Probe head with machine mounting pads and method of forming same

Abstract

A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a probe head as is known in the art.

FIG. 2 illustrates a probe card assembly as is known in the art.

FIG. 3 illustrates a probe head according to an embodiment of the present invention.

FIG. 4 a illustrates a mounting technique according to an embodiment of the present invention.

FIG. 4 b illustrates another mounting technique according to an embodiment of the present invention.

FIG. 5 illustrates another mounting technique according to an embodiment of the present invention.

FIGS. 6-8 illustrate steps for forming mounting pads on a probe contactor substrate according to an embodiment of the present invention.

FIG. 9 illustrates a probe card assembly according to an embodiment of the present invention.

FIG. 10 illustrates a probe card assembly incorporating a sub-mount according to an embodiment of the present invention.

Claims

1. A probe head for testing semiconductor wafers, comprising: a probe contactor substrate having a top side and a bottom side;a plurality of probe contactor tips coupled to the bottom side, the plurality of probe contactor tips lying substantially in a first plane; anda plurality of sub-mounting structures on the top side, each mounting structure having an upper surface planarized such that each upper surface lies substantially in a second plane, wherein the first plane is substantially parallel to the second plane, and each upper surface is adapted to be attached to another mounting structure.

2. The probe head of claim 1, wherein the plurality of sub-mounts are lithographically plated to the probe contactor substrate.

3. The probe head of claim 1, wherein the plurality of sub-mounts include at least one recessed portion adapted for receiving one of an adhesive or a solder.

4. The probe head of claim 1, wherein the plurality of sub-mounts are metal.

5. The probe head of claim 1, wherein the probe contactor substrate is of non-uniform thickness

6. The probe head of claim 1, wherein the first plane is less than 10 μm from parallel of the second plane.

7. A probe card assembly, comprising: a wiring board;a probe contactor substrate having a top side and a bottom side;a plurality of probe contactor tips coupled to the bottom side, the plurality of probe contactor tips lying substantially in a first plane; anda plurality of sub-mounting structures on the top side, each mounting structure having an upper surface planarized such that each upper surface lies substantially in a second plane, wherein the first plane is substantially parallel to the second plane, and each upper surface is adapted to be coupled to wiring board,

8. The probe card assembly of claim 7, further including an interposer coupled between the probe contactor substrate and the wiring board.

9. The probe card assembly of claim 7, further including at least one post coupled between the wiring board and at least on of the plurality of sub-mounts, wherein the post is adhesively bonded to the at least one of the plurality of sub-mounts.

10. The probe card assembly of claim 9, wherein the at least one of the plurality of sub-mounts has a recessed portion adapted to receive one of an adhesive or a solder.

11. The probe card assembly of claim 10, wherein the recessed portion is an adhesive well.

12. The probe card assembly of claim 7, wherein the first plane is less than 10 μm from parallel of the second plane.

13. The probe card assembly of claim 7, wherein the probe contactor substrate is of non-uniform thickness.

14. The probe card assembly of claim 7, wherein the plurality of sub-mounts are lithographically plated to the probe contactor substrate.

15. The probe card assembly of claim 7, further including a clamp coupled to at least one of the plurality of sub-mounts, the clamp at least partially securing the wiring board to the at least one sub-mount.