Control means for lapping machines or devices

Industry

CPC
B24B37/005

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/005Control means for lapping machines or devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resistivity-based adjustment of thresholds for in-situ monitoring
- Patent number 12,320,883
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Kun Xu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Displacement measurements in semiconductor wafer processing
- Patent number 12,322,662
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Justin Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid supply system, polishing apparatus, exhausting met...
- Patent number 12,311,500
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Peng Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing work, method of producing work, and...
- Patent number 12,311,496
- Issue date May 27, 2025
- Sumco Corporation
- Kazushige Takaishi
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for thinning substrates for semiconductor devices
- Patent number 12,290,900
- Issue date May 6, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic abrasion compensation system of lower plate and wafer lap...
- Patent number 12,285,841
- Issue date Apr 29, 2025
- SK SILTRON CO., LTD.
- Jae Pyo Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 12,285,838
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method for workpiece and grinding apparatus
- Patent number 12,263,553
- Issue date Apr 1, 2025
- Disco Corporation
- Keisuke Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Controlling chemical mechanical polishing pad stiffness by adjustin...
- Patent number 12,257,664
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Surface height measurement method using dummy disk
- Patent number 12,257,666
- Issue date Mar 25, 2025
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,251,789
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head with local wafer pressure
- Patent number 12,251,788
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Andrew Nagengast
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection signal processing apparatus and detection signal processi...
- Patent number 12,241,738
- Issue date Mar 4, 2025
- Ebara Corporation
- Hiroto Yamada
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing head retaining ring tilting moment control
- Patent number 12,214,469
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Andrew Nagengast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,208,487
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,733
- Issue date Jan 28, 2025
- Ebara Corporation
- Nobuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Irregular mechanical motion detection systems and method
- Patent number 12,172,262
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chunhung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,172,263
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Michael Yen
- B24 - GRINDING POLISHING
Information Patent Grant
Monitoring method for chemical mechanical polishing and chemical me...
- Patent number 12,151,335
- Issue date Nov 26, 2024
- HWATSING TECHNOLOGY CO., LTD.
- Xinchun Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Training a machine learning system to detect an excursion of a CMP...
- Patent number 12,148,149
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing apparatus
- Patent number 12,128,523
- Issue date Oct 29, 2024
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 12,122,012
- Issue date Oct 22, 2024
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Magnetic grinding device and magnetic grinding control method
- Patent number 12,115,619
- Issue date Oct 15, 2024
- Zhejiang Normal University
- Shiju E
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for determining thickness of metal film of wafer, polishing...
- Patent number 12,109,664
- Issue date Oct 8, 2024
- Hwatsing (Beijing) Technology Co., Ltd.
- Xinchun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platen rotation device
- Patent number 12,090,602
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bruce Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for suction pad assemblies
- Patent number 12,087,646
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Chao
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,076,831
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Eddy current sensor
- Patent number 12,076,834
- Issue date Sep 3, 2024
- Ebara Corporation
- Atsushi Abe
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR ONLINE INSPECTION OF SURFACE CONDITION OF POL...
- Publication number 20250178157
- Publication date Jun 5, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Zhe YANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20250178159
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi-Ting Wu
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20250170688
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi HUANG
- B24 - GRINDING POLISHING
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...
- Publication number 20250153302
- Publication date May 15, 2025
- EBARA CORPORATION
- Seungho YUN
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...
- Publication number 20250114897
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20250118604
- Publication date Apr 10, 2025
- EBARA CORPORATION
- Akira FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP
- Publication number 20250114896
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL
- Publication number 20250108473
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Andrew J. Nagengast
- B24 - GRINDING POLISHING
Information Patent Application
FINDING SUBSTRATE NOTCH ON SUBSTRATE BETWEEN PLATENS IN CHEMICAL ME...
- Publication number 20250108474
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Nojan Motamedi
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD
- Publication number 20250073841
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Yoshimasa OZONE
- B24 - GRINDING POLISHING
Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVINESS PREDICTION DEVICE, WAVINESS PREDICTION METHOD, PROCESSING...
- Publication number 20250058425
- Publication date Feb 20, 2025
- Resonac Corporation
- Shuki HASHIMOTO
- B24 - GRINDING POLISHING
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...
- Publication number 20250050461
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Kenichi TAKEBUCHI
- B24 - GRINDING POLISHING
Information Patent Application
PAD CONDITIONING DISK GIMBALING CONTROL
- Publication number 20250041985
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE, POLISHING METHOD, AND COMPUTER-READABLE STORAGE M...
- Publication number 20250041986
- Publication date Feb 6, 2025
- SANOH INDUSTRIAL CO., LTD.
- Hideo AIDA
- B24 - GRINDING POLISHING
Information Patent Application
DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...
- Publication number 20250041988
- Publication date Feb 6, 2025
- SK SILTRON CO., LTD.
- Sangho LEE
- B24 - GRINDING POLISHING
Information Patent Application
DEVICE, METHOD, AND SYSTEM FOR TRANSFORMING MEASUREMENT DATA
- Publication number 20250025981
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Hojoon Lee
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...
- Publication number 20250018521
- Publication date Jan 16, 2025
- II-VI Delaware, Inc.
- Edward J. GRATRIX
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRA...
- Publication number 20250010431
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Jianjun HU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, POLISHING APPARATUS, AND NON-TRANSITORY COMPUTER-...
- Publication number 20240424635
- Publication date Dec 26, 2024
- EBARA CORPORATION
- HIROKI NAKAMURA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240416479
- Publication date Dec 19, 2024
- EBARA CORPORATION
- Kenji KODERA
- B24 - GRINDING POLISHING
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...
- Publication number 20240399527
- Publication date Dec 5, 2024
- EBARA CORPORATION
- Ryo NAKAGOMI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING SYSTEM
- Publication number 20240399526
- Publication date Dec 5, 2024
- EBARA CORPORATION
- Yuichi KATO
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20240404894
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240391049
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Cheng LIN
- B24 - GRINDING POLISHING
Information Patent Application
IN-TOOL AUDIO AND VISUAL BEHAVIOR MONITORING FOR PROCESS CONTROL
- Publication number 20240391048
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Justin H. WONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING
- Publication number 20240375238
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHIANG TSENG
- B24 - GRINDING POLISHING
Information Patent Application
DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...
- Publication number 20240378718
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- B24 - GRINDING POLISHING
Information Patent Application
PLATEN ROTATION DEVICE
- Publication number 20240367286
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce CHO
- B24 - GRINDING POLISHING

Control means for lapping machines or devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resistivity-based adjustment of thresholds for in-situ monitoring

Displacement measurements in semiconductor wafer processing

Polishing liquid supply system, polishing apparatus, exhausting met...

Method of double-side polishing work, method of producing work, and...

Methods for thinning substrates for semiconductor devices

Automatic abrasion compensation system of lower plate and wafer lap...

Wafer edge asymmetry correction using groove in polishing pad

Grinding method for workpiece and grinding apparatus

Controlling chemical mechanical polishing pad stiffness by adjustin...

Surface height measurement method using dummy disk

Chemical mechanical polishing apparatus and method

Polishing head with local wafer pressure

Polishing pad and method of fabricating semiconductor device using...

Detection signal processing apparatus and detection signal processi...

Substrate holding apparatus, substrate suction determination method...

Polishing head retaining ring tilting moment control

Chemical mechanical polishing apparatus and method

Substrate processing apparatus and substrate processing method

Irregular mechanical motion detection systems and method

Chemical mechanical planarization tool

Monitoring method for chemical mechanical polishing and chemical me...

Training a machine learning system to detect an excursion of a CMP...

Polishing apparatus

Machine for finishing a work piece, and having a highly controllabl...

Magnetic grinding device and magnetic grinding control method

Method for determining thickness of metal film of wafer, polishing...

Platen rotation device

Systems and methods for suction pad assemblies

Chemical mechanical polishing apparatus and method

Eddy current sensor

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR ONLINE INSPECTION OF SURFACE CONDITION OF POL...

POLISHING APPARATUS AND METHOD FOR POLISHING SUBSTRATE

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL

FINDING SUBSTRATE NOTCH ON SUBSTRATE BETWEEN PLATENS IN CHEMICAL ME...

SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

WAVINESS PREDICTION DEVICE, WAVINESS PREDICTION METHOD, PROCESSING...

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...

PAD CONDITIONING DISK GIMBALING CONTROL

POLISHING DEVICE, POLISHING METHOD, AND COMPUTER-READABLE STORAGE M...

DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...

DEVICE, METHOD, AND SYSTEM FOR TRANSFORMING MEASUREMENT DATA

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...

POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRA...

POLISHING METHOD, POLISHING APPARATUS, AND NON-TRANSITORY COMPUTER-...

POLISHING APPARATUS AND POLISHING METHOD

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...

POLISHING HEAD AND POLISHING SYSTEM

SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

IN-TOOL AUDIO AND VISUAL BEHAVIOR MONITORING FOR PROCESS CONTROL

METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING

DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...

PLATEN ROTATION DEVICE