This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2009-174568, filed on Jul. 27, 2009, the entire contents of which are incorporated herein by reference.
The embodiment discussed herein is related to a printed wiring board, an electronic device provided with the printed wiring board and a manufacturing method of the printed wiring board.
In some printed wiring boards, mesh fibers constituted of warp fibers and weft fibers are embedded for suppressing extension and contraction due to temperature and humidity and for reinforcing strength. As the fibers to be embedded in the printed wiring boards, glass fibers are typically used.
In recent years, wiring on the printed wiring board has become denser, and the signals which are transmitted by the wiring have become higher-frequency signals. In accordance with this, higher characteristics have been required of printed wiring boards. When the characteristics of the printed wiring boards are to be further enhanced, the relation of the direction of the embedded fibers and the direction of the wiring becomes a problem, and it is known that the characteristics are more enhanced when these directions are slightly shifted from each other than when these directions correspond to each other. On printed wiring boards, wirings are generally printed parallel with one side of the printed wiring boards. Therefore, when such a printed wiring board having the directions of fibers and wirings shifted from each other is cut out from the sheet material with the fibers being embedded, which becomes a basis for cutting the printed wiring board, the printed wiring board is cut out so that the sides are formed, which are oblique with respect to the direction of extension of the fibers in the sheet material.
Here, the sheet material to be the basis for cutting of the printed wiring board is a rectangular sheet material, and in the sheet material, fibers extending in the direction along one side of the rectangular sheet material and the direction orthogonal to that direction are embedded. Therefore, when the rectangular printed wiring board with the directions of the fibers and wirings being shifted from each other is to be cut out from the sheet material, the printed wiring board is cut out in the orientation in which the sides of the printed board become oblique with respect to the sides of the sheet material. However, when the printed wiring board is to be cut out obliquely, a sheet material in a larger size needs to be prepared, as compared with the case of cutting the printed wiring board so that the sides of the sheet material and the sides of the printed wiring board become parallel with each other. Preparation of the sheet material in a larger size is likely to increase the cost correspondingly.
Meanwhile, it is conceivable to embed fibers obliquely in the process of manufacture of the sheet material to be the basis for cutting of the printed wiring board. When the printed wiring board is to be cut out from the sheet material in which the fibers are obliquely embedded, the printed wiring board may be cut out so that the sides of the sheet material and the sides of the printed wiring board cut out from the sheet material become parallel with each other as in the conventional technique. In this case, as compared with the case of cutting the printed wiring board is obliquely, waste is not caused at the point of time when the printed wiring board is cut out, but large waste is likely to occur in the step of manufacture of the sheet material.
Here, in order that a plating solution hardly penetrate to the wiring along the fibers embedded in the printed wiring board from the through-holes provided in the printed wiring board, it is proposed to make the direction of the embedded fibers and the direction of the wiring differ from each other.
Patent document 1: Japanese Laid-open Patent Publication No. S61-42992.
Patent document 2: Japanese Laid-open Patent Publication No. S61-47844.
According to a first aspect of the invention, a first printed wiring board of the printed wiring board disclosed in the present invention is formed by performing cutting in a rectangular region having sides oblique to sides of a rectangular sheet material from the rectangular sheet material formed from glass cloth fibers. The first printed wiring board is a printed wiring board which is cut out in a state in which at least one corner of the printed wiring board extends off a cuttable region of the rectangular sheet material.
Further, according to a second aspect of the invention, a second printed wiring board of the printed wiring board disclosed in the present invention is a printed wiring board which is formed from glass cloth fibers and has each side formed without being along stitches of the glass cloth fibers. Here, in the second printed wiring board, at least one corner of the printed wiring board has a chipped region along at least one stitch of the glass cloth fibers.
Further, according to a third aspect of the invention, an electronic device is provided with a printed wiring board of the present invention.
Further, according to a fourth aspect of the invention, a manufacturing method includes cutting out, from a rectangular sheet material formed from glass cloth fibers, a rectangular region having sides which are oblique to sides of the rectangular sheet material in a state in which at least one side extends off a cuttable region of the rectangular sheet material.
The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
Hereinafter, an embodiment of the present invention will be described.
The sheet material to be the basis of cutting of the printed wiring board is a rectangular sheet material, and sheet materials of a number of sizes are present. However, selectable sizes differ stepwise as sheet materials 10A and 10B illustrated in parts (A) and (B) of
Further, glass fibers which extend vertically and laterally and expand in a mesh shape are embedded in the sheet materials 10A and 10B.
Parts (A) and (B) of
As illustrated in these marks 100A and 100B, the glass fibers 101A and 101B extend in the directions parallel with and orthogonal to one sides of the sheet materials 10A and 10B. Meanwhile, the wirings 102A and 102B on the printed wiring boards 20A and 20B extend in the oblique directions when the sheet materials 10A and 10B are set as the references. This is based on the knowledge that the electric characteristics of the wirings 102A and 102B may be enhanced by extending the wirings 102A and 102B obliquely with respect to the glass fibers 101A and 101B.
In this case, in order to form the wirings 102A and 102B parallel with one sides of the printed wiring board 20A and 20B, the sheet materials 10A and 10B are obliquely cut as illustrated in parts (A) and (B) of
The description so far is the same in the case of the comparative example illustrated in part (A) of
These first portion 211B and second portion 221B are formed not to extend off the product area 12B of the sheet material 10B due to the dimensional limitation of the sheet material 10B. As compared with the printed wiring board 20A in which the upper side 21A and the lower side 22A are linearly cut as part (A) of
Further, as illustrated in parts (A) and (B) of
The sheet material 10A illustrated in part (A) of
Further, parts (A) and (B) of
In the examples of
In the case of the comparative example illustrated in part (A) of
The area of the region cut from the rectangle of the printed wiring board 40B illustrated in
Here, the outer shape (outline) of the printed wiring board is determined (step S1), and thereafter, pattern design is performed, that is, the wiring which is placed inside the outer shape is designed (step S2). In the pattern design, the wiring pattern, which is given an allowance in the corners or perimeter, is desirably designed so that the wiring is not cut even if the corners are slightly cut, as shown in part (B) of
Next, determination of the wiring specifications is performed (step S3). Here, the width of the wiring pattern, the number of wiring layers and the manufacturing method of the wiring are determined.
Next, manufacturing specified size, that is, selection by the size of the sheet material is performed (step S4). A printed wiring board plan is disposed on the sheet material, the sheet plan, that is, the drawing of the sheet material, on which the plan of cutting the printed wiring board and the coupon board is drawn, is determined (step S5).
Here, in designing of the wiring pattern (step S2), a little allowance is given to the perimeter so that the wiring pattern is not arranged on the area close to the perimeter of the printed wiring board, whereby the sheet material in the next smaller size may be selected as in part (B) of
The printed wiring boards illustrated in part (B) of
According to the printed wiring board, the electronic device and the manufacturing method of the printed wiring board disclosed in the present invention, at the time of performing cutting obliquely to the embedded fibers, the size of the sheet material to be the basis of the cutting is suppressed, and therefore, cost may be suppressed.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiment(s) of the present invention has(have) been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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2009-174568 | Jul 2009 | JP | national |