Claims
- 1. An electrical circuit head interconnect for electrically coupling to a magnetic head of a disc drive, the interconnect comprising:a dielectric layer; and a conductive layer disposed on the dielectric layer, the conductive layer forming a plurality of traces on the dielectric layer, the plurality of traces having a first thickness and a second thickness wherein the second thickness is less than the first thickness and the second thickness extends in a region located between the first thickness of the conductive layer; and wherein the dielectric layer has a first thickness and a second thickness, the second thickness being less than the first thickness wherein the second thickness of the dielectric layer coincides with the second thickness of the conductive layer.
- 2. The interconnect of claim 1 wherein the first thickness of the dielectric layer is about 50 microns and the second thickness of the dielectric layer is about 25 microns.
- 3. The interconnect of claim 1 wherein the first thickness of the conductive layer is about 15 microns and the second thickness of the conductive layer is about 7.5 microns and the first thickness of the dielectric layer is about 50 microns and the second thickness of the dielectric layer is about 25 microns.
- 4. The interconnect of claim 1 wherein the dielectric and conductive layers form a section that is rectangular in shape wherein the section has a length and a width wherein the second thickness of the dielectric and conductive layers extend along a portion of the length of the section.
- 5. The interconnect of claim 4 wherein the second thickness of the dielectric and conductive layers extend along substantially the entire length of the section.
- 6. The electrical circuit head interconnect of claim 1, wherein the interconnect includes first and second regions of reduced thickness, and the first region is formed by etching the layers of the interconnect by use of a resist mask pattern.
- 7. The electrical circuit head interconnect of claim 6, wherein the resist mask pattern includes an opening small enough such that etchants etch the layers of the interconnect in a vertical direction and in a horizontal direction at a comparable rate.
- 8. The electrical circuit head interconnect of claim 7, wherein the resist mask pattern includes a plurality of openings with different sizes to obtain different thicknesses of the interconnect layers.
- 9. The interconnect of claim 1 wherein the first thickness of the conductive layer is about 15 microns and the second thickness of the conductive layer is about 7.5 microns.
- 10. A head gimbal assembly for supporting a magnetic head in a disc drive, the assembly comprising:an elongated flexure; a gimbal coupling the magnetic head to the flexure; and an electric circuit head interconnect for electrically coupling to the magnetic head of the disc drive, the interconnect comprising: a dielectric layer; a conductive layer disposed on the dielectric layer, the conductive layer forming a plurality of traces on the dielectric layer, the plurality of traces having a first thickness and a second thickness wherein the second thickness is less than the first thickness and the second thickness extends in a region located between the first thickness of the conductive layer; and wherein the dielectric layer has a first thickness and a second thickness, the second thickness being less than the first thickness wherein the second thickness of the dielectric layer coincides with the second thickness of the conductive layer.
- 11. The interconnect of claim 10 wherein the first thickness of the dielectric layer is about 50 microns and the second thickness of the dielectric layer is about 25 microns.
- 12. The interconnect of claim 10 wherein the first thickness of the conductive layer is about 15 microns and the second thickness of the conductive layer is about 7.5 microns and the first thickness of the dielectric layer is about 50 microns and the second thickness of the dielectric layer is about 25 microns.
- 13. The interconnect of claim 10 wherein the dielectric and conductive layers form a section that is rectangular in shape wherein the section has a length and a width wherein the second thickness of the dielectric and conductive layers extend along a portion of the length of the section.
- 14. The interconnect of claim 13 wherein the second thicknesses of the dielectric and conductive layers extend along substantially the entire length of the section.
- 15. The head gimbal assembly of claim 10, wherein the interconnect includes first and second regions of reduced thickness, and the first region is formed by etching the layers of the interconnect by use of a resist mask pattern.
- 16. The head gimbal assembly of claim 15, wherein the resist mask pattern includes a mask opening small enough such that etchants etch the layers of the interconnect in a vertical direction and in a horizontal direction at a comparable rate.
- 17. The head gimbal assembly of claim 16, wherein the resist mask pattern includes a plurality of openings with different sizes to obtain different thicknesses of the interconnect layers.
- 18. The interconnect of claim 10 wherein the first thickness of the conductive layer is about 15 microns and the second thickness of the conductive layer is about 7.5 microns.
- 19. The head gimbal assembly of claim 10, wherein the gimbal has a first end and a second end, and the gimbal is mounted on the magnetic head at the first end and mounted on the flexure at the second end.
RELATED APPLICATIONS
This application claims the benefit of Provisional Application, U.S. Ser. No. 60/111,300, filed on Dec. 7, 1998, entitled to “REDUCED STIFFNESS PRINTED CIRCUIT HEAD INTERCONNECT”, by Adam Karl Himes and Kevin John Schulz.
US Referenced Citations (10)
Provisional Applications (1)
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Number |
Date |
Country |
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60/111300 |
Dec 1998 |
US |