionally, the shape of the hole 35 is a substantially L shape and is not limited to this shape. For example, the shape of the hole 35 may be a substantially C shape.
Next, a description will be given of variations of the printed substrate. Additionally, in the variations discussed below, like numerals depict like members or components according to the above embodiment to avoid duplication of explanation.
Further, if a deformational direction of the printed substrate 30a can be estimated beforehand, the hole 35a may be arranged at a position that is effective for the prevention of the deformation. For example, since the positions in which the printed substrate 30a is fixed within the housing of the main portion 20 by screws are preliminarily recognized, the bending amount of the printed substrate 30a at each position can be estimated. Further, the position of an electrical component generating heat is preliminarily given. Therefore, the hole 35a may be arranged at a position having a maximal value, by estimating the maximal value of the von mises stress of the four corner portions 55.
The holes 35b are divided, so that the wiring pattern is formed between the holes 35b. Especially, the formation of the wiring pattern connecting with the bump 53a is facilitated.
In addition, the holes 35b are divided into two by the diagonal line of the package 50. However the holes are not limited to the configuration, and may be divided into two to face one of the corner portions 55. Thus, the wiring pattern is formed between the holes.
The holes 35a to 35d according to the variations mentioned above are formed by the routing.
The shape of the hole is not limited to the above described shapes. In the above embodiments, the notebook computer is described as an example of the electrical device. However, the electrical device is not limited to this, and may be a desktop computer. Further, the electrical device may be a mobile phone and a portable device such as a portable external hard disk drive. The present invention is not limited to the BGA package, and the CSP (Chip Size Package) including a package having a size substantially identical with a semiconductor chip may be employed.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be constructed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiment of the present inventions has been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the sprit and scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2008-168499 | Jun 2008 | JP | national |
