1. Field of the Invention
The present invention relates to radiators for removing heat from electronic components, and more particularly to a radiator having a streamline airflow guiding structure.
2. Description of Related Art
During operating of an electronic component such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the CPU to facilitate removal of heat therefrom. A fan is mounted on top of the heat sink to enhance heat dissipation efficiency.
Accordingly, an object of the present invention is to provide a radiator having improved airflow path for efficient heat radiating.
In order to achieve the object set out above, a radiator in accordance with a preferred embodiment of the present invention comprises a flat base, a pair of heat pipes and a plurality of fins on the base. The base defines a pair of grooves through a top portion thereof. Each heat pipe comprises parallel and symmetrical first and second sections. The first sections are soldered to the base in the grooves. Each fin defines a notch at a bottom portion thereof and a pair of holes at opposite sides of the notch. Flanges extend perpendicularly from the notches of the fins, cooperatively defining an airflow guiding surface. Collars extend perpendicularly from the holes of the fins, for receiving the second sections of the heat pipes
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Referring to
The base 10 defines a pair of parallel grooves 12 through a top portion thereof. Each heat pipe 20 is substantially U-shaped, comprises parallel and symmetrical first and second sections 22, 24. The first sections 22 are lodged within the grooves 12 and soldered to the base 10.
The fins 30 are attached on the base 10 and parallelly arranged at uniform intervals. Each fin 30 has a substantially rectangular configuration. A tapered notch 32 is defined in a bottom portion of each fin 30 toward the base 10. The notch 32 has an upmost point 33 distal from the base 10. A pair of flanges 35 extends perpendicularly from the notch 32 and encounters one another at the upmost point 33 of the notch 32. A pair of holes 36 is defined in each fin 30 at opposite sides of the notch 32, for receiving the second sections 24 of the heat pipes 20. A collar 37 extends perpendicularly from each hole 36, for increasing engaging area with the heat pipes 20. All of the fins 30 are identically configured as described above. The intervals between adjacent fins 30 are determined by either the flanges 35 or the collars 37. As a result, channels (not labeled) are defined between the fins 30. The flanges 35 define a pair of symmetrical continuous cambered surfaces, and the collars 37 define a continuous passage for engaging with the second sections 24 of the heat pipes.
When the fan 40 mounted on the fins 30 operates, cooling air from the fan 40 flows through said channels between the fins and travels along the cambered surfaces defined by the flanges 37 to surrounding space, as shown in
In the invention, it is the heat pipes 20 primarily that transfer the heat accumulated on the base 10 to the fins 30.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, for example, fins 30 of the radiator shaped like that shown in
Number | Date | Country | Kind |
---|---|---|---|
92216905 U | Sep 2003 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
4823869 | Arnold et al. | Apr 1989 | A |
5901040 | Cromwell et al. | May 1999 | A |
6189601 | Goodman et al. | Feb 2001 | B1 |
6382306 | Hsu | May 2002 | B1 |
6394175 | Chen et al. | May 2002 | B1 |
6625021 | Lofland et al. | Sep 2003 | B1 |
6741468 | Jing et al. | May 2004 | B2 |
6779595 | Chiang | Aug 2004 | B1 |
20030141041 | Chen | Jul 2003 | A1 |
20030209342 | Hsin et al. | Nov 2003 | A1 |
20040074633 | Liu | Apr 2004 | A1 |
20060011329 | Wang et al. | Jan 2006 | A1 |
Number | Date | Country |
---|---|---|
2550536 | May 2003 | CN |
482313 | Apr 2002 | TW |
Number | Date | Country | |
---|---|---|---|
20050061479 A1 | Mar 2005 | US |