Magnetic field sensors are used in a variety of applications, including, but not limited to, an angle sensor that senses an angle of a direction of a magnetic field, a current sensor that senses a magnetic field generated by a current carried by a current-carrying conductor, a magnetic switch that senses the proximity of a ferromagnetic object, a rotation detector that senses passing ferromagnetic articles, for example, magnetic domains of a ring magnet or a ferromagnetic target (e.g., gear teeth) where the magnetic field sensor is used in combination with a back-biased or other magnet, and a magnetic field sensor that senses a magnetic field density of a magnetic field.
Various parameters characterize the performance of magnetic field sensors and magnetic field sensing elements. With regard to magnetic field sensing elements, the parameters include sensitivity, which is the change in the output signal of a magnetic field sensing element in response to a magnetic field, and linearity, which is the degree to which the output signal of a magnetic field sensor varies linearly (i.e. in direct proportion) to the magnetic field.
Some magnetic field sensors include magnetoresistance (MR) elements, such as giant magnetoresistance (GMR) elements and tunneling magnetoresistance (TMR) elements. Generally, GMR and TMR elements have a relatively high sensitivity compared, for example, to Hall effect elements. GMR and TMR elements have moderately good linearity, but over a restricted range of magnetic fields. However, even in the restricted range of magnetic fields, the linearity of the GMR or TMR element can suffer from irregularities, such as due to high temperatures.
Further, angle sensors using GMR and TMR elements can experience angle error due to phenomena such as spin flop (i.e. alteration of reference direction at high magnetic fields or anisotropy field (e.g., magnetocrystalline anisotropy or shape anisotropy)). For example, the angle obtained with GMR elements can experience error up to several degrees.
In one aspect, a magnetic field sensor includes a plurality of tunneling magnetoresistance (TMR) elements that includes a first TMR element, a second TMR element, a third TMR element and a fourth TMR element. The first and second TMR elements are connected to a voltage source and the third and fourth TMR elements are connected to ground. Each TMR element has a pillar count of more than one pillar and the pillar count is selected to reduce the angle error below 1.0°.
In another aspect, a magnetic field sensor includes a plurality of tunneling magnetoresistance (TMR) elements that include a first TMR element, a second TMR element, a third TMR element and a fourth TMR element arranged in a bridge. A voltage across each TMR element is constant. The first and second TMR elements are connected to a voltage source. The magnetic field sensor also includes a plurality of transistors that include a first transistor, a second transistor, a third transistor and a fourth transistor and each transistor is connected to another transistor and to a TMR element. The magnetic field sensor also includes a first amplifier and a second amplifier. An output of the first amplifier is connected to a base of the first transistor and the output of the first amplifier is connected to a base of the second transistor. A first input of the first amplifier is connected to the first TMR element and the second input of the first amplifier is connected to the second TMR element. An output of the second amplifier is connected to a base of a third transistor and the output of the second amplifier is connected to a base of a fourth transistor. A first input of the second amplifier is connected to the third TMR element and the second input of the second amplifier is connected to the fourth TMR element.
In a further aspect, a magnetic field sensor includes a plurality of tunneling magnetoresistance (TMR) elements that include a first TMR element, a second TMR element, a third TMR element and a fourth TMR element arranged in a bridge. A voltage across each TMR element is constant. The first and second TMR elements are connected to a constant voltage source and the third and fourth TMR elements are connected to ground. The first and third TMR elements are connected to a first bridge node and the second and third TMR elements are connected to a second bridge node. The magnetic field sensor also includes a first resistor connected to the first bridge node and a first output node, a second resistor connected to the second bridge node and a second output node, a first amplifier and a second amplifier. An output of the first amplifier is connected to the first output node and the first resistor and a first input of the first amplifier is connected to the first bridge node and the first resistor. An output of the second amplifier is connected to the second output node and the second resistor. A first input of the second amplifier is connected to the second bridge node and the second resistor and a second input of the second amplifier is connected to a second input of the first amplifier.
The foregoing features may be more fully understood from the following description of the drawings. The drawings aid in explaining and understanding the disclosed technology. Since it is often impractical or impossible to illustrate and describe every possible embodiment, the provided figures depict one or more illustrative embodiments. Accordingly, the figures are not intended to limit the scope of the broad concepts, systems and techniques described herein. Like numbers in the figures denote like elements.
Described herein are techniques to reduce voltage nonlinearity in a bridge having one or more tunneling magnetoresistance (TMR) elements.
Referring to
It will be understood that a driving current running through the TMR element 150 runs through all of the layers of the stack, running between seed and cap layers 158 and 126 (i.e. perpendicular to a surface of the substrate 102) and the TMR element 150 is sometimes referred to as a current perpendicular-to-plane (CPP) magnetoresistance element. The TMR element 150 can have a maximum response axis that is parallel to the surface of the substrate and that is in the direction 128 perpendicular to zero field magnetic directions of the free layer 156, and also parallel to the bias field generated by the reference layers, most notably in the pinned layer 152.
The TMR element 150 is pinned (i.e. it has a pinning layer 106). A synthetic antiferromagnet (SAF) is formed from layers 108, 110 and 156. The aim of the SAF is to pin layer 156. The layer 156 is referred to as a reference layer. The single layer pinned layer 108 is magnetically connected to the pinning layer 106. The layers 106, 108 are collectively referred to as bias layers. With zero external magnetic field, the reference layer 156 takes on a magnetic alignment parallel to the bias layers 106, 108, with direction (ferromagnetic or antiferromagnetic coupling) determined by thickness and material of the spacer layer 110. In some embodiments, the single layer pinned layer 108 is replaced by another SAF structure.
As described above, in general, the TMR element 150 has a maximum response axis (maximum response to external fields) aligned with the arrow 128 (i.e. perpendicular to bias directions experienced by the free layer 156, and parallel to magnetic fields of the reference layers, notably pinned layers 152). Also, in general, it is rotations of the magnetic direction of the free layer 156 caused by external magnetic fields that result in changes of resistance of the TMR element 150.
Referring to
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Each TMR element has a reference direction (e.g., similar to direction 128 (
The TMR element 308a and TMR element 308b are connected to a current source 304. In one example, the current source 304 supplies 0.5 mA. The TMR elements 312c and TMR element 312d are connected to ground 306.
The current-driven bridge 300 includes a node 332 between the TMR elements 308a, 308d and a node 334 between the TMR elements 308b, 308c. The output of the current-driven bridge 300 is the differential voltage across the nodes 332, 334.
Referring to
Referring to
Each TMR element has a reference direction. For example, the TMR element 508a has a reference direction 512a, the TMR element 508b has a reference direction 512b, the TMR element 508c has a reference direction 512c and the TMR element 508d has a reference direction 512d. The reference direction 512a is substantially in the same direction as the reference direction 512c but opposite (i.e. by 180°) from the reference direction 512b and the reference direction 512d.
The TMR element 508a and TMR element 308b are connected to a voltage source 504. In one example, the voltage source 504 supplies 1.0V. The TMR elements 512c and TMR element 512d are connected to ground 506.
The voltage-driven bridge 500 includes a node 532 between the TMR elements 508a, 508d and a node 534 between the TMR elements 508b, 508c. The output of the voltage-driven bridge 500 is the differential current across the nodes 532, 534.
Referring to
As indicated in
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The TMR element 808a, 808b are connected to a voltage source Vreg and the TMR elements 808c, 808d are connected to ground. A collector 832c of the transistor 832 is connected to a collector 836c of the transistor 836 and a collector 834c of the transistor 834 is connected to a collector 838c of the transistor 838.
Each TMR element 808a-808d has a reference direction. For example, the TMR element 808a has a reference direction 812a, the TMR element 808b has a reference direction 812b, the TMR element 808c has a reference direction 812c and the TMR element 808d has a reference direction 812d. The reference direction 812a is substantially in the same direction as reference direction 812c, but substantially in the opposite direction to reference directions 812b, 812d.
To hold constant the voltages across each TMR element 808a, 808b, 808c, 808d via a voltage feedback loop, the transistors 832, 834, 836, 838 may be used as a voltage follower. In one example, the transistors 832, 834 are PNP bipolar junction transistors and the transistors 836, 838 are NPN bipolar junction transistors. In another example, the transistors 832, 834 are p-type metal oxide semiconductor field-effect transistors and the transistors 836, 838 are n-type metal oxide semiconductor field-effect transistors. In other examples, the transistors 832, 834 are any combination of PNP bipolar junction transistors and p-type metal oxide semiconductor field-effect transistors and the transistors 836, 838 are any combination of NPN bipolar junction transistors and n-type metal oxide semiconductor field-effect transistors.
An output of the amplifier 816 is connected to a base 832b of the transistor 832 and is connected to a base 834b of the transistor 834. A first input of the amplifier 816 is connected to the TMR element 808a and is connected to an emitter 832a of the transistor 832. A second input of the amplifier 816 is connected to the TMR element 808b and is connected to an emitter 834a of the transistor 834. A third input of the amplifier 818 is connected to a current source 842 providing a current, Iref and connected to a resistor 852 having a resistance Rref. The resistor 852 is connected to the voltage source Vreg.
In one example, the resistor 852 and the current source 842 provide a reference voltage, Vref to the amplifier 816. In one particular example, the reference voltage Vref provided by the current source 842 and the resistor 852 is adjustable based on variations of one or both of the TMR elements 808a, 808b. For example, the current source 842 and/or the resistor 852 may be adjusted over temperature to avoid clipping of the output signal post amplification.
An output of the amplifier 822 is connected to a base 836b of the transistor 836 and is connected to a base 838b of the transistor 838. A first input of the amplifier 822 is connected to the TMR element 808d and is connected to an emitter 836a of the transistor 836. A second input of the amplifier 828 is connected to the TMR element 808c and is connected to an emitter 838a of the transistor 838. A third input of the amplifier 838 is connected to a current source 844 providing a current, Iref and connected to a resistor 854 having a resistance Rref. The resistor 854 is connected to ground.
In one example, the resistor 854 and the current source 844 provide a reference voltage, Vref to the amplifier 822. In one particular example, the reference voltage Vref provided by the current source 844 and the resistor 854 is adjustable based on variations of one or both of the TMR elements 808c, 808d. For example, the current source 842 and/or the resistor 852 may be adjusted over temperature to avoid clipping of the output signal post amplification.
The conductance bridge configuration 800 includes a node 852 between the transistors 832, 836 and a node 854 between the transistors 834, 838. The output of the conductance bridge configuration 800 is the differential current across the nodes 852, 854.
While
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The conductance bridge 1000 also includes a bridge 1002 that includes a TMR element 1022a that has a resistance Rn1, a TMR element 1022b having a resistance Rp1, a TMR element 1022c having a resistance Rn2 and a TMR element 1022c having a resistance Rp2. The TMR element 1022a is connected to the TMR element 1022c at a node 1024 that is connected to ground and to the TMR element 1022b. The TMR element 1022d is connected to the TMR element 1022b at a node 1026 that is connected to VBIAS and to the TMR element 1022c. The bridge 1002 is biased with a constant voltage between the nodes 1024, 1026, which is a voltage VBIAS.
An output of the amplifier 1012 is connected to the resistor R1 at a node 1032 and an output of amplifier 1014 is connected to the resistor R2 at a node 1034. A first input 1012a of the amplifier 1012 is connected to a first input 1014a of the amplifier 1014 and each input 1012a, 1014a receives a voltage VBIAS/2.
A node 1016 is connected to a resistor R1, a second input 1012b of the amplifier 1012, the resistor Rp1 and the resistor Rn1. The current at the node 1016 is equal to:
VBIAS/(2Rp1)−VBIAS/(2Rn1).
A node 1018 is connected to a resistor R2, a second input 1014b of the amplifier 1014, the resistor Rp2 and the resistor Rn2. The current at the node 1018 is equal to:
VBIAS/(2Rp2)−VBIAS/(2Rn2).
A voltage at the node 1032 is a voltage V01. Assuming the current into the amplifier 1012 is negligible V01 is equal to:
[VBIAS/(2Rp1)−VBIAS/(2Rn1)]R1.
A voltage at the node 1034 is a voltage V02. Assuming the current into the amplifier 1014 is negligible V01 is equal to:
[VBIAS/(2Rp2)−VBIAS/(2Rn2)]R2.
If the output of the bridge configuration 1000 is VOUT and VOUT=V01−V02, then VOUT is equal to:
[VBIAS/(2Rp1)−VBIAS/(2Rn1)]R1−[VBIAS/(2Rp2)−VBIAS/(2Rn2)]R2.
In one example, VBIAS is adjusted with temperature such that variations caused by temperature to the TMR elements 1022a, 1022b, 1022c, 1022d are minimized with respect to VOUT.
Referring to
Referring to
The processes and techniques described herein are not limited to the specific examples described herein.
Elements of different embodiments described herein may be combined to form other embodiments not specifically set forth above. Various elements, which are described in the context of a single embodiment, may also be provided separately or in any suitable subcombination. Other embodiments not specifically described herein are also within the scope of the following claims.
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