Maszara, W.P., “SOI By Wafer Bonding: A Review,” A ESC: SOI Technology and Devices, vol. 90-6, 1990. |
Abe, T., et al., “Silicon Wafer-Bonding Process Technology For SOI Structures,” ECS: SOI Technology and Devices, vol. 90-6, 1990. |
Beitman, B.A., et al., “Bonded SOI In A Bipolar IC Without Trench Isolation,” ECS: Semiconductor Wafer Bonding, vol. 93-29, 1993. |
Abe, T., et al., “Bonded SOI Wafers With Various Substrates For IC Fabrication,” ECS: Semiconductor Wafer Bonding, vol. 93-29, 1993. |
Saul, P., “The benefits fo bonding silicon on insulator or bipolar ICs,” (Publication identity unknown). |