Claims
- 1. A processing system comprising:a processing tool in combination with a silicon work-piece, the processing tool being for carrying out a fixed-abrasive grinding process on a surface of the silicon work-piece, and the processing tool including abrasive grains made up of silica grains such that when the fixed-abrasive process is being performed on the surface of the silicon work-piece, a dry mechano-chemical reaction occurs between the abrasive grains and the silicon work-piece so that the processing tool processes the silicon work-piece without supplying a processing fluid or coolant.
- 2. The processing system as claimed in claim 1, wherein the abrasive grains form a grindstone.
- 3. The processing system as claimed in claim 1, wherein the abrasive grains form a film.
- 4. The processing system as claimed in claim 3, wherein the film is flexible.
- 5. A method for carrying out a fixed-abrasive grinding on a surface of a silicon work-piece, the method comprising the steps of:positioning the silicon work-piece relative to a processing tool having abrasive grains made up of silica grains; and processing the surface of the silicon work-piece by the abrasive grains of the processing tool such that when the fixed-abrasive process is being performed on the surface of the silicon work-piece, a dry mechano-chemical reaction occurs between the abrasive grains and the silicon work-piece so that the processing tool processes the silicon work-piece without supplying a processing fluid or coolant.
- 6. A processing tool and silicon work-piece in combination, comprising:the processing tool for carrying out a fixed-abrasive grinding process on a surface of the silicon work-piece, wherein the processing tool includes abrasive grains made up of silica grains such that when the fixed-abrasive grinding process is being performed on the surface of the silicon work-piece, a dry mechano-chemical reaction occurs between the abrasive grains and the silicon work-piece so that the processing tool processes the silicon work-piece without supplying a processing fluid or coolant.
- 7. The processing tool and silicon work-piece in combination as claimed in claim 6, wherein the abrasive grains form a grindstone.
- 8. The processing tool and silicon work-piece in combination as claimed in claim 6, wherein the abrasive grains form a film.
- 9. The processing tool and silicon work-piece in combination as claimed in claim 8, wherein the film is flexible.
Priority Claims (4)
Number |
Date |
Country |
Kind |
11-237467 |
Aug 1999 |
JP |
|
11-260799 |
Sep 1999 |
JP |
|
11-278608 |
Sep 1999 |
JP |
|
11-306335 |
Oct 1999 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims the benefit of Japanese Patent Applications No.11-237467 filed Aug. 24, 1999, No.11-260799 filed Sep. 14, 1999, No.11-278608 filed Sep. 30, 1999 and No.11-206355 filed Oct. 28, 1999, in the Japanese Patent Office, the disclosures of which are hereby incorporated by reference.
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