Probe card capable of multi-probing

Abstract

A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages of the invention will be apparent from the more particular description of preferred aspects of the invention, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. In the drawings, the thickness of layers and regions are exaggerated for clarity.

FIG. 1 is a schematic view of a probe card according to the related art.

FIG. 2 is a schematic top view of a probe card capable of multi-probing according to an embodiment of the present invention.

FIG. 3 is a schematic sectional view taken along line III-III of FIG. 2.

FIG. 4 is a schematic sectional view taken along line IV-IV of FIG. 2.

FIGS. 5A and 5B are sectional views illustrating a process for selecting or non-selecting a test board of a test module in a probe card depicted in FIG. 2.

FIGS. 6A and 6B are schematic top views of a probing portion of a probe card depicted in FIG. 2.

Claims

1. A probe card capable of multi-probing, comprising: a printed circuit board (PCB) having a plurality of contact portions disposed on a first surface thereof; anda test module having a plurality of test boards,wherein each of the test boards includes at least one probing portion on which a plurality of needles are arrayed and the test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.

2. The probe card of claim 1, wherein the probe portions of the test boards are different in an array configuration from each other.

3. The probe card of claim 2, wherein the probe portions of the test boards are-identical in a needle array configuration to each other or partly different in the needle array configuration from each other.

4. The probe card of claim 1, wherein the probe portions of the test boards are identical in an array configuration to each other and different in a needle array configuration from each other.

5. The probe card of claim 1, wherein the test boards are interlocked and, when one of the test boards is selected, the selected test board contacts the first surface of the PCB through the contact portions and other test boards that are not selected do not contact the first surface of the PCB.

6. The probe card of claim 5, wherein there is a predetermined difference between a distance from a second surface of the PCB, which is opposite to the first surface, to extreme ends of the needles arrayed on the probing portion of the selected test board and a distance from the second surface of the PCB to extreme ends of the needles arrayed on the probing portions of the test boards that are not selected.

7. The probe card of claim 6, wherein the predetermined difference is about 5 mm.

8. A probe card capable of multi-probing, comprising: a PCB having a plurality of contact portions disposed on a first surface thereof;a test module having a plurality of test boards each having at least one probing portion on which a plurality of needles are arrayed, the test board being provided at a side surface with an insertion groove; anda fixing member for fixing each test board and disposed on the first surface of the PCB.

9. The probe card of claim 8, wherein each of the test boards is formed in the form of a push button moving in a vertical direction to the PCB.

10. The probe card of claim 9, further comprising an elastic member disposed between the PCB and each of the test boards to bias the test board upward in the vertical direction to the PCB.

11. The probe card of claim 10, wherein the elastic member comprises a spring.

12. The probe card of claim 10, wherein the fixing member includes a locking member formed on a surface facing the side surface of the test board on which the insertion groove is formed.

13. The probe card of claim 12, wherein when one of the test boards is selected, the locking member is inserted in the insertion groove of the selected test board to allow the selected test board to contact the PCB through the contact portions while the test boards that are not selected are biased by the elastic members so as not to contact the PCB.

14. The probe card of claim 12, wherein the locking member is disposed between the PCB and the test board to be movable leftward and rightward.

15. The probe card of claim 14, wherein the locking member includes a projection that is inclined as it goes from the test board toward the PCB.

16. The probe card of claim 8, wherein there is a predetermined difference between a distance from a second surface of the PCB, which is opposite to the first surface, to extreme ends of the needles arrayed on the probing portion of the selected test board and a distance from the second surface of the PCB to extreme ends of the needles arrayed on the probing portions of the test boards that are not selected.

17. The probe card of claim 16, wherein the predetermined difference is about 5 mm.