Claims
- 1. A process for preparing a semiconductor device comprising the steps of depositing a photosensitive material on a substrate comprising a semiconductor material, irradiating said photosensitive material with electromagnetic radiation in a desired pattern, developing said pattern with an alkaline composition, and completing the fabrication of said semiconductor device wherein said photosensitive material comprises a mixture of an o,o'-dinitroarylmethyl ester of a carboxylic acid and a polymer which is soluble in said alkaline composition, said o,o'-dinitroarylmethyl ester being represented by the formula ##STR7## where R.sub.1 is a substituent chosen so that a salt of the carboxylic acid, R.sub.1 COOH, is sufficiently soluble in water to produce at least a 0.01M solution and R.sub.1, R.sub.2 and R.sub.3 are chosen so that the ratio expressed as 1:n of the solubility rate of said unexposed to said exposed portions is such that n is at least 4.
- 2. The process of claim 1 wherein said substrate is a silicon wafer.
- 3. The process of claim 1 wherein said o,o'-dinitroarylmethyl ester is an o,o'-dinitrobenzyl ester.
- 4. The process of claim 1 wherein said value of n is at least 10.
- 5. The process of claim 1 wherein R.sub.1 corresponds to the R.sub.1 in the carboxylic acid, R.sub.1 COOH and wherein said carboxylic acid is chosen from the group consisting of N-adamantylphthalamic acid, cholic acid, deoxycholic acid, lithocholic acid, 5.beta.-cholanic acid, O,O,O-tris(trimethylsilyl)cholic acid, O,O,O-tris(trifluoroacetyl)cholic acid, O,O,O-triacetylcholic acid, O,O,O-tripivaloylcholic acid, and O,O-diacetylcholic acid.
- 6. The process of claim 1 wherein said polymer comprises a copolymer of methyl methacrylate and methacrylic acid.
- 7. The process of claim 1 wherein the amount of said o,o'-dinitroarylmethyl ester to said polymer is in the range 5 to 40 weight percent.
- 8. The process of claim 1 wherein said alkaline composition comprises an aqueous Na.sub.2 CO.sub.3 solution.
- 9. The process of claim 1 wherein said alkaline composition comprises an aqueous solution of Na.sub.2 CO.sub.3 and NaHCO.sub.3.
- 10. The process of claim 1 wherein said polymer has a molecular weight ranging from about 20,000 to about 200,000.
- 11. The process of claim 10 wherein said polymer has a molecular weight from about 30,000 to about 70,000.
Parent Case Info
This is a continuation-in-part of U.S. patent application Ser. No. 265,554 filed on May 22, 1981 now U.S. Pat. No. 4,400,461 by Edwin A. Chandross, Elsa Reichmanis, and Cletus W. Wilkins, Jr.
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
3849137 |
Barzynski et al. |
Nov 1974 |
|
3949143 |
Schlesinger |
Apr 1976 |
|
4131465 |
Petropoulos |
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4150989 |
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4400461 |
Chandross et al. |
Aug 1983 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
265554 |
May 1981 |
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