PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APPARATUS, AND POLISHING APPARATUS

CROSS REFERENCE TO RELATED APPLICATION

This document claims priority to Japanese Patent Application No. 2022-079536 filed May 13, 2022, the entire contents of which are hereby incorporated by reference.

BACKGROUND

Chemical mechanical polishing (hereinafter referred to as CMP) is a process of polishing a workpiece (for example, a wafer, a substrate, or a panel) by rubbing the workpiece against a polishing pad while supplying a polishing liquid containing abrasive grains, such as silica (SiO₂), onto the polishing pad. A polishing apparatus for performing this CMP includes a polishing table that supports the polishing pad having a polishing surface, and a polishing head configured to press the workpiece against the polishing pad.

The polishing apparatus polishes the workpiece as follows. While the polishing table and the polishing pad are rotated together, the polishing liquid (typically slurry) is supplied onto the polishing surface of the polishing pad. The polishing head rotates the workpiece while pressing the surface of the workpiece against the polishing surface of the polishing pad. The workpiece is brought into sliding contact with the polishing pad in the presence of the polishing liquid. The surface of the workpiece is polished by a chemical action of the polishing liquid and a mechanical action of the abrasive grains contained in the polishing liquid and/or the polishing pad.

When the workpiece is polished, the abrasive grains and polishing debris are deposited on the polishing surface of the polishing pad, and as a result, a polishing performance of the polishing pad is lowered. Therefore, in order to regenerate the polishing surface of the polishing pad, the polishing pad is dressed by a dresser. The dresser has hard abrasive grains, such as diamond particles, fixed to a lower surface of the dresser. The dresser slightly scrapes off the polishing surface of the polishing pad to thereby regenerate the polishing surface of the polishing pad.

The polishing pad is gradually worn as the dressing is repeated. If the polishing pad is worn out significantly, an intended polishing performance cannot be achieved. Therefore, it is necessary to replace the polishing pad with new one.

When the polishing pad is replaced with new one, the new polishing pad is carried to the polishing apparatus, and the polishing pad is attached to the polishing table of the polishing apparatus with an adhesive. Then, the polishing apparatus performs dressing of the polishing pad and/or polishing of a dummy workpiece to thereby perform breaking-in process of the polishing pad.

However, since the polishing pad has a certain size, it takes a lot of work to attach the new polishing pad to the polishing table of the polishing apparatus. Furthermore, while the polishing apparatus is performing the break-in process of the new polishing pad, the polishing apparatus cannot polish a workpiece, resulting in a decrease in the productivity of the polishing apparatus.

SUMMARY

An improved apparatus is provided for use in replacing a polishing pad.

Embodiments, which will be described below, relate to a technique of polishing a workpiece (e.g., wafer, substrate, panel) used in manufacturing of semiconductor devices, and more particularly relate to a break-in process of a polishing pad used in a polishing apparatus and to installation and transport of a polishing pad.

In an embodiment, there is provided a processing system comprising: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device, the pad structure including at least the polishing pad, the polishing device includes a polishing table, a pad chuck configured to fix the pad structure, transported by the pad transporting device, to the polishing table, and a polishing head configured to press the workpiece against the polishing pad, the pad transporting device includes a holding hand configured to hold the pad structure, and a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

In an embodiment, the pad transporting device further includes a tilting device configured to tilt the liquid receiving tray and the holding hand.

In an embodiment, the pad transporting device further includes a hand elevating device configured to vertically move the holding hand.

In an embodiment, the pad transporting device further includes a drain line coupled to the liquid receiving tray.

In an embodiment, the pad structure includes the polishing pad and a support plate supporting the polishing pad.

In an embodiment, the polishing device includes a lifting mechanism configured to receive the pad structure from the pad transporting device and to place the pad structure on the polishing table.

In an embodiment, the pad break-in device includes a processing table configured to hold the pad structure, a processing head configured to press a dummy workpiece against the polishing pad of the pad structure on the processing table; and a liquid supply nozzle configured to supply liquid onto the polishing pad of the pad structure on the processing table.

In an embodiment, the pad break-in device further includes a pad monitoring device configured to monitor the break-in process of the polishing pad.

In an embodiment, there is provided a pad transporting apparatus for transporting a pad structure including at least a polishing pad, comprising: a holding hand configured to hold the pad structure; and a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

In an embodiment, the pad transporting apparatus further comprises a tilting device configured to tilt the liquid receiving tray and the holding hand.

In an embodiment, the pad transporting apparatus further comprises a hand elevating device configured to vertically move the holding hand.

In an embodiment, the pad transporting apparatus further comprises a drain line coupled to the liquid receiving tray.

In an embodiment, the pad structure includes the polishing pad and a support plate supporting the polishing pad.

In an embodiment, there is provided a liquid receiving apparatus comprising: a support plate configured to support a polishing pad; and a liquid receiving tray detachably attached to a side surface of the support plate.

In an embodiment, the liquid receiving tray has a plurality of segments.

In an embodiment, there is provided a polishing apparatus for polishing a workpiece, comprising: a support plate configured to support a polishing pad; a liquid receiving tray detachably attached to a side surface of the support plate; a polishing table configured to hold the support plate; and a polishing head configured to press the workpiece against the polishing pad.

According to the above embodiments, since a break-in process of a new polishing pad is performed by the pad break-in apparatus, it is not necessary to perform a break-in process of the new polishing pad in the polishing apparatus. As a result, a time for stopping the polishing operation of the polishing apparatus for replacing the polishing pad can be shortened, and the productivity of the polishing apparatus can be improved. Furthermore, when a wet polishing pad is transported from the pad break-in apparatus to the polishing apparatus, liquid dripping from the polishing pad can be received by the liquid receiving tray, so that contamination of a clean room can be prevented. Furthermore, the pad structure including at least the polishing pad is transported from the pad break-in apparatus to the polishing apparatus by the pad transporting apparatus and mounted to the polishing table of the polishing apparatus by the pad chuck. As a result, a conventional work of attaching a polishing pad to a polishing table with an adhesive can be eliminated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram illustrating one embodiment of a processing system;

FIG. 2 is a schematic diagram showing one embodiment of a polishing apparatus;

FIG. 3 is a schematic diagram showing one embodiment of a pad break-in apparatus;

FIG. 4 is a schematic diagram showing one embodiment of a pad transporting apparatus;

FIG. 5 is a top view for explaining an embodiment of a liquid receiving tray and holding hands:

FIG. 6 is a cross-sectional view taken along a line A-A of FIG. 5;

FIG. 7 is a diagram for explaining a process of removing a pad structure from the pad break-in apparatus;

FIG. 8 is a diagram illustrating a process of removing the pad structure from the pad break-in apparatus;

FIG. 9 is a diagram explaining a process of removing the pad structure from the pad break-in apparatus;

FIG. 10 is a diagram for explaining an operation of conveying the pad structure;

FIG. 11 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 12 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 13 is a diagram for explaining a process of installing the pad structure in the polishing apparatus;

FIG. 14 is a diagram for explaining a process of installing the pad structure in the polishing apparatus;

FIG. 15 is a top view for explaining another embodiment of the pad transporting apparatus;

FIG. 16 is a cross-sectional view taken along line B-B of FIG. 15;

FIG. 17 is a top view showing a state in which a shutter is open;

FIG. 18 is a cross-sectional view showing a state in which the shutter is open:

FIG. 19 is a diagram showing one embodiment of a liquid receiving tray;

FIG. 20 is a top view showing still another embodiment of the pad transporting apparatus;

FIG. 21 is a cross-sectional view taken along a line C-C of FIG. 20;

FIG. 22 is a diagram showing another embodiment of the pad break-in apparatus:

FIG. 23 is a diagram showing another embodiment of the polishing apparatus;

FIG. 24 is a diagram for explaining a process of removing the pad structure from the pad break-in apparatus;

FIG. 25 is a diagram for explaining a process of removing the pad structure from the pad break-in apparatus;

FIG. 26 is a diagram for explaining a process of removing the pad structure from the pad break-in apparatus;

FIG. 27 is a diagram for explaining a process of removing the pad structure from the pad break-in apparatus;

FIG. 28 is a diagram for explaining a process of tilting the pad structure and the liquid receiving tray;

FIG. 29 is a diagram for explaining an operation of conveying the pad structure;

FIG. 30 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 31 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 32 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 33 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 34 is a diagram for explaining a process of carrying the pad structure into the polishing apparatus;

FIG. 35 is a side view showing one embodiment of a liquid-receiving apparatus;

FIG. 36 is a sectional view of a liquid receiving tray shown in FIG. 35:

FIG. 37 is a diagram showing a state in which the liquid receiving tray is removed from a support plate:

FIG. 38 is a cross-sectional view showing another embodiment of the liquid-receiving apparatus; and

FIG. 39 is a diagram showing an embodiment of a polishing apparatus including the liquid-receiving apparatus.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments will be described with reference to the drawings. FIG. 1 is a schematic diagram illustrating one embodiment of a processing system configured to polish a workpiece and perform a break-in process on a polishing pad. The processing system includes a polishing apparatus 500 for polishing a workpiece, a pad break-in apparatus 600 for performing a break-in process on a polishing pad, and a pad transporting apparatus 700 for transporting a pad structure 6 including at least the polishing pad from the pad break-in apparatus 600 to the polishing apparatus 500. The polishing apparatus 500, the pad break-in apparatus 600, and the pad transporting apparatus 700 are arranged in a clean room. The pad transporting apparatus 700 is configured to be movable between the polishing apparatus 500 and the pad break-in apparatus 600.

FIG. 2 is a schematic diagram illustrating one embodiment of the polishing apparatus 500. The polishing apparatus 500 is a CMP apparatus configured to chemically and mechanically polish a workpiece W used in manufacturing of semiconductor devices. Examples of the workpiece W include wafer, substrate (e.g., circular substrate, rectangular substrate), and panel. A wafer is used as the workpiece W in the embodiments described below.

As shown in FIG. 2, the polishing apparatus 500 includes a polishing table 10 configured to support a polishing pad 2 having a polishing surface 2a, a polishing head 11 configured to press the workpiece W against the polishing surface 2a of the polishing pad 2, and a polishing-liquid supply nozzle 12 configured to supply polishing liquid (e.g., slurry containing abrasive grains) onto the polishing surface 2a of the polishing pad 2. The polishing head 11 is configured to hold the workpiece W on its lower surface.

The polishing pad 2 is supported by a support plate 5. More specifically, the polishing pad 2 is fixed to a surface of the support plate 5 with an adhesive in advance. The polishing pad 2 and the support plate 5 constitute the pad structure 6 which is an integral structure. The pad structure 6 is placed on a upper surface 10a of polishing table 10.

The polishing apparatus 500 includes a pad chuck 14 configured to secure the pad structure 6 to the polishing table 10. In this embodiment, the pad chuck 14 is a vacuum chuck having a vacuum line 15 extending through the polishing table 10. The vacuum line has a plurality of open ends 15a that open in the upper surface 10a of the polishing table 10. Other end of the vacuum line 15 communicates with a vacuum source (e.g., a vacuum pump) not shown in the drawings. When a vacuum is created in the vacuum line 15, the support plate 5 of the pad structure 6 is held (fixed) to the upper surface 10a of the polishing table 10 by the vacuum. Once the vacuum formation in vacuum line 15 is stopped, the pad structure 6 can be removed from the polishing table 10. Thus, the pad chuck 14 can detachably fix the pad structure 6 to the polishing table 10.

In the present embodiment, the pad chuck 14 is configured to secure the pad structure 6 to the polishing table 10 via the vacuum, while in one embodiment, the pad chuck 14 may be a mechanical chuck configured to mechanically hold the pad structure 6.

The polishing apparatus 500 includes a plurality of lifting mechanisms 20 configured to receive the pad structure 6 from the pad transporting apparatus 700 (see FIG. 1) and place the pad structure 6 onto the polishing table 10. These lifting mechanisms 20 are arranged within the polishing table 10. Each lifting mechanism 20 has a lifting rod 21 and a rod actuator 22 for elevating the lifting rod 21. When the rod actuators 22 elevate the lifting rods 21, upper portions of the lifting rods 21 protrude from the upper surface 10a of the polishing table 10, thereby moving the pad structure 6 (including the polishing pad 2 and the support plate 5) upward away from the polishing table 10. When the polishing apparatus 500 is about to receive the pad structure 6 from the pad transporting apparatus 700 (see FIG. 1), the rod actuators 22 raises the lifting rods 21, and the pad structure 6 is placed on upper ends of the lifting rods 21. The rod actuators 22 then lower the lifting rods 21 into the polishing table 10, thereby placing the pad structure 6 onto the upper surface 10a of the polishing table 10. The pad chuck 14 then creates the vacuum in the vacuum line 15 to thereby secure the pad structure 6 to the polishing table 10.

The polishing apparatus 500 further includes a support shaft 25, a polishing-head support arm 26 coupled to an upper end of the support shaft 25, a polishing-head shaft 27 rotatably supported by a free end of the polishing-head support arm 26, and a polishing-head rotating device 28 configured to rotate the polishing-head shaft 27 and the polishing head 11. The polishing head 11 is fixed to a lower end of the polishing-head shaft 27. The polishing-head rotating device 28 is arranged in the polishing-head support arm 26. The polishing-head rotating device 28 includes an electric motor, a torque transmission device, etc., but the configuration thereof is not particularly limited. The polishing-head rotating device 28 is coupled to the polishing-head shaft 27 and configured to rotate the polishing-head shaft 27 and the polishing head 11 in a direction indicated by arrow.

The polishing apparatus 500 further includes a polishing-head elevating device 29 configured to move the polishing head 11 and the polishing-head shaft 27 up and down relative to the polishing table 10 and the polishing-head support arm 26. The polishing-head elevating device 29 has a combination of a ball screw mechanism and a servomotor, or an actuator, such as an air cylinder, but its configuration is not particularly limited. When the polishing-head elevating device 29 vertically moves the polishing-head shaft 27 relative to the polishing-head support arm 26, the polishing head 11 moves vertically relative to the polishing-head support arm 26 and the polishing table 10 as indicated by arrows.

The polishing apparatus 500 further includes a polishing-table rotating device 30 configured to rotate the polishing pad 2 and the polishing table 10 about their axes. The polishing-table rotating device 30 is arranged below the polishing table 10, and the polishing table 10 is coupled to the polishing-table rotating device 30 via a table shaft 10b. The polishing-table rotating device 30 includes an actuator, such as an electric motor, but its configuration is not particularly limited. The polishing table 10 and the polishing pad 2 are integrally rotated about the table shaft 10b by the polishing-table rotating device 30 in a direction indicated by arrow. An exposed surface of the polishing pad 2 constitutes the polishing surface 2a for polishing the workpiece W, such as a wafer.

The polishing apparatus 500 further includes a polishing-head moving device 32 configured to move the polishing head 11 between a position above the polishing pad 2 and a position outside the polishing pad 2. The polishing-head moving device 32 is fixed to the upper end of the support shaft 25 and coupled to the polishing-head support arm 26. The polishing-head moving device 32 can move the polishing head 11 in a direction parallel to the polishing surface 2a of the polishing pad 2 by rotating the polishing-head support arm 26 around the support shaft 25.

Polishing of the workpiece W is performed as follows. The workpiece W, with its surface facing downward, is held by the polishing head 11. While the polishing head 11 and the polishing table 10 are rotated, the polishing liquid (for example, slimy containing abrasive grains) is supplied onto the polishing surface 2a of the polishing pad 2 from the polishing-liquid supply nozzle 12 provided above the polishing table 10. The polishing pad 2 rotates about its central axis together with the polishing table 10. The polishing head 11 is lowered to a predetermined polishing-operation height by the polishing-head elevating device 29. Furthermore, the polishing head 11 presses the workpiece W against the polishing surface 2a of the polishing pad 2. The workpiece W rotates together with the polishing head 11. The workpiece W is brought into sliding contact with the polishing surface 2a in the presence of the polishing liquid on the polishing surface 2a of the polishing pad 2. The surface of the workpiece W is polished by a combination of a chemical action of the polishing liquid and a mechanical action of the abrasive grains contained in the polishing liquid and/or the polishing pad 2.

Next, the pad break-in apparatus 600 will be described with reference to FIG. 3. Configurations of the pad break-in apparatus 600 are basically the same as those of the polishing apparatus 500. As shown in FIG. 3, the pad break-in apparatus 600 includes a processing table 40 configured to support a new polishing pad 2 which is subjected to the break-in process, a processing head 41 configured to press a dummy workpiece W1 against a polishing surface 2a of the polishing pad 2, and a liquid supply nozzle 42 configured to supply a polishing liquid (for example, slurry containing abrasive grains) onto the polishing surface 2a. The processing head 41 is configured to hold the dummy workpiece W1 on its lower surface. The dummy workpiece W1 may be a blanket wafer having a film, or a bare wafer having no film.

The polishing pad 2 is supported by the support plate 5. More specifically, the polishing pad 2 is fixed to the surface of the support plate 5 with an adhesive in advance. The polishing pad 2 and the support plate 5 constitute the pad structure 6 which is an integral structure. The pad structure 6 is placed on an upper surface of the processing table 40.

The pad break-in apparatus 600 includes a pad chuck 44 configured to secure the pad structure 6 to the processing table 40. In this embodiment, the pad chuck 44 is a vacuum chuck having a vacuum line 45 extending through the processing table 40. Detailed configurations and operations of the pad chuck 44 are the same as those of the pad chuck 14 shown in FIG. 2, and repetitive descriptions thereof will be omitted. In one embodiment, the pad chuck 44 may be a mechanical chuck configured to mechanically hold the pad structure 6.

The pad break-in apparatus 600 includes a plurality of lifting mechanisms 50 arranged in the processing table 40. Each lifting mechanism 50 has a lifting rod 51 and a rod actuator 52 for elevating the lifting rod 51. Detailed configurations and operations of the lifting mechanisms 50 are the same as those of the lifting mechanisms 20 shown in FIG. 2, and repetitive descriptions thereof will be omitted.

The pad break-in apparatus 600 includes a support shaft 55, a processing-head support arm 56 coupled to an upper end of the support shaft 55, a processing-head shaft 57 rotatably supported by a free end of the processing-head support arm 56, and a processing-head rotating device 58 configured to rotate the processing-head shaft 57 and the processing head 41. The processing head 41 is fixed to a lower end of the processing-head shaft 57. The processing-head rotating device 58 is arranged in the processing-head support arm 56. The processing-head rotating device 58 includes an electric motor, a torque transmission device, etc., but the configuration thereof is not particularly limited. The processing-head rotating device 58 is coupled to the processing-head shaft 57 and configured to rotate the processing-head shaft 57 and the processing head 41 in a direction indicated by arrow.

The pad break-in apparatus 600 further includes a processing-head elevating device 59 configured to move the processing head 41 and the processing-head shaft 57 up and down relative to the processing table 40 and the processing-head support arm 56. The processing-head elevating device 59 has a combination of a ball screw mechanism and a servomotor, or an actuator, such as an air cylinder, but its configuration is not particularly limited. When the processing-head elevating device 59 vertically moves the processing-head shaft 57 relative to the processing-head support arm 56, the processing head 41 vertically moves relative to the processing-head support arm 56 and the processing table 40 as indicated by arrows.

The pad break-in apparatus 600 further includes a processing-table rotating device 60 configured to rotate the polishing pad 2 and the processing table 40 about their axes. The processing-table rotating device 60 is arranged below the processing table 40, and the processing table 40 is coupled to the processing-table rotating device 60 via a table shaft 40b. The processing-table rotating device 60 includes an actuator, such as an electric motor, but its configuration is not particularly limited. The processing table 40 and the polishing pad 2 are integrally rotated about the table shaft 40b by the processing-table rotating device 60 in a direction indicated by arrow.

The pad break-in apparatus 600 further includes a processing-head moving device 62 configured to move the processing head 41 between a position above the polishing pad 2 and a position outside the polishing pad 2. The processing-head moving device 62 is fixed to the upper end of the support shaft 55 and coupled to the processing-head support arm 56. The processing-head moving device 62 can move the processing head 41 in a direction parallel to the polishing surface 2a of the polishing pad 2 by rotating the processing-head support arm 56 around the support shaft 55.

Polishing of the dummy workpiece W1 is performed as follows. The dummy workpiece W1, with its surface facing downward, is held by the processing head 41. While the processing head 41 and the processing table 40 are rotated, the processing liquid (for example, slurry containing abrasive grains) is supplied onto the polishing surface 2a of the polishing pad 2 from the liquid supply nozzle 42 provided above the processing table 40. The polishing pad 2 rotates about its central axis together with the processing table 40. The processing head 41 is lowered to a predetermined polishing-operation height by the processing-head elevating device 59. Furthermore, the processing head 41 presses the dummy workpiece W1 against the polishing surface 2a of the polishing pad 2. The dummy workpiece W1 rotates together with the processing head 41. The dummy workpiece W1 is brought into sliding contact with the polishing surface 2a of the polishing pad 2 in the presence of the processing liquid on the polishing surface 2a. As a result, the surface of the dummy workpiece W1 is polished. In one embodiment, pure water as the processing liquid may be supplied onto the polishing surface 2a.

The pad break-in apparatus 600 further includes a dresser 70 for dressing the polishing surface 2a of the polishing pad 2. The dresser 70 includes a dressing disk 71 configured to nib against the polishing surface 2a of the polishing pad 2, a dresser shaft 72 coupled to the dressing disk 71, and a dresser oscillation arm 75 rotatably supporting the dresser shaft 72. A lower surface of the dressing disk 71 constitutes a dressing surface 71a, which is composed of abrasive grains (for example, diamond grains).

The dresser shaft 72 is coupled to a disk pressing mechanism (including, for example, an air cylinder) which is not shown in the drawings. This disk pressing mechanism is arranged in the dresser oscillation arm 75. The disk pressing mechanism is configured to press the dressing surface 71a of the dressing disk 71 against the polishing surface 2a of the polishing pad 2 via the dresser shaft 72. Furthermore, the dresser shaft 72 is coupled to a disk rotating mechanism (including, for example, an electric motor) which is not shown in the drawings. This disk rotating mechanism is disposed in the dresser oscillation arm 75. The disk rotating mechanism is configured to rotate the dressing disk 71 via the dresser shaft 72 in a direction indicated by arrow.

Dressing of the polishing surface 2a of the polishing pad 2 is performed as follows. While the polishing pad 2 is rotated together with the processing table 40 by the polishing-table rotating device 30, pure water is supplied from the liquid supply nozzle 42 onto the polishing surface 2a. While the dressing disk 71 is rotated about the dresser shaft 72 by the disk rotating mechanism (not shown), the dressing surface 71a of the dressing disk 71 is pressed against the polishing surface 2a by the disk pressing mechanism (not shown). The dressing disk 71 is brought into sliding contact with the polishing surface 2a in the presence of the pure water on the polishing surface 2a. During the rotation of the dressing disk 71, the dresser oscillation arm 75 is swung around the support shaft 78 to oscillate the dressing disk 71 in the radial direction of the polishing surface 2a. In this manner, the polishing pad 2 is slightly scraped off by the dressing disk 71, so that the polishing surface 2a is dressed (regenerated). The dressing of the polishing surface 2a of the polishing pad 2 is performed during polishing of the dummy workpiece W1, or before and/or after polishing of the dummy workpiece W1.

In this way, the break-in processing of the new polishing pad 2 is achieved by the polishing of the dummy workpiece W1 using the new polishing pad 2 and dressing of the new polishing pad 2. In one embodiment, the break-in process of the new polishing pad 2 may be performed by either polishing of the dummy workpiece W1 with the new polishing pad 2 or dressing of the new polishing pad 2.

The pad break-in apparatus 600 includes a pad monitoring device 80 configured to monitor the break-in process of the polishing pad 2. The pad monitoring device 80 is arranged above the polishing pad 2 and configured to detect a surface condition of the polishing pad 2. More specifically, the pad monitoring device 80 detects the surface condition of the polishing pad 2 during the break-in process and determines an end of the break-in process of the polishing pad 2 based on the detected surface condition of the polishing pad 2. Specific configurations of the pad monitoring device 80 are not particularly limited as long as the pad monitoring device 80 can detect the surface condition of the polishing pad 2. For example, the pad monitoring device 80 comprises an image processing device, a non-contact shape measuring device, or the like.

Next, an embodiment of the pad transporting apparatus 700 will be described with reference to FIG. 4. The pad transporting apparatus 700 includes a main body 84 having a moving device 83, holding hands 85 configured to hold the pad structure 6, and a liquid receiving tray 87 arranged below the holding hands 85. The moving device 83 is configured to allow the entire pad transporting apparatus 700 to move, and has wheels 88 attached to the main body 84 and an electric motor 89 for rotating the wheels 88. In one embodiment, the wheels 88 may be arranged on rails so that the pad transporting apparatus 700 travels in a predefined path. However, the moving device 83 is not limited to the combination of the wheels 88 and the electric motor 89, and any device that can move the entire pad transporting apparatus 700 may be used. In one embodiment, the pad transporting apparatus 700 may be suspended from rails arranged in an upper space of the clean room and may be moved along the rails. In other embodiments, the rails may be attached to the polishing apparatus 500 or the pad break-in apparatus 600, or the rails may be installed in the clean room separately from the polishing apparatus 500 or the pad break-in apparatus 600.

The holding hands 85 are coupled to a vacuum line 92, which is coupled to a vacuum pump 93 as a vacuum source. The vacuum pump 93 is disposed in the main body 84. The holding hands 85 can attract and hold the pad structure 6 by a vacuum formed in the vacuum line 92. In one embodiment, the holding hands 85 may have a mechanical chuck configured to mechanically hold the pad structure 6.

The pad transporting apparatus 700 further includes tilting device 101 configured to tilt the liquid receiving tray 87 and the holding hands 85. The liquid receiving tray 87 and the holding hands 85 are fixed to the tilting device 101. The tilting device 101 is configured to tilt the liquid receiving tray 87 and the holding hands 85 together about a central axis CL extending parallel to the holding hands 85 as indicated by an arrow. In particular, by tilting the liquid receiving tray 87, a liquid that has fallen onto the liquid receiving tray 87 can be collected at a specific location. In addition, by tilting the liquid receiving tray 87, the holding hands 85, and the pad structure 6, a width (space) required for the pad transporting apparatus 700 to move can be reduced.

The pad transporting apparatus 700 further includes a drain line 103 coupled to the liquid receiving tray 87. One end of the drain line 103 is open in the liquid receiving tray 87, and the other end of the drain line 103 is coupled to a liquid tank 105 arranged in the main body 84. The liquid that has dropped from the polishing pad 2 onto the liquid receiving tray 87 is discharged through the drain line 103 and collected in the liquid tank 105.

The pad transporting apparatus 700 further includes a hand elevating device 110 configured to move the holding hands 85 up and down. The hand elevating device 110 is coupled to the tilting device 101 and the main body 84. The hand elevating device 110 includes an air cylinder, a linear actuator, or a combination of an electric motor and gears, or the like, and is configured to elevate and lower the holding hands 85 coupled to the tilting device 101. In this embodiment, since the liquid receiving tray 87 is coupled to the tilting device 101, the hand elevating device 110 can elevate and lower the liquid receiving tray 87 and the holding hands 85 together. The pad structure 6 (including the polishing pad 2 and the support plate 5) held by the holding hands 85 is also elevated and lowered together with the liquid receiving tray 87 and the holding hands 85. In one embodiment, the hand elevator device 110 may be configured or arranged to elevate and lower the holding hands 85 without elevating and lowering the liquid receiving tray 87.

The liquid receiving tray 87 is arranged so as to cover the entire lower sides of the holding hands 85. The liquid receiving tray 87 is provided to receive liquid dropped from the polishing pad 2 in a wet state. Therefore, the liquid receiving tray 87 has a width and a length larger than those of the pad structure 6. Furthermore, the liquid receiving tray 87 has a width and a length larger than those of the holding hands 85.

FIG. 5 is a top view for explaining an embodiment of the liquid receiving tray 87 and the holding hands 85, and FIG. 6 is a sectional view taken along a line A-A of FIG. 5. The liquid receiving tray 87 has two hollow portions 112 that allow entry of the lifting rods 21 shown in FIG. 2 and the lifting rods 51 shown in FIG. 3. As will be described later, when the pad structure 6 is removed from the pad break-in apparatus 600 and when the pad structure 6 is carried into the polishing apparatus 500, the lifting rods 21, 51 enter the hollow portions 112.

The liquid receiving tray 87 has an endless weir 115 extending along the edge of the liquid receiving tray 87. This weir 115 is provided to retain the liquid dropped from the polishing pad 2 of the pad structure 6 onto the liquid receiving tray 87 (i.e., to prevent the liquid from dropping from the liquid receiving tray 87). The weir 115 is provided not only along the edge of the liquid receiving tray 87 but also along the hollow portions 112 so as to surround the hollow portions 112. Thus, the weir 115 prevents the liquid from spilling out through the hollow portions 112.

As shown in FIG. 5, the entire liquid receiving tray 87 is larger than the pad structure 6 as viewed from above the liquid receiving tray 87, and is located below the entire pad structure 6. Therefore, the liquid receiving tray 87 can reliably receive the liquid dropped from the polishing pad 2 of the pad structure 6. A part of the liquid that has fallen from the pad structure 6 may drop through the hollow portions 112, but an amount of such liquid is very small. An open end 103a of the drain line 103 is located on one side of a bottom of the liquid receiving tray 87. The liquid on the liquid receiving tray 87 can be guided to the drain line 103 by tilting the liquid receiving tray 87 by the tilting device 101 shown in FIG. 3 in a direction in which the opening end 103a of the drain line 103 descends.

As shown in FIG. 7, the pad chuck 54 of the pad break-in apparatus 600 releases the pad structure 6, and the pad structure 6, including the wet polishing pad 2 and the support plate 5, is lifted by the lifting rods 51 of the lifting mechanisms 50. The pad structure 6 is separated from the processing table 40, and a space is formed between the pad structure 6 and the processing table 40.

As shown in FIG. 8, the pad transporting apparatus 700 moves the holding hands 85 and the liquid receiving tray 87 into the space between the pad structure 6 and the processing table 40. Since the lifting rods 51 enter the hollow portions 112 of the liquid receiving tray 87, the liquid receiving tray 87 can move to a position below the pad structure 6.

As shown in FIG. 9, the hand elevating device 110 of the pad transporting apparatus 700 elevates the holding hands 85 and the liquid receiving tray 87, until the pad structure 6 is placed on the holding hands 85 and the pad structure 6 is separated from the lifting rods 51. The pad structure 6 is held by the holding hands 85.

As shown in FIG. 10, the pad transporting apparatus 700 transports the pad structure 6 from the pad break-in apparatus 600 to the polishing apparatus 500. Since the liquid receiving tray 87 exists under the pad structure 6 while the pad structure 6 is being transported, the liquid falling from the pad structure 6 is received by the liquid receiving tray 87. As a result, the liquid does not fall onto a floor of the clean room and does not fall into the pad break-in apparatus 600 and the polishing apparatus 500.

In one embodiment, as shown in FIG. 10, the tilting device 101 of the pad transporting apparatus 700 tilts the holding hands 85, the pad structure 6, and the liquid receiving tray 87 while the pad structure 6 is transported from the pad break-in apparatus 600 to the polishing apparatus 500. Such a tilting motion can reduce the width (space) required for the pad transporting apparatus 700 to move.

In the polishing apparatus 500, the same steps in the pad break-in apparatus 600 are performed in reverse order. Specifically, as shown in FIG. 11, the lifting mechanisms 20 elevate the lifting rods 21, and the pad transporting apparatus 700 moves the holding hands 85, the pad structure 6, and the liquid receiving tray 87 to a position above the polishing table 10. Since the lifting rods 21 enter the hollow portions 112 of the liquid receiving tray 87, the liquid receiving tray 87 can move to the position above the polishing table 10.

As shown in FIG. 12, the pad transporting apparatus 700 lowers the holding hands 85, the pad structure 6, and the liquid receiving tray 87, until the pad structure 6 is placed on the lifting rods 21. At this time, the holding hands 85 are separated from the pad structure 6.

As shown in FIG. 13, the pad transporting apparatus 700 moves the holding hands 85 and the liquid receiving tray 87 out of the polishing table 10.

As shown in FIG. 14, the lifting mechanisms 20 lower the lifting rods 21 to place the pad structure 6 onto the upper surface 10a of the polishing table 10. The pad chuck 14 then creates a vacuum in the vacuum line 15, thereby securing the pad structure 6 to the upper surface 10a of the polishing table 10.

In this manner, the pad structure 6 including the polishing pad 2 that has been subjected to the break-in process is transported from the pad break-in apparatus 600 to the polishing apparatus 500 by the pad transporting apparatus 700. In addition, the pad structure 6 is installed to the polishing apparatus 500 by the pad chuck 14. As a result, a conventional work of attaching the polishing pad 2 to the polishing table 10 with an adhesive can be eliminated. Moreover, since the pad break-in apparatus 600 performs the break-in process on the new polishing pad 2, the polishing apparatus 500 does not need to carry out the break-in process for the new polishing pad 2. As a result, a time for stopping a polishing operation of the polishing apparatus 500 for replacing the polishing pad 2 with new one can be shortened, and the productivity of the polishing apparatus can be improved.

FIG. 15 is a top view for explaining another embodiment of the pad transporting apparatus 700, and FIG. 16 is a cross-sectional view taken along line B-B of FIG. 15. Configurations and operations of this embodiment, which are not specifically described, are the same as those of the embodiments described with reference to FIGS. 15 and 16, and repetitive descriptions will be omitted. As shown in FIGS. 15 and 16, the pad transporting apparatus 700 of this embodiment includes shutters 120 covering the hollow portions 112 of the liquid receiving tray 87, and springs 122 biasing the shutters 120 in a direction of closing the hollow portions 112. The shutters 120 and springs 122 are arranged over the liquid receiving tray 87. The shutters 120 have a shape that cover the entire hollow portions 112.

FIGS. 17 and 18 illustrate a state in which the shutters 120 are open. When the pad transporting apparatus 700 moves the liquid receiving tray 87 toward the lifting rods 21 (or the lifting rods 51 shown in FIG. 3), the lifting rods 21 enter the hollow portions 112 while pushing the shutters 120, so that the lifting rods 21 force the shutters 120 to open against the force of the springs 122. According to this embodiment, the hollow portions 112 are closed by the shutters 120 when the pad transporting apparatus 700 transports the pad structure 6 from the pad break-in apparatus 600 to the polishing apparatus 500. Therefore, the liquid that has fallen from the polishing pad 2 cannot pass through the hollow portions 112 and is received by the liquid receiving tray 87. As a result, contamination of the clean room with liquid can be reliably prevented.

In the embodiments described so far, the pad structure 6 is a combination of the polishing pad 2 and the support plate 5 that supports the polishing pad 2. In one embodiment, the pad structure 6 may include the polishing pad 2, but may not include the support plate 5. In the embodiment shown in FIG. 19, the liquid receiving tray 87 has a plurality of pad supporting members 130 that support edges of the polishing pad 2 in order to reduce downward deflection of the polishing pad 2. Each pad support member 130 has a positioning guide 131 for preventing lateral displacement of the polishing pad 2. The polishing pad 2 is held on the polishing table 10 and the processing table 40 by the vacuum suction as with the above-described embodiments.

In one embodiment, the pad structure 6 may include the polishing pad 2 but may not include the support plate 5, while the polishing pad 2 may have an adhesive layer on its lower surface. When the polishing pad 2 is transported, the adhesive layer of the polishing pad 2 may be covered with release paper. The adhesive layer may be exposed after the release paper is peeled off. The adhesive layer of the polishing pad 2 may be configured such that the adhesive layer can be repeatedly attached to the polishing table 10 or the processing table 40. In this case, the pad chucks 14 and 44 described above may be omitted.

FIG. 20 is a top view showing yet another embodiment of a pad transporting apparatus 700, and FIG. 21 is a cross-sectional view taken along line C-C of FIG. 20. Configurations and operations of this embodiment, which will not be specifically described, are the same as those of the embodiments described with reference to FIGS. 1 to 14, and repetitive descriptions thereof will be omitted. The pad transporting apparatus 700 of this embodiment includes a liquid receiving tray 87 having an are shape. The liquid receiving tray 87 has a semicircular shape and is arranged below the edge of the pad structure 6. As shown in FIG. 21, the liquid receiving tray 87 has a semicircular bottom portion 141, an outer curved weir 142 protruding upward from an outer edge of the bottom portion 141, and an inner curved weir 143 protruding upward from an inner edge of the bottom portion 141.

The liquid receiving tray 87 is configured to be divided into two parts along its longitudinal direction. Specifically, the liquid receiving tray 87 includes a first tray structure 87A fixed to one of the two holding hands 85, and a second tray structure 87B detachably coupled to the first tray structure 87A by magnets 145 and 146. The magnets 145 and 146 are fixed to ends of the first tray structure 87A and the second tray structure 87B, respectively. The second tray structure 87B is coupled to the first tray structure 87A only by a magnetic force generated by these magnets 145 and 146, so that the second tray structure 87B can be separated from the first tray structure 87A. The drain line 103 is coupled to the first tray structure 87A.

FIG. 22 illustrates another embodiment of the pad break-in apparatus 600. As shown in FIG. 22, a plurality of engaging protrusions 150 and a plurality of protrusion actuators 151 are arranged along a peripheral surface of the processing table 40 of the pad break-in apparatus 600. Only one engaging protrusion 150 and only one protrusion actuator 151 are depicted in FIG. 22. The engaging protrusions 150 and the protrusion actuators 151 are provided to support the second tray structure 87B of the liquid receiving tray 87. The engaging protrusions 150 extend vertically and are coupled to the protrusion actuators 151. The protrusion actuators 151 are configured to move the engaging protrusions 150 toward and away from the processing table 40 as indicated by arrows. Although detailed configurations of the protrusion actuators 151 are not particularly limited, each protrusion actuator 151 may be composed of for example, an air cylinder or a linear motor.

Engaging holes 155 with which the engaging protrusions 150 engage are formed in the bottom of the second tray structure 87B of the liquid receiving tray 87. When the protrusion actuators 151 move the engaging protrusions 150 with the engaging protrusions 150 inserted into the engaging holes 155, the engaging protrusions 150 and the second tray structure 87B can move away from the processing table 40 and can move toward the processing table 40 as indicated by the arrows.

Similarly, as shown in FIG. 23, a plurality of engaging protrusions 160 and a plurality of protrusion actuators 161 are arranged along a peripheral surface of the polishing table 10. Since configurations and operations of the engaging protrusions 160 and the protrusion actuators 161 are the same as the configurations and the operations of the engaging protrusions 150 and the protrusion actuators 151 shown in FIG. 22, descriptions thereof will be omitted.

Next, the operation of transporting the pad structure 6 including the polishing pad 2 from the pad break-in apparatus 600 to the polishing apparatus 500 by the pad transporting apparatus 700 will be described. As described above, the new polishing pad 2 is subjected to the break-in process by the pad break-in apparatus 600 so that the polishing surface 2a of the polishing pad 2 is ready to polish a workpiece. The polishing pad 2 that has been subjected to the break-in process is in a wet state. Before the polishing pad 2 is removed from the pad break-in apparatus 600 by the pad transporting apparatus 700, the second tray structure 87B of the liquid receiving tray 87 is placed on the engaging protrusions 150 as shown in FIG. 22. The engaging holes 155 of the second tray structure 87B and the engaging protrusions 150 engage.

As shown in FIG. 24, the pad chuck 44 releases the pad structure 6, and the pad structure 6, including the wet polishing pad 2 and the support plate 5, is lifted by the lifting rods 51 of the lifting mechanisms 50. The pad structure 6 is separated from the processing table 40 and a space is formed between the pad structure 6 and the processing table 40.

As shown in FIG. 25, the protrusion actuators 151 move the engaging protrusions 150 and the second tray structure 87B toward the processing table 40, until the second tray structure 87B is located under the edge of the pad structure 6.

As shown in FIG. 26, the pad transporting apparatus 700 moves the holding hands 85 and the first tray structure 87A of the liquid receiving tray 87 into the space between the pad structure 6 and the processing table 40. The first tray structure 87A and the second tray structure 87B are fixed to each other by the magnets 145 and 146 (see FIG. 20).

As shown in FIG. 27, the pad transporting apparatus 700 elevates the holding hands 85 and the liquid receiving tray 87 until the pad structure 6 is placed on the holding hands 85 and the pad structure 6 is separated from the lifting rods 51. The second tray structure 87B is also separated from the engaging protrusions 150. The pad structure 6 is held by the holding hands 85.

As shown in FIG. 28, the tilting device 101 of the pad transporting apparatus 700 tilts the holding hands 85, the pad structure 6, and the liquid receiving tray 87 in the direction in which the liquid receiving tray 87 descends. Since the liquid receiving tray 87 is located below the pad structure 6, the liquid receiving tray 87 can receive the liquid dropped from the pad structure 6. In addition, by inclining the liquid receiving tray 87, the holding hands 85, and the pad structure 6, the width (space) required for the pad transporting apparatus 700 to travel can be reduced.

As shown in FIG. 29, the pad transporting apparatus 700 transports the pad structure 6 from the pad break-in apparatus 600 to the polishing apparatus 500. Since the liquid receiving tray 87 exists under the pad structure 6 while the pad structure 6 is being transported, the liquid falling from the pad structure 6 is received by the liquid receiving tray 87. As a result, the liquid does not fall onto the floor of the clean room

In the polishing apparatus 500, the same steps in the pad break-in apparatus 600 are performed in reverse order. Specifically, as shown in FIG. 30, the lifting mechanisms 20 elevate the lifting rods 21, and the pad transporting apparatus 700 moves the holding hands 85, the pad structure 6, and the liquid receiving tray 87 to a position above the polishing table 10.

As shown in FIG. 31, the pad transporting apparatus 700 lowers the holding hands 85, the pad structure 6, and the liquid receiving tray 87, until the pad structure 6 is placed on the lifting rods 21. At this time, the holding hands 85 are separated from the pad structure 6, and the engaging holes 155 of the second tray structure 87B of the liquid receiving tray 87 engage the engaging protrusions 160.

As shown in FIG. 32, the pad transporting apparatus 700 moves the holding hands 85 and the first tray structure 87A of the liquid receiving tray 87 out of the polishing table 10. Since the engaging protrusions 160 are in engagement with the engaging holes 155 of the second tray structure 87B, the second tray structure 87B remains on the engaging protrusions 160. Since the first tray structure 87A is coupled to the second tray structure 87B only by the magnetic force, the first tray structure 87A can be separated from the second tray structure 87B.

As shown in FIG. 33, the protrusion actuators 161 move the engaging protrusions 160 away from the polishing table 10, so that the second tray structure 87B is moved away from the polishing table 10.

As shown in FIG. 34, the lifting mechanisms 20 lower the lifting rods 21 to place the pad structure 6 on the upper surface 10a of the polishing table 10. The pad chuck 14 then creates a vacuum in the vacuum line 15, thereby securing the pad structure 6 to the upper surface 10a of the polishing table 10.

In this manner, the pad structure 6 including the polishing pad 2 that has been subjected to the break-in process is transported from the pad break-in apparatus 600 to the polishing apparatus 500 by the pad transporting apparatus 700, and is installed on the polishing apparatus 500 by the pad chuck 14. As a result, a conventional work of attaching the polishing pad 2 to the polishing table 10 with an adhesive can be eliminated. Moreover, since the pad break-in apparatus 600 performs the break-in process for the new polishing pad 2, the polishing apparatus 500 does not need to carry out the break-in process for the new polishing pad 2. As a result, a time for stopping a polishing operation of the polishing apparatus 500 for replacing the polishing pad 2 with new one can be shortened, and the productivity of the polishing apparatus can be improved.

In the embodiments described with reference to FIGS. 20 to 34, the entire liquid receiving tray 87 has a semi-annular shape, and the first tray structure 87A and the second tray structure 87B each have a quarter annular shape. However, the shape of the liquid receiving tray 87 is not limited to the above embodiments. In one embodiment, the entire liquid receiving tray 87 may have an annular shape, and each of the first tray structure 87A and the second tray structure 87B may have a semi-annular shape. The semi-annular first tray structure 87A and the semi-annular second tray structure 87B are detachably fixed to each other by magnets. The first tray structure 87A is arranged on proximal-end sides of the holding hands 85, and the second tray structure 87B is arranged on distal-end sides of the holding hands 85.

Next, an embodiment of a liquid receiving tray that can be detachably attached to a side surface of the support plate 5 will be described. FIG. 35 is a top view showing an embodiment of the support plate 5 for supporting the polishing pad 2 and a liquid receiving apparatus having a liquid receiving tray 163 attached to the support plate 5, FIG. 36 is a cross-sectional view of the liquid receiving tray shown in FIG. 35, and FIG. 37 is a diagram showing a state in which the liquid receiving tray 163 is removed from the support plate 5.

The liquid receiving tray 163 surrounds the entire circumference of the support plate 5. In this embodiment, the liquid receiving tray 163 is detachably attached to the side surface of the support plate 5 with attachment members 165. The liquid receiving tray 163 is composed of a plurality of segments 163A and 163B. The attachment members 165 are made of flexible material, examples of which include fluororubber, silicon rubber, foamed rubber, and foamed urethane. The liquid receiving tray 163 may also be made of flexible material, such as rubber. The attachment members 165 are attached to inner sides of the plurality of segments 163A and 163B, respectively, that constitute the liquid receiving tray 163.

The liquid receiving tray 163 has a bottom portion 166 arranged outside the side surface of the support plate 5, and a weir 167 extending upward from an outer edge of the bottom portion 166. The bottom portion 166 and the weir 167 extend over the entire length of the liquid receiving tray 163 and prevent the liquid from falling from the liquid receiving tray 163. The attachment members 165 are attached to an inner side of the bottom portion 166. The attachment members 165 also extend over the entire length of the liquid receiving tray 163. The attachment members 165 may be arranged at intervals with spaces therebetween along the inner side of the liquid receiving tray 163.

A groove 170 is formed in the side surface of the support plate 5 and extends in a circumferential direction of the support plate 5. The groove 170 of this embodiment is a dovetail groove with a narrow entrance. The attachment members 165 attached to the liquid receiving tray 163 are pushed into the groove 170 of the support plate 5, whereby the liquid receiving tray 163 is attached to the support plate 5. Since the attachment members 165 are made of flexible material that is easily deformed, the liquid receiving tray 163 can be removed from the support plate 5 by pulling the attachment members 165 out of the groove 170.

In this embodiment, the liquid receiving tray 163 is composed of two segments 163A and 163B. The entire liquid receiving tray 163 has an annular shape, and each of the segments 163A and 163B has a semi-annular shape. In one embodiment, the entire liquid receiving tray 163 may have an annular shape, and the liquid receiving tray 163 may be composed of three or more arcuate segments 163A and 163B.

The liquid receiving tray 163 having such configurations is transported together with the support plate 5 and the polishing pad 2. The liquid falling from the wet polishing pad 2 is received by the liquid receiving tray 163 and does not fall on the floor of the clean room. Therefore, contamination of the interior of the clean room is prevented. In embodiments where this type of liquid receiving tray 163 is used, the pad transporting apparatus 700 described above may not have the liquid receiving tray 87.

In one embodiment, as shown in FIG. 38, the liquid receiving tray 163 may further include a liquid absorbing member 180 disposed on the bottom portion 166. Examples of material of the liquid absorbing member 180 include sponge.

FIG. 39 illustrates an embodiment of a polishing apparatus including the liquid-receiving apparatus described with reference to FIGS. 35 to 37. Configurations of the polishing apparatus, which will not be specifically described, are the same as those of the embodiment described with reference to FIG. 2, and repetitive descriptions thereof will be omitted. As shown in FIG. 39, the support plate 5 is held (fixed) on the upper surface 10a of the polishing table 10 by the pad chuck 14. During polishing of the workpiece W, the liquid receiving tray 163 rotates together with the support plate 5 and the polishing table 10.

Although not shown, the liquid-receiving apparatus described with reference to FIG. 38 can also be incorporated into the polishing apparatus described with reference to FIG. 2. Furthermore, the liquid-receiving apparatus described with reference to FIGS. 35 to 37 and the liquid-receiving apparatus described with reference to FIG. 38 can be incorporated into the pad break-in apparatus 600 described with reference to FIG. 3.

Since the liquid receiving tray 163 can be removed from the support plate 5, the liquid receiving tray 163 can be cleaned periodically. In another embodiment, the liquid receiving tray 163 may be removed from the support plate 5 in advance during the polishing of the work-piece W and the break-in process of the polishing pad. The liquid receiving tray 163 may be attached to the support plate 5 when the polishing pad that has been subjected to the break-in process is transported to the polishing apparatus.

In the embodiments described above, the configurations of the pad break-in apparatus 600 are basically the same as the configurations of the polishing apparatus 500. In an embodiment, the polishing apparatus 500 may be a substrate processing apparatus configured to perform a series of processes of polishing a substrate, and cleaning and drying the polished substrate. The pad break-in apparatus 600 may be a device specialized for the pad break-in process. In an embodiment, in order to perform the pad break-in process on a polishing pad for use in one of a plurality of polishing apparatuses 500, another polishing apparatus 500 in an idling state when not producing a workpiece may be used to perform the pad break-in process on the polishing pad.

In the embodiments described above, the pad transporting apparatus 700 transports the pad structure 6 from the pad break-in apparatus 600 to the polishing apparatus 500. In another embodiment, the pad transporting apparatus 700 may remove the pad structure 6 from a stocker storing the pad structure 6 that has been subjected to the break-in process in advance by the pad break-in apparatus 600 and may convey the pad structure 6 to the polishing apparatus 500.

The previous description of embodiments is provided to enable a person skilled in the art to make and use the present invention. Moreover, various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles and specific examples defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the embodiments described herein but is to be accorded the widest scope as defined by limitation of the claims.

PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APPARATUS, AND POLISHING APPARATUS

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