Claims
- 1. A positive resist composition which comprises, in admixture, a photosensitive 1,2-quinone diazide compound, an alkali-soluble resin to bind ingredients and polyphenol compound to control a dissolution rate in a developer represented by the formula: ##STR11## wherein R is C.sub.1-18 or hydrogen.
- 2. The positive resist composition according to claim 1, wherein R is CH.sub.3.
- 3. The positive resist composition according to claim 1, wherein R is H.
- 4. The positive resist composition according to claim 1, wherein said polyphenol compound is the compound of the formula: ##STR12##
- 5. The positive resist composition according to claim 1, wherein said polyphenol compound is the compound of the formula: ##STR13##
- 6. The positive resist composition according to claim 1, wherein the alkali-soluble resin is a novolak resin.
- 7. The positive resist composition according to claim 6, wherein the novolak resin is a high molecular weight novolak resin prepared by removing 30 to 90% by weight of low molecular weight fractions based on the weight of the novolak resin having a weight average molecular weight measured by GPC which is not less than 2,000 as converted to polystyrene, from the whole resin.
- 8. A silicon wafer coated with the positive resist composition according to any one of claims 1-7.
Priority Claims (2)
Number |
Date |
Country |
Kind |
63-169477 |
Jul 1988 |
JPX |
|
63-331074 |
Dec 1988 |
JPX |
|
Parent Case Info
This application is a divisional of application Ser. No. 07/948,466, now pending, filed on Sep. 22, 1992, now pending, which is a continuation of Ser. No. 07/466,657 filed on Jan. 17, 1990, now abandoned, which is a continuation in part of Ser. No. 07/375,999 filed on Jul. 6, 1989, now abandoned, the entire contents of which are hereby incorporated by reference.
US Referenced Citations (14)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0239423 |
Mar 1978 |
EPX |
211667 |
Feb 1987 |
EPX |
60150047 |
Jun 1974 |
JPX |
6490250 |
Jul 1981 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 9, No. 323, p. 414, (Dec. 1985), JP 60150047(1). |
Divisions (1)
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Number |
Date |
Country |
Parent |
948466 |
Sep 1992 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
466657 |
Jan 1990 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
375999 |
Jul 1989 |
|