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4624896 | Watanabe et al. | Nov 1986 | |
4795670 | Nishigaki et al. | Jan 1989 | |
4912399 | Greub et al. | Mar 1990 | |
5665459 | Fukuta et al. | Sep 1997 | |
5701085 | Malladi et al. | Dec 1997 |
Number | Date | Country |
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7-231019 | Aug 1995 | JP |
Entry |
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Y. Nakata et al., “A Wafer-Level Burn-in Technology Using the Contactor Controlled Thermal Expansion”, Proc. of 1997 International Conference and Exhibition on Multichip Models, pp. 259-264, Apr. 1997. |