Lapping pads for working plane surfaces

Industry

CPC
B24B37/20

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/20Lapping pads for working plane surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 12,311,495
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer surface chemical distribution sensing system and methods for...
- Patent number 12,285,837
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Shota Yatsuzuka
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for susceptor deposition material removal
- Patent number 12,280,465
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMP polishing pad with window having transparency at low wavelength...
- Patent number 12,275,116
- Issue date Apr 15, 2025
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Matthew R. Gadinski
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,251,789
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Modular chemical mechanical polisher with simultaneous polishing an...
- Patent number 12,251,787
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Perpendicularly magnetized ferromagnetic layers having an oxide int...
- Patent number 12,249,450
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Luc Thomas
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing head, and polishing treatment device
- Patent number 12,240,074
- Issue date Mar 4, 2025
- MICRO ENGINEERING, INC.
- Akio Komura
- B24 - GRINDING POLISHING
Information Patent Grant
Liquid supplying device and method for draining liquid thereof
- Patent number 12,208,428
- Issue date Jan 28, 2025
- Ebara Corporation
- Fujihiko Toyomasu
- B08 - CLEANING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,208,487
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus using a magnetically couple...
- Patent number 12,151,336
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Pin Ho
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing single-crystal diamond
- Patent number 12,151,337
- Issue date Nov 26, 2024
- Huaqiao University
- Jing Lu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-layered windows for use in chemical-mechanical planarization...
- Patent number 12,138,735
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, preparation method thereof and method for preparing...
- Patent number 12,138,738
- Issue date Nov 12, 2024
- SK ENPULSE CO., LTD.
- Jae In Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing head, method for manufacturing wafer polishing head...
- Patent number 12,134,162
- Issue date Nov 5, 2024
- SK SILTRON CO., LTD.
- Jae Chel Sung
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for manufacturing display device
- Patent number 12,090,601
- Issue date Sep 17, 2024
- Samsung Display Co., Ltd.
- Junggun Nam
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,076,831
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,030,159
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Kai Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Fixing device and detection system
- Patent number 12,005,545
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chao Li
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing semiconductor substrate
- Patent number 11,999,027
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
Multifunctional robotic device
- Patent number 11,997,957
- Issue date Jun 4, 2024
- Globe (Jiangsu) Co., Ltd.
- Jin Cao
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System for adjusting pad surface temperature and polishing apparatus
- Patent number 11,992,915
- Issue date May 28, 2024
- Ebara Corporation
- Shuji Uozumi
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus, chemical mechanical polish...
- Patent number 11,986,921
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Myung-Ki Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated abrasive polishing pads and manufacturing methods
- Patent number 11,980,992
- Issue date May 14, 2024
- Applied Materials, Inc.
- Ashavani Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Dressing apparatus and polishing apparatus
- Patent number 11,980,997
- Issue date May 14, 2024
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Takahiko Mitsui
- B24 - GRINDING POLISHING
Information Patent Grant
CMP system and method of use
- Patent number 11,984,323
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad comprising window similar in hardness to polishing layer
- Patent number 11,964,360
- Issue date Apr 23, 2024
- SK ENPULSE CO., LTD.
- Sunghoon Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioner, chemical mechanical polishing apparatus including the...
- Patent number 11,964,357
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Seungchul Han
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING DEVICE AND METHOD FOR DETECTING POLISHING END POINT IN PO...
- Publication number 20250178152
- Publication date Jun 5, 2025
- EBARA CORPORATION
- Dai YOSHINARI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR POLISHING A WAFER
- Publication number 20250170684
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Ju Bong LEE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20250170688
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi HUANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20250162100
- Publication date May 22, 2025
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
COLD LIQUID POLISHING CONTROL
- Publication number 20250114909
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Priscilla Diep LaRosa
- B24 - GRINDING POLISHING
Information Patent Application
WINDOW-MOUNTED POLISHING PAD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250114900
- Publication date Apr 10, 2025
- KPX CHEMICAL CO., LTD.
- Byung Ju MIN
- B24 - GRINDING POLISHING
Information Patent Application
INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP
- Publication number 20250114896
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
LEVERAGED POROMERIC POLISHING PAD
- Publication number 20250058426
- Publication date Feb 20, 2025
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Wei-Wen TSAI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20250033159
- Publication date Jan 30, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- Seyun PARK
- B24 - GRINDING POLISHING
Information Patent Application
Tungsten Chemical Mechanical Polishing Slurries
- Publication number 20250019568
- Publication date Jan 16, 2025
- VERSUM MATERIALS US, LLC
- MATTHIAS STENDER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...
- Publication number 20250018526
- Publication date Jan 16, 2025
- SK enpulse Co., Ltd.
- Jae In AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
- Publication number 20250010424
- Publication date Jan 9, 2025
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND SEGMENTATION TYPE HEAD MODULE OF A CHEMICAL MECH...
- Publication number 20240399532
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Choi
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...
- Publication number 20240383095
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHI...
- Publication number 20240383094
- Publication date Nov 21, 2024
- IV Technologies CO., Ltd.
- Ko-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Application
Perpendicularly Magnetized Ferromagnetic Layers Having an Oxide Int...
- Publication number 20240379270
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Luc Thomas
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240367285
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Masayuki SATAKE
- B24 - GRINDING POLISHING
Information Patent Application
COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING
- Publication number 20240316598
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Clinton P. SAKATA
- B08 - CLEANING
Information Patent Application
POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240300066
- Publication date Sep 12, 2024
- SK enpulse Co., Ltd.
- Chang Gyu IM
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20240278381
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS
- Publication number 20240278378
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Yoichi SHIOKAWA
- B24 - GRINDING POLISHING
Information Patent Application
CONDITIONING APPARATUS
- Publication number 20240269798
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Hyuntae Lee
- B24 - GRINDING POLISHING
Information Patent Application
CMP System and Method of Use
- Publication number 20240274440
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT WINDOW
- Publication number 20240253175
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT DETECTION WINDOW
- Publication number 20240253177
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT WINDOW
- Publication number 20240253176
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD
- Publication number 20240189959
- Publication date Jun 13, 2024
- EBARA CORPORATION
- Keisuke NAMIKI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
- Publication number 20240157502
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- DONGHOON KWON
- B24 - GRINDING POLISHING
Information Patent Application
Temperature Control in Chemical Mechanical Polish
- Publication number 20240149388
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240100647
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- B24 - GRINDING POLISHING

Lapping pads for working plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature control in chemical mechanical polish

Wafer surface chemical distribution sensing system and methods for...

Apparatus and methods for susceptor deposition material removal

CMP polishing pad with window having transparency at low wavelength...

Chemical mechanical polishing apparatus and method

Modular chemical mechanical polisher with simultaneous polishing an...

Perpendicularly magnetized ferromagnetic layers having an oxide int...

Polishing pad and method of fabricating semiconductor device using...

Polishing head, and polishing treatment device

Liquid supplying device and method for draining liquid thereof

Chemical mechanical polishing apparatus and method

Chemical mechanical polishing apparatus using a magnetically couple...

Method for polishing single-crystal diamond

Multi-layered windows for use in chemical-mechanical planarization...

Polishing pad, preparation method thereof and method for preparing...

Wafer polishing head, method for manufacturing wafer polishing head...

Apparatus and method for manufacturing display device

Chemical mechanical polishing apparatus and method

Substrate processing apparatus, substrate processing system, and su...

Chemical mechanical planarization tool

Fixing device and detection system

Method for polishing semiconductor substrate

Multifunctional robotic device

System for adjusting pad surface temperature and polishing apparatus

Chemical mechanical polishing apparatus, chemical mechanical polish...

Integrated abrasive polishing pads and manufacturing methods

Dressing apparatus and polishing apparatus

CMP system and method of use

Polishing pad comprising window similar in hardness to polishing layer

Conditioner, chemical mechanical polishing apparatus including the...

Patents Applicationslast 30 patents

POLISHING DEVICE AND METHOD FOR DETECTING POLISHING END POINT IN PO...

APPARATUS FOR POLISHING A WAFER

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

POLISHING HEAD AND POLISHING APPARATUS

COLD LIQUID POLISHING CONTROL

WINDOW-MOUNTED POLISHING PAD AND METHOD OF MANUFACTURING THE SAME

INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

LEVERAGED POROMERIC POLISHING PAD

CHEMICAL MECHANICAL POLISHING APPARATUS

Tungsten Chemical Mechanical Polishing Slurries

POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...

POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD

POLISHING HEAD AND SEGMENTATION TYPE HEAD MODULE OF A CHEMICAL MECH...

MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...

POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHI...

Perpendicularly Magnetized Ferromagnetic Layers Having an Oxide Int...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING

POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE

POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...

POLISHING APPARATUS

CONDITIONING APPARATUS

CMP System and Method of Use

POLISHING PAD WITH ENDPOINT WINDOW

POLISHING PAD WITH ENDPOINT DETECTION WINDOW

POLISHING PAD WITH ENDPOINT WINDOW

POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS

Temperature Control in Chemical Mechanical Polish

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD