Claims
- 1. A planarity adjustment mechanism for a probe contact system for establishing electrical connection with contact targets, comprising:
a contact substrate having a large number of contactors mounted on a surface thereof; a probe card for mounting the contact substrate for establishing electrical communication between the contactors and a test head of a semiconductor test system; means for fixedly mounting the contact substrate on the probe card; a probe card ring attached to a frame of the probe contact system for mechanically coupling the probe card to the frame; and a plurality of connection members for connecting the probe card to the probe card ring at three or more locations on the probe card, the connection member being adjustable for changing a gap between the probe card and the probe card ring.
- 2. A planarity adjustment mechanism for a probe contact system as defined in claim 1, further comprising a gap sensor for measuring a gap between the contact substrate and a target substrate at predetermined locations of the contact substrate where the target substrate includes a semiconductor wafer to be tested and a reference plate prepared for adjusting the planarity.
- 3. A planarity adjustment mechanism for a probe contact system as defined in claim 1, further comprising a rotation adjustment device for adjusting the connection member so that the gap between the probe card and the probe card ring is regulated, thereby adjusting the distances between the tips of the contactors and the contact target to be identical to one another.
- 4. A planarity adjustment mechanism for a probe contact system as defined in claim 1, further comprising a conductive elastomer provided between the contact substrate and the probe card for electrically connecting the contact substrate and the probe card.
- 5. A planarity adjustment mechanism for a probe contact system as defined in claim 1, wherein the connection member for connecting the contact substrate and the probe card is configured by bolts and nuts.
- 6. A planarity adjustment mechanism for a probe contact system as defined in claim 1, wherein the connection member for connecting the contact substrate and the probe card is configured by differential screws.
- 7. A planarity adjustment mechanism for a probe contact system as defined in claim 2, wherein the gap sensor determines the gap between the contact substrate and the target substrate by measuring capacitance between the gap sensor and an opposing electrode.
- 8. A planarity adjustment mechanism for a probe contact system as defined in claim 2, wherein the gap sensor is provided either on the upper surface of the target substrate or the bottom surface of the contact substrate.
- 9. A planarity adjustment mechanism for a probe contact system as defined in claim 2, wherein the reference plate is made of a ceramic or alumina substrate having electrodes at positions opposite to the gap sensor.
- 10. A planarity adjustment mechanism for a probe contact system as defined in claim 1, wherein the reference plate is a metal plate for adjusting the planarity of the contactors on the contact substrate in such a way that all of the tips of the contactors contact the surface of the reference plate at substantially the same time with substantially the same pressure.
- 11. A planarity adjustment mechanism for a probe contact system as defined in claim 1, wherein each of the three locations of the connection members on the probe card corresponds to a vertex of a regular triangle.
- 12. A planarity adjustment mechanism for a probe contact system as defined in claim 3, wherein the connection member for connecting the probe card and the probe card ring is configured by bolts and nuts, and the nuts are rotatably supported on the surface of the probe card, and wherein the rotation adjustment device having a bottom opening which engages with the nut is placed on the surface of the probe card for rotating the nuts in such a way that the gaps between the contact substrate and the target substrate at a plurality of locations become identical to one another.
- 13. A planarity adjustment mechanism for a probe contact system as defined in claim 12, wherein the rotation adjustment device is formed of a top knob, a lower knob and a knob base wherein the top knob and the lower knob are mechanically connected to each other while the lower knob and the knob base are rotatably attached to each other, and wherein the knob base is fixedly engaged with the probe card while the top knob having a lower extended portion having the bottom opening rotates the nut to adjust the gap at each of the three locations.
- 14. A planarity adjustment mechanism for a probe contact system as defined in claim 13, wherein the lower knob of the rotation adjustment device is provided with a plurality of retaining holes for mounting therein plungers and springs in such a way the lower tips of the plunger protrude from a bottom surface of the lower knob by resilience produced by the springs, and the knob base of the rotation adjustment device is provided with a plurality of radial grooves so that the lower tips of the plunger engages with the grooves when the upper and lower knobs are rotated, and wherein the pitch of the retaining holes and the pitch of the radial grooves are different from one another.
- 15. A planarity adjustment mechanism for a probe contact system as defined in claim 14, wherein the plungers are made of low friction plastic or lubricated plastic.
- 16. A planarity adjustment mechanism for a probe contact system as defined in claim 4, further comprising a support frame provided between the contact substrate and the conductive elastomer for supporting the contact substrate wherein the connection member is extended between the probe card and the support frame.
- 17. A planarity adjustment mechanism for a probe contact system as defined in claim 4, wherein the conductive elastomer is comprised of a silicon rubber sheet and metal filaments running in a vertical direction so as to establish communication only in the vertical direction.
- 18. A planarity adjustment mechanism for a probe contact system for establishing electrical connection with contact targets, comprising:
a contact substrate having a large number of contactors mounted on a surface thereof; a probe card for mounting the contact substrate for establishing electrical communication between the contactors and a test head of a semiconductor test system; means for fixedly mounting the contact substrate on the probe card; an intermediate ring attached to an outer area of the probe card; a probe card ring attached to a frame of the probe contact system for mechanically coupling the probe card to the frame through the intermediate ring; and a plurality of connection members for connecting the intermediate ring to the probe card ring at three or more locations on the intermediate ring, the connection member being adjustable for changing a gap between the intermediate ring and the probe card ring.
- 19. A planarity adjustment mechanism for a probe contact system as defined in claim 18, further comprising a gap sensor for measuring a gap between the contact substrate and a target substrate at predetermined locations of the contact substrate where the target substrate includes a semiconductor wafer to be tested and a reference plate prepared for adjusting the planarity.
- 20. A planarity adjustment mechanism for a probe contact system as defined in claim 18, further comprising a rotation adjustment device for adjusting the connection member so that the gap between the intermediate ring and the probe card ring is regulated, thereby adjusting the distances between the tips of the contactors and the contact target to be identical to one another.
- 21. A planarity adjustment mechanism for a probe contact system as defined in claim 18, further comprising a conductive elastomer provided between the contact substrate and the probe card for electrically connecting the contact substrate and the probe card.
- 22. A planarity adjustment mechanism for a probe contact system as defined in claim 19, wherein the gap sensor determines the gap between the contact substrate and the target substrate by measuring capacitance between the gap sensor and an opposing electrode.
- 23. A planarity adjustment mechanism for a probe contact system as defined in claim 19, wherein the gap sensor is provided either on the upper surface of the target substrate or the bottom surface of the contact substrate.
- 24. A planarity adjustment mechanism for a probe contact system as defined in claim 18, wherein the reference plate is made of a ceramic or alumina substrate having electrodes at positions opposite to the gap sensor.
- 25. A planarity adjustment mechanism for a probe contact system as defined in claim 20, wherein the connection member for connecting the intermediate ring and the probe card ring is configured by bolts and nuts, and the nuts are rotatably supported on the surface of the intermediate ring, and wherein the rotation adjustment device having a bottom opening which engages with the nut is placed on the surface of the probe card for rotating the nuts in such a way that the gaps between the contact substrate and the target substrate at three or more locations become identical to one another.
- 27. A planarity adjustment mechanism for a probe contact system as defined in claim 18, further comprising a support frame provided between the contact substrate and the conductive elastomer for supporting the contact substrate wherein the connection member is extended between the probe card and the support frame.
- 28. A planarity adjustment mechanism for a probe contact system for establishing electrical connection with contact targets, comprising:
a contact substrate having a large number of contactors mounted on a surface thereof; a probe card for mounting the contact substrate for establishing electrical communication between the contactors and a test head of a semiconductor test system; means for fixedly mounting the contact substrate on the probe card; a probe card ring attached to a frame of the probe contact system for mechanically coupling the probe card to the frame; a plurality of connection members for connecting the probe card to the probe card ring at three or more locations on the probe card, the connection member being adjustable for changing a gap between the probe card and the probe card ring; a gap sensor for measuring a gap between the contact substrate and a target substrate at predetermined locations of the contact substrate; a controller for generating a control signal based on a detection signal from the gap sensor indicating a size of the gap between the contact substrate and the target substrate; and a motor for driving the connection member based on the control signal from the controller.
- 29. A planarity adjustment mechanism for a probe contact system as defined in claim 18, wherein the gap sensor determines the gap between the contact substrate and the target substrate by measuring capacitance between the gap sensor and an opposing electrode.
- 30. A planarity adjustment mechanism for a probe contact system as defined in claim 28, wherein the gap sensor is provided either on the upper surface of the target substrate or the bottom surface of the contact substrate.
Parent Case Info
[0001] This is a continuation-in-part of U.S. application Ser. No. 09/583,837, filed May 31, 2000.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09583837 |
May 2000 |
US |
Child |
09885437 |
Jun 2001 |
US |