Claims
- 1. An electrical circuit head interconnect for electrically coupling to a magnetic head of a disc drive, comprising:
a lamination sheet of materials having dielectric materials and conductive materials; means for determining a thickness of the lamination sheet of materials, the thickness of the lamination sheet of materials being different in different regions of the electrical circuit head interconnect.
- 2. The electrical circuit head interconnect of claim 1, wherein a thickness of the dielectric materials is different in different regions of the electrical circuit head interconnect.
- 3. The electrical circuit head interconnect of claim 1, wherein a thickness of the conductive materials is different in different regions of the electrical circuit head interconnect.
- 4. The electrical circuit head interconnect of claim 1, wherein a thickness of the dielectric materials is different in different regions of the electrical circuit, and a thickness of the conductive materials is different in different regions of the electrical circuit head interconnect.
- 5. The electrical circuit head interconnect of claim 1, wherein a first region is thinner than a second region.
- 6. The electrical circuit head interconnect of claim 5, wherein the first region is formed by etching the materials by use of a resist mask pattern.
- 7. The electrical circuit head interconnect of claim 6, wherein the resist mask pattern includes an opening small enough such that etchants etch the materials in a vertical direction and in a horizontal direction at a comparable rate.
- 8. The electrical circuit head interconnect of claim 7, wherein the resist mask pattern includes a plurality of openings with different sizes to obtain different thicknesses of the materials.
- 9. A head gimbal assembly for supporting a magnetic head in a disc drive, comprising:
an elongated flexure; a gimbal coupling the magnetic head to the flexure; and an electrical circuit head interconnect for electrically coupling to the magnetic head being disposed on the elongated flexure and electrically coupled to the magnetic head, the electrical circuit head interconnect including a lamination sheet of materials having dielectric materials and conductive materials, a thickness of the lamination sheet of materials being different in different regions of the electrical circuit head interconnect.
- 10. The head gimbal assembly of claim 9, wherein the gimbal has a first end and a second end, and the gimbal is mounted on the magnetic head at the first end and mounted on the flexure at the second end.
- 11. The head gimbal assembly of claim 9, wherein a thickness of the dielectric materials is different in different regions of the electrical circuit head interconnect.
- 12. The head gimbal assembly of claim 9, wherein a thickness of the conductive materials is different in different regions of the electrical circuit head interconnect.
- 13. The head gimbal assembly of claim 9, wherein a thickness of the dielectric materials is different in different regions of the electrical circuit head interconnect, and a thickness of the conductive materials is different in different regions of the electrical circuit head interconnect.
- 14. The head gimbal assembly of claim 9, wherein a first region is thinner than a second region.
- 15. The head gimbal assembly of claim 14, wherein the first region is formed by etching the materials by use of a resist mask pattern.
- 16. The head gimbal assembly of claim 15, wherein the resist mask pattern includes a mask opening small enough such that etchants etch the materials in a vertical direction and in a horizontal direction at a comparable rate.
- 17. The head gimbal assembly of claim 16, wherein the resist mask pattern includes a plurality of openings with different sizes to obtain different thicknesses of the materials.
- 18. A method of reducing a thickness of an electrical circuit head interconnect for electrically coupling to a magnetic head of a disc drive, comprising:
applying a first resist mask pattern onto a first material, the first resist mask pattern having a first plurality of openings with different sizes; etching the first material; and removing the first resist mask pattern after etching, the etched first material having different thicknesses in different regions.
- 19. The method of claim 18, wherein the first plurality of openings are small enough such that etchants etch the first material in a vertical direction and in a horizontal direction at a comparable rate.
- 20. The method of claim 18, further comprising:
applying a second resist mask pattern onto a second material at the same time as applying the first resist mask pattern, the second resist mask pattern having a second plurality of openings with different sizes; etching the second material at the same time as etching the first material; and removing the second resist mask pattern at the same time as removing the first resist mask pattern, the etched second material having different thicknesses in different regions.
RELATED APPLICATIONS
[0001] This application claims the benefit of Provisional Application, U.S. Serial No. 60/111,300, filed on Dec. 7, 1998, entitled to “REDUCED STIFFNESS PRINTED CIRCUIT HEAD INTERCONNECT”, by Adam Karl Himes and Kevin John Schulz.
Provisional Applications (1)
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Number |
Date |
Country |
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60111300 |
Dec 1998 |
US |