Claims
- 1. A positive resist composition which comprises, in admixture, a photosensitive 1,2-quinone diazide compound, an alkali-soluble resin to bind ingredients and polyphenol compound to control a dissolution rate in a developer having a molecular weight of not more than 550 and represented by the general formula: ##STR11## wherein a, b, c, d, e and f are the same or different and a number of 0-3, provided that d+f is not less than 1, and provided that if b, d and f are 1, then at least on of a, c, and e is not 0 ; R.sub.1, R2 and R.sub.3 are the same or different and a C.sub.1 -C.sub.18 alkyl group, a C.sub.1 -C.sub.18 alkoxy group, a carboxyl group or a halogen atom; R.sub.4 is a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or an aryl group, wherein an amount of said 1,2-quinone diazide compound is from 5 to 100% by weight and an amount of said polyphenol compound is from 4 to 40% by weight based on the total weight of said alkali-soluble resin.
- 2. The positive resist composition according to claim 1, wherein the polyphenol compound is the compound of the formula: ##STR12##
- 3. The positive resist composition according to claim 1, wherein said polyphenol compound is selected from the group consisting of ##STR13##
- 4. The positive resist composition according to claim 1, wherein said polyphenol compound is ##STR14##
- 5. The positive resist composition according to claim 1, wherein R.sub.4 is hydrogen and b, d and f are each 1.
- 6. The positive resist composition according to claim 5, wherein the alkali-soluble resin is a novolak resin.
- 7. The positive resist composition according to claim 6, wherein the novolak resin is a high molecular weight novolak resin prepared by removing 30 to 90% by weight of low molecular weight fractions based on the weight of the novolak resin having a weight average molecular weight measured by GPC which is not less than 2,000 as converted to polystyrene, from the whole resin.
Priority Claims (2)
Number |
Date |
Country |
Kind |
63-169477 |
Jul 1988 |
JPX |
|
63-331074 |
Dec 1988 |
JPX |
|
BACKGROUND OF THE INVENTION
1. Field of the Invention
This application is a divisional of application Ser. No. 07/948,466, filed on Sep. 22, 1992, which is a continuation of Ser. No. 07/466,657 filed on Jan. 17, 1990, now abandoned, which is a continuation-in-part of Ser. No. 07/375,999 filed on Jul. 6, 1989, now abandoned, the entire contents of which are hereby incorporated by reference.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
211667 |
Feb 1987 |
EPX |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 9, No. 323, p. 414, (Dec. 1985), JP 60150047 (1). |
Divisions (1)
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Number |
Date |
Country |
Parent |
948466 |
Sep 1992 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
466657 |
Jan 1990 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
375999 |
Jul 1989 |
|